Patents by Inventor Shu-Hui Cheng
Shu-Hui Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12286287Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.Type: GrantFiled: October 20, 2021Date of Patent: April 29, 2025Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Eddy Liu, Jun Yan, Chih-Yuan Cheng, Wei-Da Yang, Jun Chen, Er-Wei Chen, Xiao-Ming Lv, Qi Feng, Shu-Fa Jiang, Zhe-Qi Zhao, Hsin-Ta Lin, Han Yang, Jun-Hui Zhang
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Publication number: 20250126855Abstract: Methods for forming a gate structure of a multi-gate device are provided. An example method includes depositing a gate dielectric layer over first nanostructures over a first region of a substrate and second nanostructures over a second region of the substrate, depositing a first work function metal (WFM) layer over the first nanostructures and the second nanostructures, depositing a first hard mask (HM) layer over the first WFM layer, selectively removing the first HM layer and the first WFM layer over the first region, selectively removing the first HM layer over the second region, depositing a second WFM layer over the substrate, depositing a second HM layer over the second WFM layer, selectively removing the second HM layer and the second WFM layer over the first region, selectively removing the second HM layer over the second region, and depositing a third WFM layer over the substrate.Type: ApplicationFiled: October 12, 2023Publication date: April 17, 2025Inventors: Ming-Huei Lin, Kai-Yuan Cheng, Chih-Pin Tsao, Hsing-Kan Peng, Shih-Hsun Chang, Shu-Hui Wang, Jeng-Ya Yeh
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Publication number: 20250113496Abstract: Various embodiments of the present application are directed towards an integrated chip (IC). The IC comprises a trench capacitor overlying a substrate. The trench capacitor comprises a plurality of capacitor electrode structures, a plurality of warping reduction structures, and a plurality of capacitor dielectric structures. The plurality of capacitor electrode structures, the plurality of warping reduction structures, and the plurality of capacitor dielectric structures are alternatingly stacked and define a trench segment that extends vertically into the substrate. The plurality of capacitor electrode structures comprise a metal component and a nitrogen component. The plurality of warping reduction structures comprise the metal component, the nitrogen component, and an oxygen component.Type: ApplicationFiled: December 9, 2024Publication date: April 3, 2025Inventors: Ting-Chen Hsu, Hsin-Li Cheng, Jyun-Ying Lin, Yingkit Felix Tsui, Shu-Hui Su, Shi-Min Wu
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Patent number: 12237288Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.Type: GrantFiled: August 9, 2023Date of Patent: February 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Shu Chia Hsu, Yu-Yun Huang, Wen-Yao Chang, Yu-Jen Cheng
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Publication number: 20250063743Abstract: Some implementations described herein provide techniques and apparatuses for an integrated circuit device including a trench capacitor structure that has a merged region. A material filling the merged region is different than a material that is included in electrode layers of the trench capacitor structure. Furthermore, the material filling the merged region includes a coefficient of thermal expansion and a modulus of elasticity that, in combination with the architecture of the trench capacitor structure, reduce thermally induced stresses and/or strains within the integrated circuit device relative to another integrated circuit device having a trench capacitor structure including a merged region and electrode layers of a same material.Type: ApplicationFiled: August 15, 2023Publication date: February 20, 2025Inventors: Shu-Hui SU, Hsin-Li CHENG, YingKit Felix TSUI, Tuo-Hsin CHIEN, Jyun-Ying LIN, Shi-Min WU, Yu-Chi CHANG, Ting-Chen HSU
