Abstract: Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.

Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: Some embodiments relate to a semiconductor structure. The semiconductor structure includes a first substrate including a first plurality of conductive pads that are laterally spaced apart from one another on the first substrate. A first plurality of conductive bumps are disposed on the first plurality of conductive pads, respectively. A multi-tiered solder-resist structure is disposed on the first substrate and arranged between the first plurality of conductive pads. The multi-tiered solder-resist structure has different widths at a different heights over the first substrate and contacts sidewalls of the first plurality of conductive bumps to separate the first plurality of conductive bumps from one another.

Abstract: An organometallic complex, a catalyst composition employing the same, and a method for preparing polyolefin are provided. The organometallic compound has a structure represented by Formula (I) wherein M is Ti, Zr, or Hf; X is —O—, or —NR6—; R1 and R2 are independently hydrogen, C1-6 alkyl group, C6-12 aryl group, or R1 and R2 are combined with the carbon atoms, to which they are attached, to form an C6-12 aryl moiety; R3, R4 and R5 are independently fluoride, chloride, bromide, C1-6 alkyl group, C6-12 aryl group, C3-6 hetero aryl group, C7-13 aryl alkyl group or C7-12 alkyl aryl group; and R6 is hydrogen, C6-12 aryl group or C7-12 alkyl aryl group.

Abstract: A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures connect the substrate and corners of the thermal conductive structure. The thermal conductive structure has a side edge connecting the first and the second support structures. The first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. The first and the second support structures are disposed along a side of the substrate. The first support structure is laterally separated from the side of the substrate by a first lateral distance. The side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.

Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.

Abstract: A method includes forming a first dielectric layer, forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes forming a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, with a first center of conductive pad being offsetting from a second center of the conductive bump. The second via is further offset from the second center of the conductive bump.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A shoe that is conveniently put on and taken off includes an outsole, an upper, a supporting piece, and a guiding piece. The upper is attached on the outsole and has a counter and a collar extending upward from the counter and configured as a shoehorn. The supporting piece is attached to the counter and the collar of the upper. The guiding piece is attached to an instep of the upper. Because of the supporting piece having a predetermined hardness and the collar having a shape like a shoehorn, the rear of the upper can be served as a shoehorn for helping a user's foot in slipping into the shoe. In addition, the guiding piece can avoid the instep of the upper from becoming crease and unsmooth. As a result, the shoe is convenient for the user to put on without bending his back and using his hand.

Abstract: A hinge includes a base, an arm, a mounting member, a hinge spring, a fixing pin member, and a damping device. Two ends of the arm are pivotably connected to the base and the mounting member, with the hinge spring exerting elastic force on the base and the arm. The damping device is mounted in the base and includes a fixed seat mounted in the base, a sliding block movably received in the fixed seat, a damping member mounted between the sliding block and the fixing pin member and abutting the base, and an elastic element. The sliding block includes a front portion facing the arm and a rear portion connected to the elastic element pressing against the fixed seat.

Abstract: A hinge includes a base, a crank, a bottom board, a crank engagement seat, and a fixed seat. The crank is pivotably connected to the base. The bottom board includes at least one retaining portion, a first rivet hole and a vertical elongated hole. The crank engagement seat is connected to the crank and located between the fixed seat and the bottom board. The crank engagement seat includes first and second through-holes and a second rivet hole. The fixed seat includes first and second adjusting holes. A first adjusting member is extended through the first adjusting hole and the first through-hole into the first rivet hole. A second adjusting member is extended through the second adjusting hole into the second rivet hole. The bottom board and the crank engagement seat can be slightly moved in the vertical direction. The crank engagement seat can be slightly moved in the horizontal direction.

Abstract: A shoe that is conveniently put on and taken off includes an outsole, an upper, a supporting piece, and a guiding piece. The upper is attached on the outsole and has a counter and a collar extending upward from the counter and configured as a shoehorn. The supporting piece is attached to the counter and the collar of the upper. The guiding piece is attached to an instep of the upper. Because of the supporting piece having a predetermined hardness and the collar having a shape like a shoehorn, the rear of the upper can be served as a shoehorn for helping a user's foot in slipping into the shoe. In addition, the guiding piece can avoid the instep of the upper from becoming crease and unsmooth. As a result, the shoe is convenient for the user to put on without bending his back and using his hand.

Abstract: A hinge includes a base, an arm, a mounting member, a hinge spring, a fixing pin member, and a damping device. Two ends of the arm are pivotably connected to the base and the mounting member, with the hinge spring exerting elastic force on the base and the arm. The damping device is mounted in the base and includes a fixed seat mounted in the base, a sliding block movably received in the fixed seat, a damping member mounted between the sliding block and the fixing pin member and abutting the base, and an elastic element. The sliding block includes a front portion facing the arm and a rear portion connected to the elastic element pressing against the fixed seat.

Abstract: A hinge includes a base, an arm, and an elastic element. The base includes a recessed body having a rear wall with a supporting portion. The arm includes a pivotal portion and two cam portions. A first pin section of a fixing pin member is extended through the pivotal portion and connected to the base. The elastic element includes two front elastic portions, a rear elastic portion, two intermediate portions each interconnected to one of the front elastic portions, and two extensions each interconnected between the rear elastic portion and one of the intermediate portions. The front elastic portions press against the cam portions. The intermediate portions are connected to the base by a second pin section of the fixing pin member. The rear elastic portion abuts the supporting portion of the rear wall.

Abstract: A hinge includes a base, a crank, a bottom board, a crank engagement seat, and a fixed seat. The crank is pivotably connected to the base. The bottom board includes at least one retaining portion, a first rivet hole and a vertical elongated hole. The crank engagement seat is connected to the crank and located between the fixed seat and the bottom board. The crank engagement seat includes first and second through-holes and a second rivet hole. The fixed seat includes first and second adjusting holes. A first adjusting member is extended through the first adjusting hole and the first through-hole into the first rivet hole. A second adjusting member is extended through the second adjusting hole into the second rivet hole. The bottom board and the crank engagement seat can be slightly moved in the vertical direction. The crank engagement seat can be slightly moved in the horizontal direction.

Abstract: A hinge includes a base receiving a coupling device detachably mounted onto a mounting seat. An outer resilient plate includes an end pivotably mounted onto the base. A fixed seat is pivotably mounted onto the other end of the outer resilient plate. A buffer device includes a connecting member, a buffer, and an inner resilient plate. Each of a first pivot hole of the connecting member, an end of the buffer, and an end of the inner resilient plate is pivotably mounted onto the base. The other end of the buffer is pivotably mounted onto a second pivot hole of the connecting member. The other end of the inner resilient plate is slideably mounted onto an arcuate slot of the connecting member. The inner resilient plate further includes a fulcrum pivot hole intermediate the ends thereof. The fulcrum pivot hole is pivotably mounted by a pivot to the base.

Abstract: A hinge includes a base receiving a coupling device detachably mounted onto a mounting seat. An outer resilient plate includes an end pivotably mounted onto the base. A fixed seat is pivotably mounted onto the other end of the outer resilient plate. A buffer device includes a connecting member, a buffer, and an inner resilient plate. Each of a first pivot hole of the connecting member, an end of the buffer, and an end of the inner resilient plate is pivotably mounted onto the base. The other end of the buffer is pivotably mounted onto a second pivot hole of the connecting member. The other end of the inner resilient plate is slideably mounted onto an arcuate slot of the connecting member. The inner resilient plate further includes a fulcrum pivot hole in at intermediate portion thereof. The fulcrum pivot hole is pivotably mounted by a pivot to the base.