Patents by Inventor Shrisudersan Jayaraman
Shrisudersan Jayaraman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240085361Abstract: A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Inventors: Shrisudersan Jayaraman, Navaneetha Krishnan Subbaiyan
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Patent number: 11846597Abstract: A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.Type: GrantFiled: December 28, 2018Date of Patent: December 19, 2023Assignee: Corning IncorporatedInventors: Shrisudersan Jayaraman, Navaneetha Krishnan Subbaiyan
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Publication number: 20230357541Abstract: A method of forming an antimicrobial film, including providing a substrate with a polymer coating disposed thereon, the polymer coating including: an antimicrobial material, an inner surface contacting the substrate, and an outer surface opposite the inner surface; and extracting ions from the antimicrobial material toward the outer surface, such that the outer surface interacts with surface microorganisms. A composition, including a polymer; an antimicrobial material; and at least one of an organic solvent and an additive. The antimicrobial material comprises at least one of copper-containing glass particles, copper oxide particles, copper metal particles, copper salts, copper coordination complexes, cuprite crystals, and a combination thereof. Further, the additive can be selected to increase the oxidation resistance of the antimicrobial material.Type: ApplicationFiled: July 6, 2023Publication date: November 9, 2023Inventors: Andrew Charles Antony, Theresa Chang, Sushmit Sunil Kumar Goyal, Shrisudersan Jayaraman, Rui Qi, Vinalia Tjong, Shu Yuan
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Publication number: 20210092843Abstract: An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.Type: ApplicationFiled: December 3, 2020Publication date: March 25, 2021Inventor: Shrisudersan Jayaraman
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Patent number: 10917966Abstract: An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.Type: GrantFiled: January 11, 2019Date of Patent: February 9, 2021Assignee: Corning IncorporatedInventor: Shrisudersan Jayaraman
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Patent number: 10887987Abstract: An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.Type: GrantFiled: January 11, 2019Date of Patent: January 5, 2021Assignee: Corning IncorporatedInventor: Shrisudersan Jayaraman
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Publication number: 20200333279Abstract: A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.Type: ApplicationFiled: December 28, 2018Publication date: October 22, 2020Inventors: Shrisudersan Jayaraman, Navaneetha Krishnan Subbaiyan
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Publication number: 20190378773Abstract: An article including a glass or glass ceramic substrate, a noble metal layer, an adhesion promoting layer positioned between and bonded to the substrate and the noble metal layer, and a conductive metal layer positioned on and bonded to the noble metal layer. The adhesion promoting layer includes a siloxy group bonded with the substrate and a thiol group bonded to the noble metal layer. A method for manufacturing an article including applying an adhesion promoting layer comprising mercaptosilane to at least a portion of a glass or glass ceramic substrate, wherein siloxane bonds are formed between the mercaptosilane and the substrate, applying a noble metal layer to the adhesion promoting layer, the noble metal layer bonds with a thiol present in the mercaptosilane, thermally treating the noble metal layer, and applying a conductive metal layer to the noble metal layer.Type: ApplicationFiled: June 5, 2019Publication date: December 12, 2019Inventors: Philip Simon Brown, Shrisudersan Jayaraman, Prantik Mazumder, Rajesh Vaddi
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Publication number: 20190239353Abstract: An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.Type: ApplicationFiled: January 11, 2019Publication date: August 1, 2019Inventor: Shrisudersan Jayaraman
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Publication number: 20190024237Abstract: Methods of metalizing vias are disclosed. A method of metalizing at least one via includes contacting a substrate with a sacrificial metal sheet. The substrate includes a first surface, a second surface, and the at least one via extending between the first surface and the second surface and the first surface or the second surface of the substrate contacts a surface of the sacrificial metal sheet. The method further includes applying a solution comprising metal ions to the substrate and the sacrificial metal sheet such that a Galvanic displacement reaction occurs between the sacrificial metal sheet and the metal ions in the solution until the metal ions form a metal coating on at least one surface of the at least one via.Type: ApplicationFiled: June 22, 2018Publication date: January 24, 2019Inventor: Shrisudersan Jayaraman
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Patent number: 9903040Abstract: Methods for stripping partially oxidized nitride wear or release coatings from metal workpieces comprise disrupting surface oxidation layers present on the coatings following use, and causing electrical current to flow from the workpiece and release coating to a counter electrode while the workpiece, release coating and counter electrode are immersed in an aqueous alkaline electrolyte solution.Type: GrantFiled: April 12, 2011Date of Patent: February 27, 2018Assignee: CORNING INCORPORATEDInventors: Jiangwei Feng, Todd M Harvey, Shrisudersan Jayaraman, Ljerka Ukrainczyk
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Publication number: 20170287728Abstract: Methods of metalizing vias within a substrate are disclosed. In one embodiment, a method of metalizing vias includes disposing a substrate onto a growth substrate. The substrate includes a first surface, a second surface, and at least one via. The first surface or the second surface of the substrate directly contacts a surface of the growth substrate, and the surface of the growth substrate is electrically conductive. The method further includes applying an electrolyte to the substrate such that the electrolyte is disposed within the at least one via. The electrolyte includes metal ions of a metal to be deposited within the at least one via. The method also includes positioning an electrode within the electrolyte, and applying a current and/or a voltage between the electrode and the substrate, thereby reducing the metal ions into the metal on the surface of the growth substrate within the at least one via.Type: ApplicationFiled: March 28, 2017Publication date: October 5, 2017Inventors: Rachel Eileen Dahlberg, Shrisudersan Jayaraman