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Publication number: 20250063744Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a substrate comprising first opposing sidewalls defining a first trench and second opposing sidewalls defining a second trench laterally offset from the first trench. A stack of layers comprises a plurality of conductive layers and a plurality of dielectric layers alternatingly stacked with the conductive layers. The stack of layers comprises a first segment in the first trench and a second segment in the second trench. A first lateral distance between the first segment and the second segment aligned with a first surface of the substrate is greater than a second lateral distance between the first segment and the second segment below the first surface of the substrate.Type: ApplicationFiled: November 7, 2024Publication date: February 20, 2025Inventors: Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu, Tuo-Hsin Chien, Felix Ying-Kit Tsui, Shi-Min Wu, Yu-Chi Chang
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Patent number: 11642632Abstract: Provided is a nanofiltration composite membrane, comprising: a supporting layer comprising a polyethylene terephthalate, a polymeric porous layer formed on the supporting layer, the polymeric porous layer comprising a polysulfone and an amphiphilic polymer represented by the formula below: and an interfacial polymerization layer formed on the polymeric porous layer and the interfacial polymerization layer comprising polyamide which is synthesized by polymerizing piperazine with 1,3,5-benzenetricarbonyl trichloride; wherein, n1, n2, n3, x, and y are integers greater than 0, the molecular weight of the amphiphilic polymer ranges from 90,000 to 200,000, and a weight ratio of the polysulfone to the amphiphilic polymer ranges from 2 to 20. The nanofiltration composite membrane can increase the removal rate of divalent ions and separate substances of specific molecular weights in solutions.Type: GrantFiled: November 13, 2020Date of Patent: May 9, 2023Assignee: NEW MICROPORE, INC.Inventors: Shu-Hui Cheng, Kai-Wei Chiou
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Publication number: 20220152564Abstract: Provided is a nanofiltration composite membrane, comprising: a supporting layer comprising a polyethylene terephthalate, a polymeric porous layer formed on the supporting layer, the polymeric porous layer comprising a polysulfone and an amphiphilic polymer represented by the formula below: and an interfacial polymerization layer formed on the polymeric porous layer and the interfacial polymerization layer comprising polyamide which is synthesized by polymerizing piperazine with 1,3,5-benzenetricarbonyl trichloride; wherein, n1, n2, n3, x, and y are integers greater than 0, the molecular weight of the amphiphilic polymer ranges from 90,000 to 200,000, and a weight ratio of the polysulfone to the amphiphilic polymer ranges from 2 to 20. The nanofiltration composite membrane can increase the removal rate of divalent ions and separate substances of specific molecular weights in solutions.Type: ApplicationFiled: November 13, 2020Publication date: May 19, 2022Inventors: Shu-Hui CHENG, Kai-Wei CHIOU
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Patent number: 10124301Abstract: The filtration material includes a supporting layer, a first selective layer disposed on the supporting layer, and a second selective layer disposed on the first selective layer. The first selective layer includes a polyimide and an ionic polymer intertwined with the polyimide. In particular, the polyimide includes at least one repeat unit having a structure represented by Formula (I) wherein A1 is A2 is R1 and R2 are independently —H, —CF3, —OH, —Br, —Cl, —F, C1-6 alkyl group, or C1-6 alkoxy group; and X and Y are independently single bond, —O—, —CH2—, —C(CH3)2—, or —NH—.Type: GrantFiled: July 18, 2016Date of Patent: November 13, 2018Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Rui-Xuan Dong, Shu-Hui Cheng, Jen-You Chu, Yin-Ju Yang, Yi-Chun Lo
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Publication number: 20170189865Abstract: The filtration material includes a supporting layer, a first selective layer disposed on the supporting layer, and a second selective layer disposed on the first selective layer. The first selective layer includes a polyimide and an ionic polymer intertwined with the polyimide. In particular, the polyimide includes at least one repeat unit having a structure represented by Formula (I) wherein A1 is A2 is R1 and R2 are independently —H, —CF3, —OH, —Br, —Cl, —F, C1-6 alkyl group, or C1-6 alkoxy group; and X and Y are independently single bond, —O—, —CH2—, —C(CH3)2—, or —NH—.Type: ApplicationFiled: July 18, 2016Publication date: July 6, 2017Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Rui-Xuan DONG, Shu-Hui CHENG, Jen-You CHU, Yin-Ju YANG, Yi-Chun LO
