Abstract: Some embodiments relate to a semiconductor structure. The semiconductor structure includes a first substrate including a first plurality of conductive pads that are laterally spaced apart from one another on the first substrate. A first plurality of conductive bumps are disposed on the first plurality of conductive pads, respectively. A multi-tiered solder-resist structure is disposed on the first substrate and arranged between the first plurality of conductive pads. The multi-tiered solder-resist structure has different widths at a different heights over the first substrate and contacts sidewalls of the first plurality of conductive bumps to separate the first plurality of conductive bumps from one another.

Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A hidden image capturing device is applied to a display. The hidden image capturing device has a shell, a control module, a slide module, and an image capturing module. The slide module is disposed in the shell and controlled by the control module for sliding. Besides, the slide module enables the image capturing module to extend out or withdraw into the shell when it slides.

Abstract: A handheld electronic device including a body and an image capturing module. A display is disposed on one surface of the body. The image capturing module is disposed at the body, and includes a lens and a filter unit. The lens is exposed from an opening on the body. Images captured by the lens are displayed on the display. The filter unit includes at least one first filter, one second filter, and a switch. Each of the first filter and the second filter transmits light with different wavelength. The switch is used to switch the first filter and the second filter so that one of the first filter and the second filter is on the light receiving path of the lens.

Abstract: A hidden image capturing device is applied to a display. The hidden image capturing device has a shell, a control module, a slide module, and an image capturing module. The slide module is disposed in the shell and controlled by the control module for sliding. Besides, the slide module enables the image capturing module to extend out or withdraw into the shell when it slides.

Abstract: An ionizer incorporated with an electronic appliance utilizes the power supply of the appliance so that only less device and space are required for the additional ion function. The small power-consumption ionizer does not influence the original function of the electronic device while the negative ions help refreshing the air and improving people's moods, energy and health.

Abstract: A recessed touch pad comprises a case, a touchpad module, an extension and retraction mechanism and a data transmission interface. The case, equipped with a motherboard of notebook, has a storing space and a storing port. The touchpad module is used to control the shift of display cursor of notebook, while the extension and retraction mechanism is placed between the case's storing space and touchpad module, such that the touchpad module can exit/enter the storing space via the storing port. Besides, a data transmission interface is placed between the case and touchpad module to transmit the signal of touchpad module. Based on this recessed touch pad, notebook's keyboard is located backwards and the drop height of operating panel and tabletop is minimized in favor of the ergonomics for long-lasting operation.

Abstract: A wireless touch-control panel and an information process system applied to the touch-control panel. The information process system has a portable information process device, such as a notebook computer, a personal data assistance or other similar products, a touch-control panel providing a sensor plane allowing the user to touch, a sensor circuit to receive and identify the input signal, generated when the user touches the touch-control panel, an output corresponding signal, and a wireless module to transmit the signal output via the sensor circuit to a wireless receiving module of the portable information process device through a built-in antenna.