Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A layout of a semiconductor memory device includes a substrate and a ternary content addressable memory (TCAM). The TCAM is disposed on the substrate and includes a plurality of TCAM bit cells, where at least two of the TCAM bit cells are mirror-symmetrical along an axis of symmetry, and each of the TCAM bit cells includes two storage units electrically connected to two word lines respectively, and a logic circuit electrically connected to the storage units. The logic circuit includes two first reading transistors, and two second reading transistors, where each of the second reading transistors includes a gate and source and drain regions, the source and drain regions of the second reading transistors are electrically connected to two matching lines and the first reading transistors, respectively, where the word lines are disposed parallel to and between the matching lines.

Abstract: An edge narrowing method for a display panel is disclosed. The method includes the steps of providing the display panel, a grinding apparatus and a polishing apparatus; tilting the display panel so that the first substrate and a grinding member of the grinding apparatus have a first grinding angle therebetween; grinding the first substrate and the light-shielding area with the grinding apparatus while the display panel is tilted at the first grinding angle, thereby forming a first grinding end surface; stopping grinding of the first substrate and the light-shielding area when the width of the light-shielding area is between 0.35 and 1 mm; and polishing the first grinding end surface with the polishing apparatus to form a first end surface.

Abstract: An edge narrowing method for a display panel is disclosed. The method includes the steps of providing the display panel, a grinding apparatus and a polishing apparatus; tilting the display panel so that the first substrate and a grinding member of the grinding apparatus have a first grinding angle therebetween; grinding the first substrate and the light-shielding area with the grinding apparatus while the display panel is tilted at the first grinding angle, thereby forming a first grinding end surface; stopping grinding of the first substrate and the light-shielding area when the width of the light-shielding area is between 0.35 and 1 mm; and polishing the first grinding end surface with the polishing apparatus to form a first end surface.

Abstract: An edge narrowing method for a display panel is disclosed. The display panel includes a first substrate, a second substrate, a sealant and a light-shielding area. The sealant is disposed between the first substrate and the second substrate. The light-shielding area is disposed between the first substrate and the sealant. The method includes the steps of providing the display panel, a grinding apparatus and a polishing apparatus; tilting the display panel so that the first substrate and a grinding member of the grinding apparatus have a first grinding angle therebetween; grinding the first substrate and the light-shielding area with the grinding apparatus while the display panel is tilted at the first grinding angle, thereby forming a first grinding end surface; stopping grinding of the first substrate and the light-shielding area when the width of the light-shielding area is between 0.35 and 1 mm; and polishing the first grinding end surface with the polishing apparatus to form a first end surface.

Abstract: A cambered liquid crystal display including a first substrate, a second substrate, a sealant, a plurality of photo-spacers and a liquid crystal layer is provided. The sealant is disposed between the first substrate and the second substrate, wherein the first substrate, the second substrate and the sealant are bent to form at least one cambered structure. The photo-spacers are disposed on the first substrate and distributed between the first and the second substrate, wherein a gap formed between a part of the photo-spacers close to the top of the cambered structure and the second substrate is smaller than a gap formed between a part of the photo-spacers apart from the top of the cambered structure and the second substrate. The liquid crystal layer is disposed between the first and the second substrate, wherein the photo-spacers and the liquid crystal layer are surrounded by the sealant.

Abstract: A display motherboard includes a first substrate, a second substrate, a plurality of cutting lines, and at least one photo supporting member. The second substrate is opposite the first substrate. The cutting lines are disposed on the first substrate and the second substrate, wherein the cutting lines separate the first substrate and the second substrate into at least one display panel. The photo supporting member is located between the first substrate and the second substrate, wherein the photo supporting member overlaps the cutting lines, and the photo supporting member has a bar shape surrounding the display panel.

Abstract: A display panel using laser cutting technology and a mother substrate thereof are provided. The display panel comprises two base plates opposite to each other, a sealant and a buffering metal layer. The sealant is disposed between the two base plates. The buffering metal layer formed on the inside surface of at least one of the two base plates is disposed along the sealant. At least a portion of the buffering metal layer is positioned outside the sealant. There is a first distance between the rim of the buffering metal layer and the edge of the base plate.

Abstract: A display panel using laser cutting technology and a mother substrate thereof are provided. The display panel comprises two base plates opposite to each other, a sealant and a buffering metal layer. The sealant is disposed between the two base plates. The buffering metal layer formed on the inside surface of at least one of the two base plates is disposed along the sealant. At least a portion of the buffering metal layer is positioned outside the sealant. There is a first distance between the rim of the buffering metal layer and the edge of the base plate.