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Patent number: 9634308Abstract: A single layer structure of micron or nano fibers, and a multi-layer structure of micron and nano fibers. The single layer structure of micron fibers includes a web of micron fibers and an impregnating resin, and has a pore size of 1 nm-500 nm. The web of micron fibers is formed by plural interweaved micron fibers (D?1 ?m). The single layer structure of nano fibers includes a web of nano fibers formed by plural interweaved nano fibers (D<1 ?m). The multi-layer structure of micron and nano fibers includes a web of interweaved micron fibers, a web of nano fibers formed by plural nano fibers interweaved on the web of micron fibers, a mixture layer formed by parts of the interweaved nano and micron fibers, and a resin at least impregnating the mixture layer and parts of the micron fibers of the web of micron fibers.Type: GrantFiled: December 21, 2015Date of Patent: April 25, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wan-Shu Chen, Shu-Hui Cheng, Jung-Ching Hsing, Tzu-Hsien Han, Ming-Lung Lee
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Publication number: 20160111697Abstract: A single fiber layer structure of micron or nano fibers, and a multi-layer structure of micron and nano fibers are provided. The single fiber layer structure of micron fibers comprises a web of micron fibers and an impregnating resin, and has a pore size of 1 nm-500 nm. The web of micron fibers is formed by plural interweaved micron fibers (D?1 ?m). The single fiber layer structure of nano fibers comprises a web of nano fibers formed by plural interweaved nano fibers (D<1 ?m). The multi-layer structure of micron and nano fibers comprises a web of interweaved micron fibers, a web of nano fibers formed by plural nano fibers interweaved on the web of micron fibers, a mixture layer formed by parts of the interweaved nano and micron fibers, and a resin at least impregnating the mixture layer and parts of the micron fibers of the web of micron fibers.Type: ApplicationFiled: December 21, 2015Publication date: April 21, 2016Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wan-Shu CHEN, Shu-Hui CHENG, Jung-Ching HSING, Tzu-Hsien HAN, Ming-Lung LEE
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Patent number: 9287541Abstract: A single fiber layer structure of micron or nano fibers, and a multi-layer structure of micron and nano fibers are provided. The single fiber layer structure of micron fibers comprises a web of micron fibers and an impregnating resin, and has a pore size of 1 nm-500 nm. The web of micron fibers is formed by plural interweaved micron fibers (D?1 ?m). The single fiber layer structure of nano fibers comprises a web of nano fibers formed by plural interweaved nano fibers (D<1 ?m). The multi-layer structure of micron and nano fibers comprises a web of interweaved micron fibers, a web of nano fibers formed by plural nano fibers interweaved on the web of micron fibers, a mixture layer formed by parts of the interweaved nano and micron fibers, and a resin at least impregnating the mixture layer and parts of the micron fibers of the web of micron fibers.Type: GrantFiled: December 4, 2013Date of Patent: March 15, 2016Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wan-Shu Chen, Shu-Hui Cheng, Jung-Ching Hsing, Tzu-Hsien Han, Ming-Lung Lee
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Patent number: 9180649Abstract: Disclosed is a method to manufacture a carbon composite structure. First, a polymer nano fiber net is provided. The polymer nano fiber net is thermal oxidized to form an oxidized nano fiber net. The oxidized nano fiber net and an oxidized micro fiber net are stacked and impregnated in a resin. The resin is oxidized. Finally, the oxidized nano fiber net, the oxidized micro fiber net, and the oxidized resin are carbonized at a high temperature to form the carbon composite structure.Type: GrantFiled: July 12, 2012Date of Patent: November 10, 2015Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wan-Shu Chen, Tzu-Hsien Han, Shu-Hui Cheng
