Abstract: Described herein are systems, methods, and software to enhance failover operations in a cloud computing environment. In one implementation, a method of operating a first service instance in a cloud computing environment includes obtaining a communication from a computing asset, wherein the communication comprises a first destination address. The method further provides replacing the first destination address with a second destination address in the communication, wherein the second destination address comprises a shared address for failover from a second service instance. After replacing the address, the method determines whether the communication is permitted based on the second destination address, and if permitted, processes the communication in accordance with a service executing on the service instance.

Abstract: A method for fabricating a semiconductor device includes the steps of forming a gate structure on a substrate, forming recesses adjacent to two sides of the gate structure, forming a buffer layer in the recesses, forming a first linear bulk layer on the buffer layer, forming a second linear bulk layer on the first linear bulk layer, forming a bulk layer on the second linear bulk layer, and forming a cap layer on the bulk layer.

Abstract: Stateful inspection and classification of packets is disclosed. For a first packet associated with a network traffic flow, a differentiated services header value (DSHV) is determined to associate with the first packet. The DSHV is used to perform a lookup of a quality of service treatment associated with the DSHV. The treatment is applied to the first packet. A determination is made, for a second packet associated with the network traffic flow, to associate a second DSHV with the second, where the second DSHV is different from the first DSHV.

Abstract: Provided are certain RET inhibitors, pharmaceutical compositions thereof, and methods of use thereof.

Abstract: Techniques for providing localization at scale for a cloud-based security service are disclosed. In some embodiments, a system/method/computer program product for providing localization at scale for a cloud-based security service includes receiving a connection request at a network gateway of a cloud-based security service; performing a source Network Address Translation (NAT) from a registered set of public IP addresses associated with a tenant; and providing secure access to a Software as a Service (SaaS) using the cloud-based security service.

Abstract: An electrical connection assembly includes a main body and a spring. One end of the main body is configured to be in contact with a device under test. The spring is sleeved around the main body. Two ends of the spring are respectively defined as a first end and a second end. The first end is abutted against a limiting protrusion, and a concealed section of the main body is correspondingly arranged inside of the spring. The spring has a first tightly-coiled section, an elastic section, and a second tightly-coiled section in sequence from the first end to the second end. A pitch of the spring within the elastic section is greater than a pitch of the spring within the first tightly-coiled section, and the pitch of the spring within the elastic section is greater than a pitch of the spring within the second tightly-coiled section.

Abstract: A semiconductor structure and method of forming the same are provided. The method includes: forming a plurality of mandrel patterns over a dielectric layer; forming a first spacer and a second spacer on sidewalls of the plurality of mandrel patterns, wherein a first width of the first spacer is larger than a second width of the second spacer; removing the plurality of mandrel patterns; patterning the dielectric layer using the first spacer and the second spacer as a patterning mask; and forming conductive lines laterally aside the dielectric layer.

Abstract: A first UE receives a first Session Initiation Protocol (SIP) INVITE message requesting the first UE to place the RTT call on hold, during an ongoing Real-Time Text (RTT) call with a second UE. In response to the first SIP INVITE message, the first UE sends a first SIP 200 OK message to the second UE, and the first SIP 200 OK message indicates that the first UE is not allowed to send and receive media data. After sending the first SIP 200 OK message, the first UE receives a second SIP INVITE message requesting the first UE to resume the RTT call. In response to the second SIP INVITE message, the first UE sends a third SIP INVITE message to the second UE, and the third SIP INVITE message indicates that the first UE is allowed to send and receive media data.

Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.

Abstract: Techniques are described for joint encoding and decoding of information symbols. In one embodiment, a method for joint encoding includes, in part, obtaining a sequence of information symbols, generating a plurality of cyclic codewords each corresponding to a portion of the sequence of information symbols, jointly encoding the plurality of cyclic codewords to generate at least one combined codeword, and providing the combined codeword to a device. The at least one combined codeword may be generated through Galois Fourier Transform (GFT).

