Abstract: A clock having a transparent weight with a liquid content comprising a clock shell installed with a set of clockwork, with a pendulum positioned inside the clock shell. The transparent weight at the bottom of the pendulum consists of a transparent container filled with liquid and an adornment floating on the surface of the liquid. A piece of magnet is fastened onto the pendulum, and a piece of electromagnet is attached to the bottom of the clock. The nature of the magnetic attraction of the iron alternates with the change of the electric current being passed through the iron, which causes the pendulum to swing back and forth. As the pendulum swings, the liquid in the transparent container fluctuates, shaking the adornment to achieve an animated effect.

Abstract: A chip scale package, which can be fabricated on a print circuit board, comprises a chip having multiple electrodes, a plurality of conductive blocks, and an insulating material. The electrodes of the chip are electrically connected to the conductive blocks respectively through one of the surfaces thereof by a conductive bond, and are electrically connected to the circuit on the print circuit board through the side surfaces thereof. The insulated material is filled on the chip surface between the conductive blocks, and in the gap between the conductive blocks and the chip.

Abstract: A dual-chip packaging structure comprises a die pad with a chip attached to each of its two surfaces. Outside and around the die pad is a plurality of first metal studs. A plurality of second metal studs is arranged outside and around the first metal studs. Connections between the first metal studs and the second metal studs are made by means of a plurality of conductive traces. The two chips on the respective surfaces of the die pad are connected to corresponding ends of the first metal studs through bonding wires. An insulating material is employed to enclose the two chips, the die pad, the first metal studs, the conductive traces, and ends of the second metal studs, with other ends of the second metal studs exposed. A plurality of solder balls is attached to the respective exposed ends of the second metal studs.

Abstract: A metal stud array packaging structure has a die pad with a die attached on it. A plurality of metal studs is located around the die pad. A metal heat dissipating ring is selectively located outside the metal studs. The metal heat dissipating ring is connected to the die pad. The die, the die pad, and one end of each metal stud are enclosed by an insulating material. The enclosed ends of the metal studs are electrically connected to bonding pads of the die. The insulating material exposes a bottom surface of the die pad. Moreover, both ends of each metal stud and both surfaces of the metal heat dissipating ring have plated layers.

Abstract: A chip scale package, which can be fabricated on a print circuit board, comprises a chip having multiple electrodes, a plurality of conductive blocks, and an insulating material. The electrodes of the chip are electrically connected to the conductive blocks respectively through one of the surfaces thereof by a conductive bond, and are electrically connected to the circuit on the print circuit board through the side surfaces thereof. The insulated material is filled on the chip surface between the conductive blocks, and in the gap between the conductive blocks and the chip.