Abstract: The invention provides a layout pattern of static random access memory (SRAM), which at least comprises a plurality of gate structures located on a substrate and spanning the plurality of fin structures to form a plurality of transistors distributed on the substrate, wherein the plurality of transistors comprise two pull-up transistors (PU), two pull-down transistors (PD) to form a latch circuit, and two access transistors (PG) connected to the latch circuit. In each SRAM memory cell, the fin structure included in the pull-up transistor (PU) is defined as a PU fin structure, the fin structure included in the pull-down transistor (PD) is defined as a PD fin structure, and the fin structure included in the access transistor (PG) is defined as a PG fin structure, wherein a width of the PD fin structure is wider than a width of the PG fin structure.

Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.

Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: The present invention is related to a composite laminated structure for shoe stiffeners and preparing method thereof. The composite laminated structure comprises: a fabric core layer, and a hot-melt-adhesive layer covering and interpenetrating the fabric core layer, wherein the fabric core layer comprises a fabric having a fabric count of about 61 to 13 wpi and about 60 to 30 fpi and a weight more than or equal to 100 g/m2. Preparing methods for said composite laminated structure are very simple processes. With the fabric core layer, proper performances could be achieved with simple hot-melt-adhesives. High level of cheap fillers, such as recycled materials, inorganic fillers or the mixture thereof, could be added while still maintaining excellent split tear strength, resilience and bending stiffness. Thus, the use of virgin materials and the overall cost could be greatly reduced for shoe stiffeners.

Abstract: The present invention is related to a composite laminated structure for shoe stiffeners and preparing method thereof. The composite laminated structure comprises: a fiber fabric core layer, and a hot-melt-adhesive layer covering and interpenetrating the fiber fabric core layer, whereby the composite laminated structure has a tear resistance greater than 3.0 kg or a resilience greater than 2.0 kg. Preparing methods for said composite laminated structure are very simple processes, which are also provided herein. With the fiber fabric core layer, proper performances could be achieved with simple hot-melt-adhesives. High level of cheap fillers, such as recycled materials, inorganic fillers or the mixture thereof, could be added while still maintaining excellent tear resistance and resilience. Thus, the use of virgin materials and the overall cost could be greatly reduced for shoe stiffeners.