Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: A medical intelligent device is for use with a medical jar. The medical jar defines an accommodating space for containing at least one medicine. The medication intelligent device includes a cover and an auxiliary medicine deliver. The cover is detachably mounted on the medical jar. The auxiliary medicine deliver is disposed on the cover and includes a main control chip and a medicine delivery gate electrically connected to the main control chip. The main control chip is used to move the gate between a closed position and an opened position relative to the cover. In the closed position, the medicine delivery gate closes the accommodating space. In the opened position, the medicine delivery gate opens the accommodating space.

Abstract: A portable biological microscopic image analysis system is suitable for analyzing a sample on a slide in real time, and the sample comes from an animal. The portable biological microscopic image analysis system includes a handheld electronic device and a microscope kit; the handheld electronic device includes an image capture unit, an image analysis module electrically connected to the image capture unit, and a real-time state analysis module electrically connected to the image analysis module; the microscope kit is detachably mounted on the handheld electronic device; wherein the image capture unit is used to obtain an image related to the sample through the microscope kit, the image analysis module is used to obtain cell information corresponding to the animal according to the image, and the real-time state analysis module is used to obtain state information corresponding to the animal according to the cell information.

Abstract: A medical intelligent device is for use with a medical jar. The medical jar defines an accommodating space for containing at least one medicine. The medication intelligent device includes a cover and an auxiliary medicine deliver. The cover is detachably mounted on the medical jar. The auxiliary medicine deliver is disposed on the cover and includes a main control chip and a medicine delivery gate electrically connected to the main control chip. The main control chip is used to move the gate between a closed position and an opened position relative to the cover. In the closed position, the medicine delivery gate closes the accommodating space. In the opened position, the medicine delivery gate opens the accommodating space.

Abstract: A portable biological microscopic image analysis system is suitable for analyzing a sample on a slide in real time, and the sample comes from an animal. The portable biological microscopic image analysis system includes a handheld electronic device and a microscope kit; the handheld electronic device includes an image capture unit, an image analysis module electrically connected to the image capture unit, and a real-time state analysis module electrically connected to the image analysis module; the microscope kit is detachably mounted on the handheld electronic device; wherein the image capture unit is used to obtain an image related to the sample through the microscope kit, the image analysis module is used to obtain cell information corresponding to the animal according to the image, and the real-time state analysis module is used to obtain state information corresponding to the animal according to the cell information.

Abstract: The present invention provides a method for swallow safety monitoring and a device thereof, which can monitor eating safety in real-time. By means of the real-time records of fundamental breath sound, the feeding safety for patients or weakness persons with dysphagia can be real-timely monitored and alarmed.

Abstract: A method for suppressing material warpage by means of a pressure difference comprises the following steps: a. preparing a plurality of carrier boards; b. preparing a plurality of carrier board pressing devices having an upper surface and a lower surface on which at least one air bag is provided; c. adjusting the processing chamber to be a working temperature and a working pressure, so that the carrier boards and the carrier board pressing devices placed therein are surrounded by the working temperature and the working pressure; d. effectively suppressing warpage of the carrier board by using a pressure difference between a first predetermined pressure in the air bag and the working pressure of the processing chamber. Thereby, production quality of carrier board is significantly improved, as well as the cost for production of which is effectively reduced.

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

Abstract: A method for suppressing material warpage by means of a pressure difference comprises the following steps: a. preparing a plurality of carrier boards; b. preparing a plurality of carrier board pressing devices having an upper surface and a lower surface on which at least one air bag is provided; c. adjusting the processing chamber to be a working temperature and a working pressure, so that the carrier boards and the carrier board pressing devices placed therein are surrounded by the working temperature and the working pressure; d. effectively suppressing warpage of the carrier board by using a pressure difference between a first predetermined pressure in the air bag and the working pressure of the processing chamber. Thereby, production quality of carrier board is significantly improved, as well as the cost for production of which is effectively reduced.

Abstract: Disclosed is a medicine box counter, which comprise a case body, comprising a bottom seat, an upper cap movably combined with the case body, and a plurality of resilient elements disposed between the bottom seat and the upper cap. As such, the medicine and the bottom seat are directly combined so that when the user exerts a pressure upon the upper cap in the use course, the resilient elements may be indirectly extruded and thus the bottom seat triggers the count mechanism to count, and after the pressure on the upper cap is released, the upper cap automatically restores to its original position by means of the resilient elements, whereby achieving the efficacies of rapid assembly, convenient use, effective medicine-taken count and reduced manufacturing cost are provided.

