Patents by Inventor Shu Hamada

Shu Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200135396
    Abstract: A ceramic electronic component includes a stack including ceramic layers and internal electrodes stacked alternately, and external electrodes provided on a surface of the stack and electrically connected to the internal electrodes. The internal electrodes include a melting trigger portion that melts earlier than any other portion. The ceramic layer adjacent to the internal electrode including the melting trigger portion includes a cavity. The cavity is provided at a position at which the cavity overlaps the melting trigger portion at least partially in a stacking direction of the internal electrodes. The cavity is open on a melting trigger portion side. A surface of at least one of the stack and the external electrodes is provided with an identifier that serves as a marker indicating use of the ceramic electronic component with the cavity vertically below the melting trigger portion.
    Type: Application
    Filed: October 29, 2019
    Publication date: April 30, 2020
    Inventors: Takahiro HIRAO, Takashi OHARA, Shu HAMADA
  • Publication number: 20190144559
    Abstract: It is intended to provide an antitumor drug having an excellent therapeutic effect, which is excellent in terms of antitumor effect and safety. There is provided an antibody-drug conjugate in which an antitumor compound represented by the following formula is conjugated to an anti-TROP2 antibody via a linker having a structure represented by the following formula: -L1-L2-LP-NH—(CH2)n1-La-(CH2)n2-C(?O)— wherein the anti-TROP2 antibody is connected to the terminal of L1, and the antitumor compound is connected to the carbonyl group of the —(CH2)n2-C(?O)— moiety with the nitrogen atom of the amino group at position 1 as a connecting position.
    Type: Application
    Filed: January 24, 2019
    Publication date: May 16, 2019
    Applicants: DAIICHI SANKYO COMPANY, LIMITED, SAPPORO MEDICAL UNIVERSITY
    Inventors: Toshinori Agatsuma, Shu Takahashi, Jun Hasegawa, Daisuke Okajima, Hirofumi Hamada, Miki Yamaguchi
  • Publication number: 20170098637
    Abstract: A module board includes insulating layers, ground electrodes, signal electrodes, and interlayer vias. Electronic components are mounted on a front surface of the module board, and a sealing resin layer covers the electronic components. A half-cut portion is provided in the module board at an outer peripheral edge thereof and recessed to an intermediate position in a thickness direction of the module board. A shield layer cover the sealing resin layer. The shield layer includes a frame portion that extends into the half-cut portion. The frame portion is electrically connected to ground interlayer vias that are exposed at an end surface and a bottom surface of the half-cut portion.
    Type: Application
    Filed: December 15, 2016
    Publication date: April 6, 2017
    Inventor: Shu HAMADA
  • Publication number: 20140168510
    Abstract: The front face of an opening in a first wiring substrate is covered by a transparent substrate, a light-receiving face is made to face the opening, and an imaging element chip is flip-chip bonded to the rear face side of the first substrate. A gap formed between connection terminals between the periphery of the light-receiving face of the imaging element chip and the peripheral edge section of the opening is buried in a first resin, and the entire rear face of the imaging element chip and the rear face side of the first substrate are covered by a second resin. At the front face on this rear face side, an exposed conductive portion substantially parallel with the front face of the transparent substrate is covered with the second resin. A second wiring substrate is electrically and mechanically connected to the first substrate.
    Type: Application
    Filed: February 19, 2014
    Publication date: June 19, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Shu HAMADA, Hitoshi SHIMAMURA, Yoshiyuki TAKASE
  • Patent number: 7646402
    Abstract: Shooting is performed upon full depression of a shutter button, and a taken image is recorded in a memory card as an image file. An LCD displays the taken image and a print number thereof. The print number is adjusted by pressing addition and subtraction buttons. Upon pressing a decision button, number data of the print number is inputted. The number data is recorded in the memory card so as to relate to the image file. Incidentally, in case the shutter button is pressed by half without inputting the number data, the print number is set to one, and next shooting is allowed. The above operation is repeated until entire shooting is completed.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: January 12, 2010
    Assignee: Fujifilm Corporation
    Inventors: Mitsuhiro Moriya, Hideaki Kataoka, Akira Haishi, Akihisa Iida, Shu Hamada
  • Publication number: 20050226596
    Abstract: Shooting is performed upon full depression of a shutter button, and a taken image is recorded in a memory card as an image file. An LCD displays the taken image and a print number thereof. The print number is adjusted by pressing addition and subtraction buttons. Upon pressing a decision button, number data of the print number is inputted. The number data is recorded in the memory card so as to relate to the image file. Incidentally, in case the shutter button is pressed by half without inputting the number data, the print number is set to one, and next shooting is allowed. The above operation is repeated until entire shooting is completed.
    Type: Application
    Filed: March 25, 2005
    Publication date: October 13, 2005
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Mitsuhiro Moriya, Hideaki Kataoka, Akira Haishi, Akihisa Iida, Shu Hamada