Abstract: The present disclosure provides a forward converter with secondary LCD connected in series to realize excitation energy transfer, comprising a forward converter main circuit and an energy transfer and transmission circuit. The forward converter main circuit includes a high-frequency transformer T, a switching tube S, a diode D1, a diode D2, an inductance L1, and a capacitor C1. The energy transfer and transmission circuit includes a diode D3, a capacitor C2, and an inductance L2. The circuit structure of the present disclosure has simple circuit structure and high reliability. And the reverse recovery problem of the diode could be eliminated by the soft switch-off or soft switch-on of the switching tube, which further reducing the loss of switching tube and diodes and improving the overall efficiency. In addition, the excitation energy could be transferred to the load side to improve the energy transmission efficiency.

Abstract: The present disclosure provides a forward converter with secondary LCD connected in parallel to realize forward and backward energy transmission, comprising a forward converter main circuit and an energy transfer and transmission circuit. The forward converter main circuit includes a high-frequency transformer T, a switching tube S, a diode D1, a diode D2, an inductance L1, and a capacitor C1. The energy transfer and transmission circuit includes a diode D3, a capacitor C2 and an inductance L2.

Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.

Abstract: A structure including a wiring substrate, an interposer disposed on and electrically connected to the wiring substrate, a semiconductor die disposed on and electrically connected to the interposer, a first insulating encapsulation disposed on the interposer, a second insulating encapsulation disposed on the wiring substrate, and a lid is provided. The semiconductor die is laterally encapsulated by the first insulating encapsulation. The semiconductor die and the first insulating encapsulation are laterally encapsulated by the second insulating encapsulation. A top surface of the first insulating encapsulation is substantially leveled with a top surface of the second insulating encapsulation and a surface of the semiconductor die. The lid is disposed on the semiconductor die, the first insulating encapsulation and the second insulating encapsulation.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a substrate, a die stack disposed over the substrate, a heat spreader disposed over the substrate and having a surface facing the substrate, and a thermal interface material (TIM) disposed between the die stack and the heat spreader. A bottommost die of the die stack includes a surface exposed from remaining dies of the die stack from a top view perspective; and the TIM is in contact with the exposed surface of the bottommost die and the surface of the heat spreader, and is in contact with a sidewall of at least one of the plurality of dies of the die stack.

Abstract: A foldable dip net includes a handle, a connector and a net rack, wherein the handle comprises a U-shaped support connected with a handle lever and an arm rest plate; the connector has a mounting base body and a lock structure, and a light-emitting unit is arranged in the mounting base body; the net rack is hinged to the mounting base body through a rotary pin, and a clamping groove is formed in the side wall of the rotary pin and is matched with the lock structure.

Abstract: A package structure includes a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure is located on and electrically connected to the semiconductor die, the redistribution circuit structure includes a first contact pad having a first width and a second contact pad having a second width. The conductive pads are located on and electrically connected to the redistribution circuit structure through connecting to the first contact pad and the second contact pad, the redistribution circuit structure is located between the conductive pads and the semiconductor die. The first width of the first contact pad is less than a width of the conductive pads, and the second width of the second contact pad is substantially equal to or greater than the width of the conductive pads.

Abstract: A packaged semiconductor device and a method and apparatus for forming the same are disclosed. In an embodiment, a method includes bonding a device die to a first surface of a substrate; depositing an adhesive on the first surface of the substrate; depositing a thermal interface material on a surface of the device die opposite the substrate; placing a lid over the device die and the substrate, the lid contacting the adhesive and the thermal interface material; applying a clamping force to the lid and the substrate; and while applying the clamping force, curing the adhesive and the thermal interface material.

Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, a heat sink lid and conductive balls. The die is disposed on a front surface of the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the front surface of the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies. The conductive balls are disposed on the opposite surface of the circuit substrate and electrically connected with the die through the circuit substrate.

Abstract: A structure includes a bridge die. The bridge die includes a semiconductor substrate; and an interconnect structure over the semiconductor substrate. The interconnect structure includes dielectric layers and conductive lines in the dielectric layers, an encapsulant encapsulating the bridge die therein, and a redistribution structure over the bridge die. The redistribution structure includes redistribution lines therein. A first package component and a second package component are bonded to the redistribution lines. The first package component and the second package component are electrically interconnected through the redistribution lines and the bridge die.