Patents by Inventor Shu Hamada
Shu Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260158550Abstract: A method for manufacturing a ceramic electronic component that includes: forming a modeled object by applying a ceramic material, a metal material, and a disappearing material by 3D printing, the modeled object including an electronic component main body containing the ceramic material and the metal material, a support body that contains the ceramic material and that is disposed around at least a portion of a periphery of the electronic component main body, and a disappearing body that contains the disappearing material and that is disposed between the electronic component main body and the support body; firing the modeled object at a temperature higher than or equal to a temperature at which the disappearing body disappears; and isolating the support body from the modeled object after firing so as to obtain the ceramic electronic component.Type: ApplicationFiled: April 15, 2025Publication date: June 11, 2026Inventors: Shu HAMADA, Jun KOJIMA
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Patent number: 12609452Abstract: A dielectric block includes a bottom surface that includes a conductive ground member including an antenna ground surface inclined with respect to the bottom surface. A feed element is disposed at a distance from the antenna ground surface, and constitutes a patch antenna together with the antenna ground surface. A feed line is connected to a feed point of the feed element, and a dielectric member that supports the feed element with respect to the ground member. The ground member is exposed to the bottom surface, on both a lower side and a higher side of a contour line passing through an intersection point of a perpendicular line from the feed point to a virtual plane including the bottom surface and a plane including the antenna ground surface, using the bottom surface as a height reference.Type: GrantFiled: January 11, 2024Date of Patent: April 21, 2026Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hideki Ueda, Kaoru Sudo, Natsumi Minamitani, Jun Adachi, Shu Hamada
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Patent number: 12567532Abstract: An inductor includes a housing composed of an insulating material and a conical coil provided inside the housing. The conical coil is formed of a spirally wound coil conductor. The winding diameter of the conical coil increases in a continuous manner. The coil conductor has a rectangular cross section. Parts of the coil conductor that are adjacent to each other in a winding axis direction of the conical coil are disposed so as to partially overlap when looking in the winding axis direction of the conical coil. The insulating material of the housing is disposed without any gaps along the periphery of the coil conductor.Type: GrantFiled: December 8, 2021Date of Patent: March 3, 2026Assignee: Murata Manufacturing Co., Ltd.Inventors: Shu Hamada, Hiroya Ueyama
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Patent number: 12441063Abstract: A three-dimensional print data generation method is capable of matching the number of layers and/or size of slice data. Three-dimensional interpolation shape data is generated by interpolating a three-dimensional interpolation shape on three-dimensional shape data having a plurality of three-dimensional shapes composed of different materials. The three-dimensional interpolation shape defines an outline in slice data, and a shape disposed outside of the maximum outline of the three-dimensional shape on the deposition surface of the three-dimensional print and is continuous from the bottommost end to the topmost end of the three-dimensional shape in the layering direction of the three-dimensional print. The three-dimensional shape and the three-dimensional interpolation shape for each three-dimensional shape are sliced in the three-dimensional interpolation shape data to generate a plurality of items of interpolation slice data.Type: GrantFiled: October 31, 2023Date of Patent: October 14, 2025Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Shu Hamada
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Publication number: 20250119633Abstract: A distal-end structure of an endoscope includes an image sensor disposed in a distal-end portion of an insertion portion of the endoscope elongated in an axial direction D1. The image sensor is directed in the axial direction D1 toward a distal end of the insertion portion and is configured to capture an image. A light-emitting device is disposed in the distal-end portion and configured to emit light in the axial direction D1 toward the distal end. A connection member is disposed inside the distal-end portion and in which the image sensor and the light-emitting device are mounted. Wires are connected to the connection member. The wires supply electricity for driving the image sensor and the light-emitting device from outside the endoscope, transmit driving signals, and also transmit captured image data to a control unit.Type: ApplicationFiled: December 17, 2024Publication date: April 10, 2025Inventors: Shu HAMADA, Tetsuo KAWAKAMI, Hiroyuki DAI
