Abstract: A method of transferring a light-emitting element in a testing system includes transferring the light-emitting element to a predetermined position by a transferring component, and vacuuming the at least one vacuum hole to attract the light-emitting element. The predetermined position is spaced apart a distance from at least one vacuum hole, and the distance is greater than half of a width of the light-emitting element.

Abstract: A method for aligning an inhomogeneous receiver with an anisotropic emitter on a wafer probing system, wherein a reference semiconductor die comprising a reference pad and an anisotropic emitter is formed on a semiconductor wafer, the reference pad is located at a reference-pad-and-anisotropic-emitter relative position corresponding to the anisotropic emitter, the method comprises following steps of: measuring a receiver center position of an inhomogeneous receiver configured on a wafer probing system by a profile sensor; measuring a reference tip position of a reference tip of a reference probe on a probe card by a measuring instrument; displacing the inhomogeneous receiver in an aligning displacement according to the reference-pad-and-anisotropic-emitter relative position, the reference tip position and the receiver center position; and aligning the reference tip with the reference pad by a probe-tip-and-pad aligning machine of the wafer probing system.

Abstract: A coaxial probe structure, comprising: a support member, comprising a first connecting member; a connector, comprising a second connecting member; a coaxial probe, connecting with a connecting end of the coaxial probe to a bottom of the connector, and extending downwards from the bottom of the connector to a probe tip, and an included angle formed at a junction of the probe tip and the connecting end; and an elastic body connecting the support member with the junction of the connecting end and the probe tip of the coaxial probe.

Abstract: A method for aligning an inhomogeneous receiver with an anisotropic emitter on a wafer probing system, wherein a reference semiconductor die comprising a reference pad and an anisotropic emitter is formed on a semiconductor wafer, the reference pad is located at a reference-pad-and-anisotropic-emitter relative position corresponding to the anisotropic emitter, the method comprises following steps of: measuring a receiver center position of an inhomogeneous receiver configured on a wafer probing system by a profile sensor; measuring a reference tip position of a reference tip of a reference probe on a probe card by a measuring instrument; displacing the inhomogeneous receiver in an aligning displacement according to the reference-pad-and-anisotropic-emitter relative position, the reference tip position and the receiver center position; and aligning the reference tip with the reference pad by a probe-tip-and-pad aligning machine of the wafer probing system.

Abstract: A prober and methods using the prober for positioning a probe tip and for obtaining contact data of a probe and a polishing sheet. The prober comprises a probe card holder for holding a probe card having at least one probe, and each of the at least one probe having a probe tip; a force sensor, provided below the probe card holder, and having a sensing surface for being in contact with the probe tip; and at least one moving device, for moving the force sensor and the probe relatively in the direction toward each other, wherein, as the probe tip being in contact with the sensing surface, the force sensor sensing a force and producing a signal, so as to stop moving the force sensor and the probe relatively.

Abstract: A coaxial probe structure, comprising: a support member, comprising a first connecting member; a connector, comprising a second connecting member; a coaxial probe, connecting with a connecting end of the coaxial probe to a bottom of the connector, and extending downwards from the bottom of the connector to a probe tip, and an included angle formed at a junction of the probe tip and the connecting end; and an elastic body connecting the support member with the junction of the connecting end and the probe tip of the coaxial probe.

Abstract: A probe structure is disclosed which includes a metal needle, a soft insulative tube and a metal layer. The metal needle has a first end-portion and a second end-portion opposite to each other. The first end-portion has a tip. The soft insulative tube has a through hole in which the metal needle is partially inserted. The tip of the metal needle protrudes from the through hole. The metal layer is coated on the outer surface of the soft insulative tube and is electrically isolated from the metal needle; the thickness of the metal layer has a thickness no larger than 10 micrometers. Therefore, good resilience and signal integrity could coexist in the probe structure. A probe card including several above-mentioned probe structures and a method for manufacturing the above-mentioned probe structure are also disclosed.

Abstract: A thin wafer carrying device includes a laminated board made of layers of compound material so that the thin wafer is put on the circular board. The compound material includes reinforcement material and high-polymer resin. A metal film good in electric conductivity is coated to the compound material. The compound material has been used in printed circuit boards. The carrying device includes a plurality of tiny holes and a vacuum system located beneath the circular board. The thin wafer is attracted on the carrying device by the method of vacuum and is convenient to be tested, processed and transported.

Abstract: A thin wafer carrying device includes a laminated board made of layers of compound material so that the thin wafer is put on the circular board. The compound material includes reinforcement material and high-polymer resin. A metal film good in electric conductivity is coated to the compound material. The compound material has been used in printed circuit boards. The carrying device includes a plurality of tiny holes and a vacuum system located beneath the circular board. The thin wafer is attracted on the carrying device by the method of vacuum and is convenient to be tested, processed and transported.