Patents by Inventor Shruti R. Jaywant

Shruti R. Jaywant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making a flexible wearable circuit
    Patent number: 10798817
    Abstract: Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Javier Soto Gonzalez, Meizi Jiao, Shruti R. Jaywant, Oscar Ojeda, Sashi S. Kandanur, Srinivas Venkata Ramanuja Pietambaram, Roy Dittler, Rajat Goyal, Dilan Seneviratne
  • Stretchable electronic assembly
    Patent number: 10327330
    Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: June 18, 2019
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Adel A. Elsherbini, Javier Soto Gonzalez, Dilan Seneviratne, Shruti R. Jaywant, Sashi S. Kandanur, Srinivas Pietambaram, Nadine L. Dabby, Braxton Lathrop, Rajat Goyal, Vivek Raghunathan
  • MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WEARABLE ELECTRONICS
    Publication number: 20180376585
    Abstract: Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.
    Type: Application
    Filed: December 11, 2015
    Publication date: December 27, 2018
    Inventors: Aleksandar Aleksov, Javier Soto Gonzalea, Meizi Jiao, Shruti R. Jaywant, Oscar Ojeda, Sashi S. Kandanur, Srinivas Pietambaram, Roy Dittler, Rajat Goyal, Dilan Seneviratne
  • STRETCHABLE ELECTRONIC ASSEMBLY
    Publication number: 20180295720
    Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.
    Type: Application
    Filed: September 24, 2015
    Publication date: October 11, 2018
    Inventors: Aleksandar Aleksov, Adel A. Elsherbini, Javier Soto Gonzalez, Dilan Seneviratne, Shruti R. Jaywant, Sashi S. Kandanur, Srinivas Pietambaram, Nadine L. Dabby, Braxton Lathrop, Rajat Goyal, Vivek Raghunathan
  • Raster-planarized substrate interlayers and methods of planarizing same
    Patent number: 10068776
    Abstract: An interlayer dielectric material includes a planar surface that exhibits planarity due to raster-patterned decomposition products due to use of a confocal light beam. The planar surface encompasses a filled via that is in electrical and physical contact with a bond pad that is also on the planar surface.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: September 4, 2018
    Assignee: Intel Corporation
    Inventors: Frank Truong, Praneeth Akkinepally, Shruti R. Jaywant, Dilan Seneviratne