Abstract: Disclosed is a medicine box counter, which comprise a case body, comprising a bottom seat, an upper cap movably combined with the case body, and a plurality of resilient elements disposed between the bottom seat and the upper cap. As such, the medicine and the bottom seat are directly combined so that when the user exerts a pressure upon the upper cap in the use course, the resilient elements may be indirectly extruded and thus the bottom seat triggers the count mechanism to count, and after the pressure on the upper cap is released, the upper cap automatically restores to its original position by means of the resilient elements, whereby achieving the efficacies of rapid assembly, convenient use, effective medicine-taken count and reduced manufacturing cost are provided.

Abstract: A medication recording apparatus is used for motoring and recording patient's medication. The medication recording apparatus is coupled with a drug inhaler. When the patient receives a drug from the drug inhaler, a drug-supply actuation is generated. The medication recording apparatus has: a sensing module for sensing at least one type of the medication recording apparatus motion generated by the drug-supply actuation and sensing a motion data generated by the drug-supply actuation; a control and analysis module for determining if the medication recording apparatus motion is a valid medication according to the motion data and recording correct medication information corresponding to the correct medication. A medication recording method is also provided and used to analyze if the drug-supply actuation of the patient generates the valid medication and to record the correct medication information, so as to control the patient's medication status.

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

Abstract: The present invention provides a synchronous poultry feeding system, wherein a barrier member is configured through the feed conveying trough. The conveying trough comprises a trough and a fence configured above the trough. The fence is configured with a plurality of feeding openings. The outer edge of the barrier member is close to the inner wall of the trough and the fence. The barrier member can be controlled by the control device to be lifted or lowered inside the conveying trough. In this way, when the barrier member is not lifted, it can block the feed inside the trough, so that the poultry cannot stretch into the trough to eat, while when the barrier member is lifted to an appropriate height, the poultry can stretch from their respective feeding openings into the trough to eat.

Abstract: The present invention provides a synchronous poultry feeding system, wherein a barrier member is configured through the feed conveying trough. The conveying trough comprises a trough and a fence configured above the trough. The fence is configured with a plurality of feeding openings. The outer edge of the barrier member is close to the inner wall of the trough and the fence. The barrier member can be controlled by the control device to be lifted or lowered inside the conveying trough. In this way, when the barrier member is not lifted, it can block the feed inside the trough, so that the poultry cannot stretch into the trough to eat, while when the barrier member is lifted to an appropriate height, the poultry can stretch from their respective feeding openings into the trough to eat.

Abstract: In a method for removing bubbles from adhesive layer of semiconductor chip package, one or more semiconductor chips are attached to or stacked on a base plate using an adhesive material. The base plate is selected from a substrate, a lead frame, and other carrier for carrying the semiconductor chips thereon. Before the adhesive material starts curing or becomes fully cured, the base plate with the semiconductor chips is placed in a processing tank which is preset to heat at a predetermined heating rising rate to a predetermined temperature and to apply a predetermined pressure for a predetermined period of time, so that bubbles presented in the adhesive material, at an interface between the adhesive material and the base, and at an interface between the adhesive material and the semiconductor chip are expelled from the adhesive material under the temperature and pressure in the processing tank.

Abstract: A barrier for poultry troughs has a ridge bracket, two shutters and a holding device. The ridge bracket has two surfaces, a mounting edge and a connecting edge. The shutters are respectively mounted on the surfaces of the ridge bracket. The holding device is connected securely to the ridge bracket to allow the barrier to be raised and lowered over the poultry trough to prevent poultry from feeding from the trough whilst the troughs are being filled. Once filed the holding device is used to raise the barrier and expose feed to the poultry. When the barrier is lowered, the pivoting of the shutters prevents damage to poultry straddling the trough and automatically closes once the poultry have left the trough.

Abstract: In a method for removing bubbles from adhesive layer of semiconductor chip package, one or more semiconductor chips are attached to or stacked on a base plate using an adhesive material. The base plate is selected from a substrate, a lead frame, and other carrier for carrying the semiconductor chips thereon. Before the adhesive material starts curing or becomes fully cured, the base plate with the semiconductor chips is placed in a processing tank which is preset to heat at a predetermined heating rising rate to a predetermined temperature and to apply a predetermined pressure for a predetermined period of time, so that bubbles presented in the adhesive material, at an interface between the adhesive material and the base, and at an interface between the adhesive material and the semiconductor chip are expelled from the adhesive material under the temperature and pressure in the processing tank.