Patents by Inventor Shu-Fen Wu

Shu-Fen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10441260
    Abstract: An expander includes a first handle, a second handle, a first supporting member, and a second supporting member. The first handle includes a first gripping portion, a first pivoting portion, a first connecting portion, and an expanding compass. The second handle includes a second gripping portion, a second pivoting portion, and a second connecting portion. The second gripping portion includes a thru groove, and the expanding compass passes through the thru groove. The second pivoting portion is pivoted to the first pivoting portion. The second connecting portion and the second gripping portion are extending from two ends of the second pivoting portion, and the extension direction of the second connecting portion is not parallel to the extension direction of the second gripping portion.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: October 15, 2019
    Assignees: Megaforce Company Limited, Mackay Memorial Hospital
    Inventors: Wen-Chieh Wu, Shu-Fen Chen, Pei-Yi Lee
  • Patent number: 10327629
    Abstract: An oral dilator includes a first body, a second body, a rotary member, and a positioning member. The first body includes a housing and a first duckbilled element. The second body includes a second duckbilled element corresponding to the first duckbilled element. The rotary member drives the second body to rotate. The positioning member is on the first body and selectively locks or unlocks the relative position between the first duckbilled element and the second duckbilled element when the second duckbilled element is driven to rotate by the rotary member.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: June 25, 2019
    Assignees: MEGAFORCE COMPANY LIMITED, MACKAY MEMORIAL HOSPITAL
    Inventors: Pei-Yi Lee, Shu-Fen Chen, Tien-Fu Chen, Kai-Ping Wang, Shunfeng Huang, Yi-Shun Chung, Shu-Hui Huang, Yu-Siang Ji, Zhen Wei Wu
  • Patent number: 9976215
    Abstract: An apparatus and method are disclosed for forming thin films on a semiconductor substrate. The apparatus in one embodiment includes a process chamber configured for supporting the substrate, a gas excitation power source, and first and second gas distribution showerheads fluidly coupled to a reactive process gas supply containing film precursors. The showerheads dispense the gas into two different zones above the substrate, which is excited to generate an inner plasma field and an outer plasma field over the wafer. The apparatus deposits a material on the substrate in a manner that promotes the formation of a film having a substantially uniform thickness across the substrate. In one embodiment, the substrate is a wafer. Various embodiments include first and second independently controllable power sources connected to the first and second showerheads to vary the power level and plasma intensity in each zone.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: May 22, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: You-Hua Chou, Chih-Tsung Lee, Shu-Fen Wu, Chin-Hsiang Lin
  • Patent number: 9287154
    Abstract: Embodiments of an ultraviolet (UV) curing system for treating a semiconductor substrate such as a wafer are disclosed. The curing system generally includes a processing chamber, a wafer support for holding a wafer in the chamber, a UV radiation source disposed above the chamber, and a UV transparent window interspersed between the radiation source and wafer support. In one embodiment, the wafer support is provided by a belt conveyor operable to transport wafers through the chamber during UV curing. In another embodiment, the UV radiation source is a movable lamp unit that travels across the top of the chamber for irradiating the wafer. In another embodiment, the UV transparent window includes a UV radiation modifier that reduces the intensity of UV radiation on portions of the wafer positioned below the modifier. Various embodiments enhance wafer curing uniformity by normalizing UV intensity levels on the wafer.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: March 15, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming Huei Lien, Chia-Ho Chen, Shu-Fen Wu, Chih-Tsung Lee, You-Hua Chou
  • Patent number: 9218998
    Abstract: An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied to the one or more electrodes via the power supply. An electrostatic attraction force associated with each of the field and one or more zones of the dielectric layer of the electrostatic chuck is induced, wherein the electrostatic attraction force varies based on the dielectric material of each of the field and one or more zones. The electrostatic attraction force is greater in the one or more zones than in the field, therein attracting warped regions of the workpiece to the clamping surface and clamping the warped workpiece to the clamping surface across a surface of the warped workpiece.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: December 22, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Ho Chen, Ming Huei Lien, Shu-Fen Wu, Chih-Tsung Lee, You-Hua Chou
  • Publication number: 20150016011
    Abstract: An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied to the one or more electrodes via the power supply. An electrostatic attraction force associated with each of the field and one or more zones of the dielectric layer of the electrostatic chuck is induced, wherein the electrostatic attraction force varies based on the dielectric material of each of the field and one or more zones. The electrostatic attraction force is greater in the one or more zones than in the field, therein attracting warped regions of the workpiece to the clamping surface and clamping the warped workpiece to the clamping surface across a surface of the warped workpiece.