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Publication number: 20240268742Abstract: An implantable device is provided that includes a tubular body with at least one open end, defining an inner space, a cap closing the at least one open end and having an inner surface on one side and an outer surface on the other side, the inner surface facing the inner space, and a circuit board being placed in the inner space, having an active surface, a board electrode disposed on the active surface, and a wireless communication circuit to communicate outside of a body, biological information obtained via the board electrode. Moreover, a recess and an inner electrode are disposed on the inner surface of the cap, and the circuit board is disposed in the recess, and the inner electrode is electrically connected to the board electrode. An outer electrode is disposed on the outer surface of the cap and is electrically connected to the inner electrode.Type: ApplicationFiled: April 16, 2024Publication date: August 15, 2024Inventors: Shu HAMADA, Alper BOZKURT, James REYNOLDS, Parvez AHMMED
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Publication number: 20240145926Abstract: A dielectric block includes a bottom surface that includes a conductive ground member including an antenna ground surface inclined with respect to the bottom surface. A feed element is disposed at a distance from the antenna ground surface, and constitutes a patch antenna together with the antenna ground surface. A feed line is connected to a feed point of the feed element, and a dielectric member that supports the feed element with respect to the ground member. The ground member is exposed to the bottom surface, on both a lower side and a higher side of a contour line passing through an intersection point of a perpendicular line from the feed point to a virtual plane including the bottom surface and a plane including the antenna ground surface, using the bottom surface as a height reference.Type: ApplicationFiled: January 11, 2024Publication date: May 2, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Hideki UEDA, Kaoru SUDO, Natsumi MINAMITANI, Jun ADACHI, Shu HAMADA
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Publication number: 20240059018Abstract: A three-dimensional print data generation method is capable of matching the number of layers and/or size of slice data. Three-dimensional interpolation shape data is generated by interpolating a three-dimensional interpolation shape on three-dimensional shape data having a plurality of three-dimensional shapes composed of different materials. The three-dimensional interpolation shape defines an outline in slice data, and a shape disposed outside of the maximum outline of the three-dimensional shape on the deposition surface of the three-dimensional print and is continuous from the bottommost end to the topmost end of the three-dimensional shape in the layering direction of the three-dimensional print. The three-dimensional shape and the three-dimensional interpolation shape for each three-dimensional shape are sliced in the three-dimensional interpolation shape data to generate a plurality of items of interpolation slice data.Type: ApplicationFiled: October 31, 2023Publication date: February 22, 2024Inventor: Shu HAMADA
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Publication number: 20220102064Abstract: An inductor includes a rectangular parallelepiped shaped housing, a conical coil buried inside the housing, a first outer electrode provided on a first end portion of a substrate mounting surface of the housing, and a second outer electrode provided on a second end portion of the substrate mounting surface of the housing. The conical coil is formed of the coil conductor, which is wound in a spiral shape. A winding axis direction of the conical coil is tilted with respect to the substrate mounting surface of the housing. Two ends of the coil conductor are connected to the first outer electrode and the second outer electrode so that end portions of the coil conductor are at a side near the substrate mounting surface of the housing.Type: ApplicationFiled: December 8, 2021Publication date: March 31, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Shu HAMADA, Hiroya UEYAMA
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Publication number: 20220102059Abstract: An inductor includes a housing composed of an insulating material and a conical coil provided inside the housing. The conical coil is formed of a spirally wound coil conductor. The winding diameter of the conical coil increases in a continuous manner. The coil conductor has a rectangular cross section. Parts of the coil conductor that are adjacent to each other in a winding axis direction of the conical coil are disposed so as to partially overlap when looking in the winding axis direction of the conical coil. The insulating material of the housing is disposed without any gaps along the periphery of the coil conductor.Type: ApplicationFiled: December 8, 2021Publication date: March 31, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Shu HAMADA, Hiroya UEYAMA
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Patent number: 10937593Abstract: A ceramic electronic component includes a stack including ceramic layers and internal electrodes stacked alternately, and external electrodes provided on a surface of the stack and electrically connected to the internal electrodes. The internal electrodes include a melting trigger portion that melts earlier than any other portion. The ceramic layer adjacent to the internal electrode including the melting trigger portion includes a cavity. The cavity is provided at a position at which the cavity overlaps the melting trigger portion at least partially in a stacking direction of the internal electrodes. The cavity is open on a melting trigger portion side. A surface of at least one of the stack and the external electrodes is provided with an identifier that serves as a marker indicating use of the ceramic electronic component with the cavity vertically below the melting trigger portion.Type: GrantFiled: October 29, 2019Date of Patent: March 2, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Hirao, Takashi Ohara, Shu Hamada
