Abstract: A lighting fixture for an automobile instrument panel comprised of a backlight module; a light guide plate on the module; a light source and multiple semi-spherical grains on the guide plate sandwiched by a reflection plate and a diffusion plate; light being projected and evenly distributed on the light guide plate due to those grains; light intensity being increased by the reflection plate to be projected on the diffusion plate for the light to be evenly projected onto the instrument panel by light reflex and scattering to better illuminate the instrument panel.

Abstract: A method of metal-electro-plating for IC package substrate comprising the steps of: forming vias on the package substrate coated with copper film on both sides thereof; electro-plating the vias to form electrical conductive holes between the top layer and the bottom layer of the package substrate; coating a resisting agent where the patterns should be formed on the top layer and on the entire bottom layer of the package substrate; etching the pattern to form circuit without plating lines on the top layer of the substrate, and removing the resisting agent; coating with a resisting agent on the top side and the bottom side of the package substrate but the wiring position to be electro-plated as surface finish for wire-bonding electro-plating on the top side of the package substrate not being applied with the resisting agent; electro-plating the substrate with nickel and gold, and removing the resisting agent; fabricating the circuit on the bottom side of the package substrate and coating with a resisting agent