    Type: Application
    Filed: October 3, 2014
    Publication date: January 15, 2015
    Inventors: Chia-Ho Chen, Ming Huei Lien, Shu-Fen Wu, Chih-Tsung Lee, You-Hua Chou
  • Patent number: 8902561
    Abstract: An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied to the one or more electrodes via the power supply. An electrostatic attraction force associated with each of the field and one or more zones of the dielectric layer of the electrostatic chuck is induced, wherein the electrostatic attraction force varies based on the dielectric material of each of the field and one or more zones. The electrostatic attraction force is greater in the one or more zones than in the field, therein attracting warped regions of the workpiece to the clamping surface and clamping the warped workpiece to the clamping surface across a surface of the warped workpiece.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: December 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Ho Chen, Ming Huei Lien, Shu-Fen Wu, Chih-Tsung Lee, You-Hua Chou
  • Publication number: 20130320235
    Abstract: Embodiments of an ultraviolet (UV) curing system for treating a semiconductor substrate such as a wafer are disclosed. The curing system generally includes a processing chamber, a wafer support for holding a wafer in the chamber, a UV radiation source disposed above the chamber, and a UV transparent window interspersed between the radiation source and wafer support. In one embodiment, the wafer support is provided by a belt conveyor operable to transport wafers through the chamber during UV curing. In another embodiment, the UV radiation source is a movable lamp unit that travels across the top of the chamber for irradiating the wafer. In another embodiment, the UV transparent window includes a UV radiation modifier that reduces the intensity of UV radiation on portions of the wafer positioned below the modifier. Various embodiments enhance wafer curing uniformity by normalizing UV intensity levels on the wafer.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 5, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming Huei LIEN, Chia-Ho CHEN, Shu-Fen WU, Chih-Tsung LEE, You-Hua CHOU
  • Publication number: 20130295297
    Abstract: An apparatus and method are disclosed for forming thin films on a semiconductor substrate. The apparatus in one embodiment includes a process chamber configured for supporting the substrate, a gas excitation power source, and first and second gas distribution showerheads fluidly coupled to a reactive process gas supply containing film precursors. The showerheads dispense the gas into two different zones above the substrate, which is excited to generate an inner plasma field and an outer plasma field over the wafer. The apparatus deposits a material on the substrate in a manner that promotes the formation of a film having a substantially uniform thickness across the substrate. In one embodiment, the substrate is a wafer. Various embodiments include first and second independently controllable power sources connected to the first and second showerheads to vary the power level and plasma intensity in each zone.
    Type: Application
    Filed: May 1, 2012
    Publication date: November 7, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: You-Hua CHOU, Chih-Tsung LEE, Shu-Fen WU, Chin-Hsiang LIN
  • Publication number: 20130239889
    Abstract: A semiconductor manufacturing tool and method for operating the tool are provided. The semiconductor manufacturing tool includes a process chamber in which plasma operations or ion etching operations are carried out and a valve assembly for opening and closing a valve that provides for loading and unloading substrates into and out of, the semiconductor manufacturing tool. While a processing operation is being carried out in the chamber, a valve assembly purge operation also takes place. The valve assembly purge operation involves inert gases being directed to the valve assembly area to prevent the buildup of particles and contaminating films in the valve assembly. Because the valve assembly is maintained in a clean condition, particle contamination is reduced or eliminated.
    Type: Application
    Filed: March 14, 2012
    Publication date: September 19, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming Huei LIEN, Chia-Ho CHEN, Shu-Fen WU, Chih-Tsung LEE, You-Hua CHOU
  • Publication number: 20130201596
    Abstract: An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied to the one or more electrodes via the power supply. An electrostatic attraction force associated with each of the field and one or more zones of the dielectric layer of the electrostatic chuck is induced, wherein the electrostatic attraction force varies based on the dielectric material of each of the field and one or more zones. The electrostatic attraction force is greater in the one or more zones than in the field, therein attracting warped regions of the workpiece to the clamping surface and clamping the warped workpiece to the clamping surface across a surface of the warped workpiece.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 8, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Ho Chen, Ming Huei Lien, Shu-Fen Wu, Chih-Tsung Lee, You-Hua Chou