Abstract: A semiconductor device is provided. The semiconductor device comprises a first semiconductor die comprising a first capacitor, and a second semiconductor die in contact with the first semiconductor die and comprises a diode. The first semiconductor die and the second semiconductor die are arranged along a first direction, and a diode is configured to direct electrons accumulated at the first capacitor to a ground.

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

Abstract: A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

Abstract: A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

Abstract: A method for mitigating eutrophication in a water body includes: adding a treating agent that contains nanosilicate platelets to an eutrophic water body, such that algae and suspended substances in the eutrophic water body are adsorbed by the nanosilicate platelets.

Abstract: A communication system includes a computer terminal and a server. The computer terminal includes a command control module and a response detecting module. The server includes a response control module. The command control module is configured for sending a command to the server. The response control module is configured for receiving the command, calculating a command check reference value according to the received command using a first formula, and sending a response to the response detecting module. The response detecting module is configured for calculating a response check reference value according to the response using a second formula. If the response check reference value is not equal to the response checksum bits value, the command control module resends the command corresponding to the received command to the server.

Abstract: An injection molding machine system for setting system parameters provides an interface unit displaying a boot interface, a common module interface, a new module setting interface, and a main operating interface. If not all the system parameter values need be modified, the system parameters are loaded on the boot interface and the main operating interface are started. If some of the system parameter values need be modified, the system parameter values are loaded, modified, and saved on the common module interface and the main operating interface are started. If all the system parameter values need be set, the system parameter values are saved on the new module setting interface and the main operating interface are started. If the system parameter values modified need be fine-tuned, the system parameter values are fine-tuned on the main operating interface.

Abstract: A detecting apparatus and method for detecting deformation of a fixed mold plate of an injection molding machine. The apparatus includes a mounting member and an elastic member that is received in the through hole of the mounting member and generally positioned at the center thereof. The apparatus also has a contacting member that is received in the through hole and positioned near or at the first end surface, and a sliding member that is slidably received in the through hole near or at the second end surface. A blocking member is attached to the second end surface of the mounting member. A pressure sensor is fixed between the blocking member and the contacting member.

Abstract: A detecting apparatus and method for detecting deformation of a fixed mold plate of an injection molding machine. The apparatus includes a mounting member and an elastic member that is received in the through hole of the mounting member and generally positioned at the center thereof. The apparatus also has a contacting member that is received in the through hole and positioned near or at the first end surface, and a sliding member that is slidably received in the through hole near or at the second end surface. A blocking member is attached to the second end surface of the mounting member. A pressure sensor is fixed between the blocking member and the contacting member.

Abstract: A panel that is used in forming the panel portions of recreational sport balls, and methods for the production thereof, are provided. The panels may be affixed to an inflatable bladder and include a base layer of polymeric material and a covering layer bonded thereto. The base layer may be bonded to a substrate layer of nonwoven cloth. The covering layer includes at least one conditioning agent that is either a water repellant agent to reduce water and sweat absorption, or an antistatic agent to repel dirt and dust, but may include both agents. The conditioning agent(s) may penetrate into the outer surface of the base layer to form the covering layer bonded thereto. Alternatively, the base layer may resist penetration by the conditioning agent(s) such that the covering layer is bonded to the surface of the base layer. The covering layer may further include an anti-bacterial agent.