Abstract: A display panel using laser cutting technology and a mother substrate thereof are provided. The display panel comprises two base plates opposite to each other, a sealant and a buffering metal layer. The sealant is disposed between the two base plates. The buffering metal layer formed on the inside surface of at least one of the two base plates is disposed along the sealant. At least a portion of the buffering metal layer is positioned outside the sealant. There is a first distance between the rim of the buffering metal layer and the edge of the base plate.

Abstract: A substrate splitting apparatus and a method for splitting a substrate using the substrate splitting apparatus are provided. The substrate splitting apparatus includes a servo motor, a transmission device, a substrate breaking bar, and a stage. One end of the transmission is directly or indirectly coupled to the servo motor while the other end is coupled with the breaking bar. The stage has a load-lock surface and the load-lock surface faces the breaking bar. The servo motor drives the transmission device to move the breaking bar toward the load-lock surface. A substrate with a pre-crack on the bottom is disposed on the load-lock surface. The servo motor drives the substrate breaking bar to move towards or away from the pre-crack. The method of splitting includes the following steps: forming a pre-crack on the substrate; controlling the servo motor to drive the breaking bar to move towards the substrate; and controlling the breaking bar to press the substrate at the pre-crack.

Abstract: An edge narrowing method for a display panel is disclosed. The display panel includes a first substrate, a second substrate, a sealant and a light-shielding area. The sealant is disposed between the first substrate and the second substrate. The light-shielding area is disposed between the first substrate and the sealant. The method includes the steps of providing the display panel, a grinding apparatus and a polishing apparatus; tilting the display panel so that the first substrate and a grinding member of the grinding apparatus have a first grinding angle therebetween; grinding the first substrate and the light-shielding area with the grinding apparatus while the display panel is tilted at the first grinding angle, thereby forming a first grinding end surface; stopping grinding of the first substrate and the light-shielding area when the width of the light-shielding area is between 0.35 and 1 mm; and polishing the first grinding end surface with the polishing apparatus to form a first end surface.

Abstract: A cambered liquid crystal display including a first substrate, a second substrate, a sealant, a plurality of photo-spacers and a liquid crystal layer is provided. The sealant is disposed between the first substrate and the second substrate, wherein the first substrate, the second substrate and the sealant are bent to form at least one cambered structure. The photo-spacers are disposed on the first substrate and distributed between the first and the second substrate, wherein a gap formed between a part of the photo-spacers close to the top of the cambered structure and the second substrate is smaller than a gap formed between a part of the photo-spacers apart from the top of the cambered structure and the second substrate. The liquid crystal layer is disposed between the first and the second substrate, wherein the photo-spacers and the liquid crystal layer are surrounded by the sealant.

Abstract: A display motherboard includes a first substrate, a second substrate, a plurality of cutting lines, and at least one photo supporting member. The second substrate is opposite the first substrate. The cutting lines are disposed on the first substrate and the second substrate, wherein the cutting lines separate the first substrate and the second substrate into at least one display panel. The photo supporting member is located between the first substrate and the second substrate, wherein the photo supporting member overlaps the cutting lines, and the photo supporting member has a bar shape surrounding the display panel.

Abstract: A display panel using laser cutting technology and a mother substrate thereof are provided. The display panel comprises two base plates opposite to each other, a sealant and a buffering metal layer. The sealant is disposed between the two base plates. The buffering metal layer formed on the inside surface of at least one of the two base plates is disposed along the sealant. At least a portion of the buffering metal layer is positioned outside the sealant. There is a first distance between the rim of the buffering metal layer and the edge of the base plate.

Abstract: The present invention provides a method for manufacturing display panel with substrates having different thickness. The display panel manufacturing method includes assembling a first substrate and a second substrate, positioning the anti-etching layer on the outer surface of the first substrate and etching the substrates at the first etching process. Because the anti-etching layer is disposed on the first substrate, the first substrate is protected by the anti-etching layer from being etched or later etched. Simultaneously, the second substrate is etched to reduce its thickness in order to adjust the thickness difference between the first substrate and the second substrate.

Abstract: A substrate splitting apparatus and a method for splitting a substrate using the substrate splitting apparatus are provided. The substrate splitting apparatus includes a servo motor, a transmission device, a substrate breaking bar, and a stage. One end of the transmission is directly or indirectly coupled to the servo motor while the other end is coupled with the breaking bar. The stage has a load-lock surface and the load-lock surface faces the breaking bar. The servo motor drives the transmission device to move the breaking bar toward the load-lock surface. A substrate with a pre-crack on the bottom is disposed on the load-lock surface. The servo motor drives the substrate breaking bar to move towards or away from the pre-crack. The method of splitting includes the following steps: forming a pre-crack on the substrate; controlling the servo motor to drive the breaking bar to move towards the substrate; and controlling the breaking bar to press the substrate at the pre-crack.