Patents by Inventor Shu-Hsien Lin

Shu-Hsien Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Waterproof and heat-dissipating module mounted for an electronic device
    Patent number: 7843684
    Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: November 30, 2010
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Yi-Jen Lu, Shu-Hsien Lin
  • WATERPROOF AND HEAT-DISSIPATING MODULE MOUNTED FOR AN ELECTRONIC DEVICE
    Publication number: 20100195282
    Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.
    Type: Application
    Filed: April 23, 2009
    Publication date: August 5, 2010
    Inventors: Yi-Jen Lu, Shu-Hsien Lin