Patents by Inventor Shriram DEVI

Shriram DEVI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11540384
    Abstract: An apparatus comprises a transceiver (Tx/Rx) printed circuit board (PCB) with a top surface and a bottom surface and a power supply PCB. The Tx/Rx PCB includes two transmitter devices, each comprising a number N of channels. A first transmitter device is arranged on the bottom surface and a second transmitter device is arranged on the top surface over the first transmitter device. One or more pins of the second transmitter device are shorted with one or more pins of the first transmitter device with the same function. An analog front end (AFE) device comprising N input channels is arranged on the top surface of the Tx/Rx PCB, and a digital signal processor is coupled to the AFE device. The power supply PCB comprises a power supply module configured to provide a plurality of supply voltages to the Tx/Rx PCB and the power supply PCB.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: December 27, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Shabbir Amjhera Wala, Xiaochen Xu, Dijeesh K, Abhishek Vishwa, Shriram Devi, Aatish Chandak, Sanjay Dixit, Elisa Maddalena Granata, Jun Shen, Sandeep Oswal
  • Publication number: 20220399388
    Abstract: In examples, an electronic device comprises a semiconductor package including a semiconductor die and a set of conductive members coupled to the semiconductor die, the set of conductive members coupled to a bottom surface of the semiconductor package. The package also includes a conductive terminal coupled to the semiconductor die and exposed to the bottom surface, the set of conductive members extending farther away from the bottom surface of the semiconductor die than the conductive terminal extends from the bottom surface of the semiconductor die. The electronic device includes a flexible substrate having first and second ends opposing each other, the first end having a first conductive terminal coupled to the conductive terminal.
    Type: Application
    Filed: September 30, 2021
    Publication date: December 15, 2022
    Inventors: Bradley Andrew GLASSCOCK, Nagesh SURENDRANATH, Shriram DEVI
  • Publication number: 20210329776
    Abstract: An apparatus comprises a transceiver (Tx/Rx) printed circuit board (PCB) with a top surface and a bottom surface and a power supply PCB. The Tx/Rx PCB includes two transmitter devices, each comprising a number N of channels. A first transmitter device is arranged on the bottom surface and a second transmitter device is arranged on the top surface over the first transmitter device. One or more pins of the second transmitter device are shorted with one or more pins of the first transmitter device with the same function. An analog front end (AFE) device comprising N input channels is arranged on the top surface of the Tx/Rx PCB, and a digital signal processor is coupled to the AFE device. The power supply PCB comprises a power supply module configured to provide a plurality of supply voltages to the Tx/Rx PCB and the power supply PCB.
    Type: Application
    Filed: September 8, 2020
    Publication date: October 21, 2021
    Inventors: Shabbir AMJHERA WALA, Xiaochen XU, Dijeesh K, Abhishek VISHWA, Shriram DEVI, Aatish CHANDAK, Sanjay DIXIT, Elisa Maddalena GRANATA, Jun SHEN, Sandeep OSWAL