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Patent number: 8906339Abstract: The invention provides a high module carbon fiber and a fabrication method thereof. The high module carbon fiber includes the product fabricated by the following steps: subjecting a pre-oxidized carbon fiber to a microwave assisted graphitization process, wherein the pre-oxidized carbon fiber is heated to a graphitization temperature of 1000-3000° C. for 1-30 min. Further, the high module carbon fiber has a tensile strength of between 2.0-6.5 GPa and a module of between 200-650 GPa.Type: GrantFiled: May 29, 2010Date of Patent: December 9, 2014Assignee: Industrial Technology Research InstituteInventors: Chih-Yung Wang, I-Wen Liu, Jong-Pyng Chen, Shu-Hui Cheng, Syh-Yuh Cheng
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Publication number: 20140319047Abstract: The disclosure provides a filtration material and a method for fabricating the same. The filtration material includes a supporting layer, and a composite layer, wherein the composite layer includes an ionic polymer and an interfacial polymer. Particularly, the ionic polymer and the interfacial polymer are intertwined with each other, resulting from ionic bonds formed between the ionic polymer and the interfacial polymer.Type: ApplicationFiled: April 23, 2014Publication date: October 30, 2014Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Shu-Hui CHENG, Wei-Cheng TSAI, Shan-Shan LIN, Yu-Chuan HSU, Yin-Ju YANG
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Patent number: 8808597Abstract: A precursor raw material for the PAN-based carbon fibers represented by Formula (I) is provided. In Formula (I), R is methyl, ethyl or propyl, x+z=0.5-20.0 mol %, z?0.5 mol %, y=99.5-80.0 mol % and x+y+z=100 mol %. The invention also provides a PAN-based oxidized fiber and a PAN-based carbon fiber prepared by the precursor raw material for the PAN-based carbon fibers.Type: GrantFiled: December 28, 2010Date of Patent: August 19, 2014Assignee: Industrial Technology Research InstituteInventors: Tun-Fun Way, Jiun-Jy Chen, Yu-Ting Chen, Kai-Jen Hsiao, Shu-Hui Cheng, Jong-Pyng Chen
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Publication number: 20140162110Abstract: A single fiber layer structure of micron or nano fibers, and a multi-layer structure of micron and nano fibers are provided. The single fiber layer structure of micron fibers comprises a web of micron fibers and an impregnating resin, and has a pore size of 1 nm-500 nm. The web of micron fibers is formed by plural interweaved micron fibers (D?1 ?m). The single fiber layer structure of nano fibers comprises a web of nano fibers formed by plural interweaved nano fibers (D<1 ?m). The multi-layer structure of micron and nano fibers comprises a web of interweaved micron fibers, a web of nano fibers formed by plural nano fibers interweaved on the web of micron fibers, a mixture layer formed by parts of the interweaved nano and micron fibers, and a resin at least impregnating the mixture layer and parts of the micron fibers of the web of micron fibers.Type: ApplicationFiled: December 4, 2013Publication date: June 12, 2014Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wan-Shu CHEN, Shu-Hui CHENG, Jung-Ching HSING, Tzu-Hsien HAN, Ming-Lung LEE
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Patent number: 8567611Abstract: The invention discloses a filtration material for desalination, including a support layer, and a desalination layer formed on the support layer, wherein the desalination layer is a fiber composite membrane and includes at least one water-swellable polymer. The water-swellable polymer is made of hydrophilic monomers and hydrophobic monomers, and the hydrophilic monomers include ionic monomers and non-ionic monomers, and the ionic monomers include cationic monomers and anionic monomers.Type: GrantFiled: December 21, 2010Date of Patent: October 29, 2013Assignee: Industrial Technology Research InstituteInventors: Shu-Hui Cheng, Jong-Pyng Chen, En Kuang Wang, Yi-Chun Lo, Shan-Shan Lin
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Publication number: 20130171498Abstract: A method of fabricating a separator is provided. The method includes providing a porous non-woven substrate, and coating a first resin on the non-woven substrate, wherein the first resin includes hydrophilic oxyalkyl compounds, oxyalkyl polymers, oxyalkenyl alkyl polymers or derivatives thereof. The disclosure also provides a separator prepared by the method.Type: ApplicationFiled: August 8, 2012Publication date: July 4, 2013Inventors: Jung-Ching HSING, Tzu-Hsien Han, Shu-Hui Cheng, Wan-Shu Chen