Abstract: A solid electrolyte is provided. The solid electrolyte includes inorganic ceramic electrolytes and an organic polymer. The organic polymer physically combines to the inorganic ceramic electrolytes. The organic polymer includes a repeat unit of formula (I), wherein the A includes the following formula (II): wherein each of R1 and R2 is independently selected at least one from the group consisting of the following groups: C2-C4 aliphatic alkyl, optionally substituted phenyl, bisphenol, bisphenol A, bisphenol F, and bisphenol S. The organic polymer is distributed uniformly between the inorganic ceramic electrolytes. The solid electrolyte has a conducting ion path. The solid electrolyte has a conducting ion path.

Abstract: A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.

Abstract: A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.

Abstract: A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.

Abstract: A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.

Abstract: A heat dissipating board structure includes a heat dissipating board body having a first face with at least one groove; and at least one heat pipe correspondingly received in the at least one groove to flush with the first face. To manufacture the heat dissipating board structure, first provide at least one heat pipe and a heat dissipating board body; then, form at least one groove on a first face of the board body, place the heat pipe in the groove, and press the board body with a press machine to associate the heat pipe with the groove while flatten a top of the heat pipe; and finally, flush the heat pipe with the first face by removing extra material of the heat pipe that is protruded from the first face. The completed heat dissipating board structure provides upgraded heat dissipation efficiency and eliminates the problem of thermal resistance.

Abstract: A pin leading device (1) comprises a hollow plate holder (8) having a hollow frame (9) and a hollow cylinder (10) disposed on the hollow frame (9), a threaded hole (101) formed in the hollow cylinder (10), a sleeve (2) having a recess hole (21) and a threaded end (20) engaging with the threaded hole (101), an elastic spring (3) inserted in an upper portion of the sleeve (2), a rod (4) inserted in the recess hole (21) and surrounded by the elastic spring (3), and a press head (5) disposed on an upper end of the rod (4). The hollow frame (9) has two opposite lateral plates (90) defining a spacing on a bottom of the hollow frame (9). A pin leading plate (6) is disposed on the bottom of the hollow frame (9). The pin leading plate (6) has a center hole (60) and two serrated lateral sides (7). The spacings between the lateral plates (90) of the hollow frame (9) and the lateral sides (7) of the leading plate (6) receive two rows of pins of an integrated circuit component.

Abstract: An IC hand tool is composed of a base, a main body, a press rod, and two holding arms. The base is provided with a receiving space for locating an IC element. The main body is fastened at one end thereof with the base and provided with an axial through hole in which the press rod is located such that a cap of the press rod is located outside the top end of the main body and that a leg block of the press rod is located in the receiving space of the base. The main body is further provided with two protruded portions and a plurality of fastening lugs for fastening the holding arms pivotally. The holding arms are provided respectively at the bottom end thereof with a hooked body for holding securely the IC element which is located in the receiving space of the base. The IC element is handled by mainpulating the press rod with hand of an operator.

Abstract: An umbrella control structure for automatic opening and closing is provided. A leaf spring maintains an umbrella closing spring in a compressed state when a control tab is moved upwardly to cause opening of the umbrella. The upward movement of the control tab causes a control tube to be displaced upwardly to release an active strut guide which permits an umbrella unfolding coil spring to cause the umbrella frame members to open outwardly. Subsequent downward displacement of the control tab causes a movable tab to displace the leaf spring. Displacement of the leaf spring releases a slidable inner tube member which releases the umbrella closing spring to cause the umbrella frame members to move inwardly and thereby close the umbrella.