Patents by Inventor Shriya Kumar
Shriya Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200288991Abstract: A health & fitness tracking device may include a display that provides fitness information to a wearer of the health & fitness tracking device, at least one physiological sensor that obtains physiological data by monitoring at least one physiological condition of the wearer, at least one environmental sensor that obtains environmental data by monitoring at least one environmental condition, a data storage device that stores the physiological data, the environmental data, and medical history data relating to the wearer, a memory storing a computer program, and a processor that executes the computer program. The computer program may adjust a sensor configuration of the at least one physiological sensor based on the medical history data.Type: ApplicationFiled: March 12, 2019Publication date: September 17, 2020Inventors: JOHN KNICKERBOCKER, Shriya Kumar
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Patent number: 10750955Abstract: A health & fitness tracking device may include a display that provides fitness information to a wearer of the health & fitness tracking device, at least one physiological sensor that obtains physiological data by monitoring at least one physiological condition of the wearer, at least one environmental sensor that obtains environmental data by monitoring at least one environmental condition, a data storage device that stores the physiological data, the environmental data, and medical history data relating to the wearer, a memory storing a computer program, and a processor that executes the computer program. The computer program may adjust a sensor configuration of the at least one physiological sensor based on the medical history data.Type: GrantFiled: March 12, 2019Date of Patent: August 25, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Knickerbocker, Shriya Kumar
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Patent number: 10621885Abstract: Systems and methods for monitoring body mounted/implanted sensors in combination with environmental sensors and sensors attached to person's medical/sports equipment. Data indicating a plurality of measured quantities associated with movement of a person at a time point is received. Each measured quantity within the plurality of measured quantities having been determined by a respective sensor attached to a respective location on the person or the person's environment or the person's medical/sports equipment. At least one characteristic of the person associated with the time point is determined based on analyzing the plurality of measured quantities. The at least one characteristic is stored. Recommendations for the person are determined based upon the characteristics, and a report comprising the recommendations is provided.Type: GrantFiled: December 31, 2015Date of Patent: April 14, 2020Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Shriya Kumar, Kang-Wook Lee, Minhua Lu
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Patent number: 10383572Abstract: A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.Type: GrantFiled: June 1, 2017Date of Patent: August 20, 2019Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Patent number: 10258279Abstract: A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.Type: GrantFiled: June 2, 2017Date of Patent: April 16, 2019Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Publication number: 20180344245Abstract: An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.Type: ApplicationFiled: August 3, 2018Publication date: December 6, 2018Inventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Patent number: 10130302Abstract: A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.Type: GrantFiled: June 29, 2016Date of Patent: November 20, 2018Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Publication number: 20180096179Abstract: Embodiments include systems, methods, and computer program products for tracking and sensing medical assets. Systems include a plurality of long range transmitters. Systems also include a medical asset box including a medical asset, a radio frequency ID microchip in proximity to the medical asset, and an extended antenna that is capable of receiving a signal from the radio frequency ID microchip and transmitting the signal to an external device.Type: ApplicationFiled: October 5, 2016Publication date: April 5, 2018Inventors: BING DANG, LI-WEN HUNG, JOHN U. KNICKERBOCKER, SHRIYA KUMAR, DUIXIAN LIU, ENRIQUE VARGAS
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Patent number: 9861313Abstract: A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.Type: GrantFiled: July 20, 2016Date of Patent: January 9, 2018Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Publication number: 20180005879Abstract: A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.Type: ApplicationFiled: June 29, 2016Publication date: January 4, 2018Inventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Publication number: 20180005932Abstract: A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.Type: ApplicationFiled: June 1, 2017Publication date: January 4, 2018Inventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Publication number: 20180000412Abstract: A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.Type: ApplicationFiled: July 20, 2016Publication date: January 4, 2018Inventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Publication number: 20180005982Abstract: A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.Type: ApplicationFiled: June 2, 2017Publication date: January 4, 2018Inventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Patent number: 9773751Abstract: A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.Type: GrantFiled: July 20, 2016Date of Patent: September 26, 2017Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Patent number: 9761516Abstract: A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.Type: GrantFiled: July 20, 2016Date of Patent: September 12, 2017Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Publication number: 20170189751Abstract: Systems and methods for monitoring body mounted/implanted sensors in combination with environmental sensors and sensors attached to person's medical/sports equipment. Data indicating a plurality of measured quantities associated with movement of a person at a time point is received. Each measured quantity within the plurality of measured quantities having been determined by a respective sensor attached to a respective location on the person or the person's environment or the person's medical/sports equipment. At least one characteristic of the person associated with the time point is determined based on analyzing the plurality of measured quantities. The at least one characteristic is stored. Recommendations for the person are determined based upon the characteristics, and a report comprising the recommendations is provided.Type: ApplicationFiled: December 31, 2015Publication date: July 6, 2017Inventors: John U. Knickerbocker, Shriya Kumar, Kang-Wook Lee, Minhua Lu