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Publication number: 20160099115Abstract: An electrolyte composition, including: an electrolyte comprising a conductive salt; and a mixture comprising an alkyl nitrile and an alkyl dinitrile, wherein the electrolyte composition has a depressed vapor pressure at 85° C., as defined herein. Also disclosed is an article incorporating the electrolyte composition and methods for making and using the article at elevated temperatures.Type: ApplicationFiled: October 7, 2014Publication date: April 7, 2016Inventors: Shrisudersan Jayaraman, Rahul Suryakant Kadam, Steven Isaac Massey, Shivani Rao Polasani
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Patent number: 8842417Abstract: An electro-chemical double layer capacitor comprises positive and negative electrodes, where the carbon material that is incorporated into the positive electrode is halogenated carbon material, while the carbon material that is incorporated into the negative electrode is un-halogenated carbon material. Further, the carbon material incorporated into each respective electrode can have a distinct pore size distribution. A pore volume ratio of the carbon material incorporated into the positive electrode is greater than a pore volume ratio of the carbon material incorporated into the negative electrode. The pore volume ratio R is defined as R=V1/V, where V1 is a total volume of pores having a pore size of less than 1 nm, and V is a total volume of pores having a pore size greater than 1 nm.Type: GrantFiled: September 23, 2011Date of Patent: September 23, 2014Assignee: Corning IncorporatedInventors: Kishor Purushottam Gadkaree, Shrisudersan Jayaraman
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Patent number: 8593787Abstract: A device having a first electrode, a second electrode, a separator positioned between the first electrode and the second electrode, and an electrolyte incorporated throughout the first electrode, the second electrode, and the separator. The electrolyte includes one or more lithium salts and one or more solvents. The first electrode and second electrodes comprise a majority of activated carbon having a microporous pore size distribution.Type: GrantFiled: April 21, 2010Date of Patent: November 26, 2013Assignee: Corning IncorporatedInventors: Kishor Purushottam Gadkaree, Shrisudersan Jayaraman, James Robert Lim
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Patent number: 8576541Abstract: An electrolyte system having a conductive salt dispersed in a solvent mixture, the solvent mixture having an organic nitrile solvent and a co-solvent. The concentration of the conductive salt in the electrolyte system is 1.25 molar to 3.0 molar.Type: GrantFiled: October 4, 2010Date of Patent: November 5, 2013Assignee: Corning IncorporatedInventors: Kishor Purushottam Gadkaree, Shrisudersan Jayaraman
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Publication number: 20130077206Abstract: An electro-chemical double layer capacitor comprises positive and negative electrodes, where the carbon material that is incorporated into the positive electrode is halogenated carbon material, while the carbon material that is incorporated into the negative electrode is un-halogenated carbon material. Further, the carbon material incorporated into each respective electrode can have a distinct pore size distribution. A pore volume ratio of the carbon material incorporated into the positive electrode is greater than a pore volume ratio of the carbon material incorporated into the negative electrode. The pore volume ratio R is defined as R=V1/V, where V1 is a total volume of pores having a pore size of less than 1 nm, and V is a total volume of pores having a pore size greater than 1 nm.Type: ApplicationFiled: September 23, 2011Publication date: March 28, 2013Inventors: Kishor Purushottam Gadkaree, Shrisudersan Jayaraman
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Patent number: 8405955Abstract: An electric double layer capacitor composite electrode includes a current collector having opposing major surfaces, first and second conductive layers formed over respective ones of the major surfaces, and first and second carbon-based layers formed over the first and second conductive layers.Type: GrantFiled: March 16, 2010Date of Patent: March 26, 2013Assignee: Corning IncorporatedInventors: Kishor Purushottam Gadkaree, Shrisudersan Jayaraman, James Robert Lim, Jia Liu
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Patent number: 8329341Abstract: A method for producing a halogenated activated carbon material includes heating a natural, non-lignocellulosic carbon precursor in an inert or reducing atmosphere to form a first carbon material, mixing the first carbon material with an inorganic compound to form a mixture, heating the mixture in an inert or reducing atmosphere to incorporate the inorganic compound into the first carbon material, removing the inorganic compound from the first carbon material to produce an activated carbon material, and treating the activated carbon material with a halogen source to form a halogenated activated carbon material. The halogenated activated carbon material is suitable to form improved carbon-based electrodes for use in high energy density devices.Type: GrantFiled: June 22, 2011Date of Patent: December 11, 2012Assignee: Corning IncorporatedInventors: Kishor Purushottam Gadkaree, Shrisudersan Jayaraman
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Patent number: 8198210Abstract: A method for producing a halogenated activated carbon material includes heating a natural, non-lignocellulosic carbon precursor in an inert or reducing atmosphere to form a first carbon material, mixing the first carbon material with an inorganic compound to form a mixture, heating the mixture in an inert or reducing atmosphere to incorporate the inorganic compound into the first carbon material, removing the inorganic compound from the first carbon material to produce an activated carbon material, and treating the activated carbon material with a halogen source to form a halogenated activated carbon material. The halogenated activated carbon material is suitable to form improved carbon-based electrodes for use in high energy density devices.Type: GrantFiled: May 27, 2010Date of Patent: June 12, 2012Assignee: Corning IncorporatedInventors: Kishor Purushottam Gadkaree, Shrisudersan Jayaraman