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Publication number: 20200135396Abstract: A ceramic electronic component includes a stack including ceramic layers and internal electrodes stacked alternately, and external electrodes provided on a surface of the stack and electrically connected to the internal electrodes. The internal electrodes include a melting trigger portion that melts earlier than any other portion. The ceramic layer adjacent to the internal electrode including the melting trigger portion includes a cavity. The cavity is provided at a position at which the cavity overlaps the melting trigger portion at least partially in a stacking direction of the internal electrodes. The cavity is open on a melting trigger portion side. A surface of at least one of the stack and the external electrodes is provided with an identifier that serves as a marker indicating use of the ceramic electronic component with the cavity vertically below the melting trigger portion.Type: ApplicationFiled: October 29, 2019Publication date: April 30, 2020Inventors: Takahiro HIRAO, Takashi OHARA, Shu HAMADA
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Publication number: 20170098637Abstract: A module board includes insulating layers, ground electrodes, signal electrodes, and interlayer vias. Electronic components are mounted on a front surface of the module board, and a sealing resin layer covers the electronic components. A half-cut portion is provided in the module board at an outer peripheral edge thereof and recessed to an intermediate position in a thickness direction of the module board. A shield layer cover the sealing resin layer. The shield layer includes a frame portion that extends into the half-cut portion. The frame portion is electrically connected to ground interlayer vias that are exposed at an end surface and a bottom surface of the half-cut portion.Type: ApplicationFiled: December 15, 2016Publication date: April 6, 2017Inventor: Shu HAMADA
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Publication number: 20140168510Abstract: The front face of an opening in a first wiring substrate is covered by a transparent substrate, a light-receiving face is made to face the opening, and an imaging element chip is flip-chip bonded to the rear face side of the first substrate. A gap formed between connection terminals between the periphery of the light-receiving face of the imaging element chip and the peripheral edge section of the opening is buried in a first resin, and the entire rear face of the imaging element chip and the rear face side of the first substrate are covered by a second resin. At the front face on this rear face side, an exposed conductive portion substantially parallel with the front face of the transparent substrate is covered with the second resin. A second wiring substrate is electrically and mechanically connected to the first substrate.Type: ApplicationFiled: February 19, 2014Publication date: June 19, 2014Applicant: FUJIFILM CorporationInventors: Shu HAMADA, Hitoshi SHIMAMURA, Yoshiyuki TAKASE
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Patent number: 7646402Abstract: Shooting is performed upon full depression of a shutter button, and a taken image is recorded in a memory card as an image file. An LCD displays the taken image and a print number thereof. The print number is adjusted by pressing addition and subtraction buttons. Upon pressing a decision button, number data of the print number is inputted. The number data is recorded in the memory card so as to relate to the image file. Incidentally, in case the shutter button is pressed by half without inputting the number data, the print number is set to one, and next shooting is allowed. The above operation is repeated until entire shooting is completed.Type: GrantFiled: March 25, 2005Date of Patent: January 12, 2010Assignee: Fujifilm CorporationInventors: Mitsuhiro Moriya, Hideaki Kataoka, Akira Haishi, Akihisa Iida, Shu Hamada
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Publication number: 20050226596Abstract: Shooting is performed upon full depression of a shutter button, and a taken image is recorded in a memory card as an image file. An LCD displays the taken image and a print number thereof. The print number is adjusted by pressing addition and subtraction buttons. Upon pressing a decision button, number data of the print number is inputted. The number data is recorded in the memory card so as to relate to the image file. Incidentally, in case the shutter button is pressed by half without inputting the number data, the print number is set to one, and next shooting is allowed. The above operation is repeated until entire shooting is completed.Type: ApplicationFiled: March 25, 2005Publication date: October 13, 2005Applicant: FUJI PHOTO FILM CO., LTD.Inventors: Mitsuhiro Moriya, Hideaki Kataoka, Akira Haishi, Akihisa Iida, Shu Hamada