Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

Abstract: A projector (20) projects a structured light pattern (46) along a first optical axis (44) onto a surface (80). A viewer (50) attached to the projector (20) receives a reflection of the structured light pattern (46) from the surface (80) along a second optical axis (54), and digitizes a two-dimensional snapshot. The optical axes (44, 54) are non-parallel, and they meet within a common field of view of the projector (20) and the viewer (50). A computer (61) interfaced to the viewer (50) receives the digitized snapshot, and analyzes it to mathematically model the surface for display and inspection. The projector and attached viewer are designed as a hand-held unit with a hand grip (66) and a trigger button (68) to trigger a snapshot. A guide tip (70) on the unit extends beside the two optical axes (44, 54) to the common field of view to position the hand-held unit.

Abstract: A phase shifting imaging module in a handheld imager is provided. The phase shifting imaging module includes a first beam splitter configured to split an image radiation beam into first and second image radiation beams. It also includes a first prism configured to align the first and second image radiation beams, and a second beam splitter configured to split the first and second image radiation beams into four image radiation beams. A second prism aligns the four image radiation beams. A phase mask introduces phase retardation between the four image radiation beams, resulting in four phase shifted image radiation beams. A pixilated sensor generates image data based upon each of the four phase shifted image radiation beams.

Abstract: Disclosed herein is a method comprising capturing an image of a grating formed on a surface of a brightness enhancing display film; measuring a displacement ?d of a fringe from the image of the grating; and determining a slope of a deviation from flatness of the brightness enhancing display film from the displacement ?d by using the equation (I) ? ? ? d ? ( y , ? 2 ) = 2 ? y ? ? sin ? ( ? 1 + ? 3 - 2 ? ? 2 ) [ tan ? ( ? 1 + ? 3 - ? 2 - 90 ) tan ? ( 90 - ? 2 ) + tan ? ( ? 1 + ? 3 - ? 2 - 90 ) ] ( I ) wherein y represents a distance along the brightness enhancing display film that represents a location of the deviation from flatness; ?1 is a light box angle; ?2 is the slope of the deviation from flatness in the brightness enhancing display film; and ?3 is a camera angle.

Abstract: A phase shifting imaging module in a handheld imager is provided. The phase shifting imaging module includes a first beam splitter configured to split an image radiation beam into first and second image radiation beams. It also includes a first prism configured to align the first and second image radiation beams, and a second beam splitter configured to split the first and second image radiation beams into four image radiation beams. A second prism aligns the four image radiation beams. A phase mask introduces phase retardation between the four image radiation beams, resulting in four phase shifted image radiation beams. A pixilated sensor generates image data based upon each of the four phase shifted image radiation beams.

Abstract: Disclosed herein is a method comprising capturing an image of a grating formed on a surface of a brightness enhancing display film; measuring a displacement ?d of a fringe from the image of the grating; and determining a slope of a deviation from flatness of the brightness enhancing display film from the displacement ?d by using the equation (I) ? ? ? ? d ? ( y , ? 2 ) = 2 ? y ? ? ? sin ? ( ? 1 + ? 3 - 2 ? ? 2 ) [ tan ? ( ? 1 + ? 3 - ? 2 - 90 ) tan ? ( 90 - ? 2 ) + tan ? ( ? 1 + ? 3 - ? 2 - 90 ) ] ( I ) wherein y represents a distance along the brightness enhancing display film that represents a location of the deviation from flatness; ?1 is a light box angle; ?2 is the slope of the deviation from flatness in the brightness enhancing display film; and ?3 is a camera angle.

Abstract: A projector (20) projects a structured light pattern (46) along a first optical axis (44) onto a surface (80). A viewer (50) attached to the projector (20) receives a reflection of the structured light pattern (46) from the surface (80) along a second optical axis (54), and digitizes a two-dimensional snapshot. The optical axes (44, 54) are non-parallel, and they meet within a common field of view of the projector (20) and the viewer (50). A computer (61) interfaced to the viewer (50) receives the digitized snapshot, and analyzes it to mathematically model the surface for display and inspection. The projector and attached viewer are designed as a hand-held unit with a hand grip (66) and a trigger button (68) to trigger a snapshot. A guide tip (70) on the unit extends beside the two optical axes (44, 54) to the common field of view to position the hand-held unit.

Abstract: An optical device comprised of multiple substrates with complimentary functions. The substrates are joined by structures that are integrated into the substrate surfaces. The joining structures are alternatively used to provide a spacer between the optical surface and other system components.