Patents by Inventor Shu-Li Chen

Shu-Li Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978526
    Abstract: A data processing circuit and a fault mitigating method are provided. The method is adapted for a memory having at least one fault bit. The memory provides a block for data storage. A difference between an output of a value of a plurality of bits input to at least one computing layer in a neural network and a correct value is determined. The bits are respectively considered the at least one fault bit. A repair condition is determined based on the difference. The repair condition includes a correspondence between a position where the fault bit is located in the block and at least one non-fault bit in the memory. A value of at least one non-fault bit of the memory replaces a value of the fault bit based on the repair condition.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: May 7, 2024
    Assignee: Skymizer Taiwan Inc.
    Inventors: Shu-Ming Liu, Kai-Chiang Wu, Chien-Fa Chen, Wen Li Tang
  • Publication number: 20240097435
    Abstract: A bypass seamless switching apparatus and a method thereof are provided, in which a controller sends a first control signal to control or switch a first relay to on/off state, sends a second control signal to control or switch a second relay to on/off state, and sends a switch signal to control or switch a bypass switch module to on/off state. When the controller is in failure mode or is disconnected, a driving power supply of a bypass circuit provides a driving signal to the bypass switch module to maintain or switch a switch of the bypass switch module to on state, so that the bypass switch module is in short-circuit state or short-circuit protection state, and a bypass side voltage of the bypass switch module is equal to or close to zero voltage, so as to execute bypass function or bypass seamless switching function of the bypass switch module.
    Type: Application
    Filed: July 6, 2023
    Publication date: March 21, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Po-Li CHEN, Shu-Syuan HUANG
  • Patent number: 6644904
    Abstract: A wood screw to be used exclusively for fastening a wooden plate mainly has a screw shank helically disposed with squared threads, wherein a shaft flange is disposed at the bottom end of the screw shank to be parallel or slanted to the longitudinal axis of the screw shank between the upper and the bottom rims of the third and fourth threads. The shaft flange is in a convex trapezoid shape and is positioned vertically along the shank to make a pointed or planar cut so as to reduce friction for a smoother driving, an easier and labor-saving operation.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: November 11, 2003
    Inventors: Shu-Li Chen, Shiu-Mei Chen
  • Publication number: 20030118423
    Abstract: A screw structure to be used exclusively for fastening a wooden plate mainly has a screw shank helically disposed with squared threads, wherein a shaft flange is disposed at the bottom end of the screw shank to be parallel or slanted to the longitudinal axis of the screw shank between the upper and the bottom rims of the third and fourth threads; the shaft flange is in a convex trapezoid shape and is positioned vertically along the shank to make a pointed or planar cut so as to reduce friction for a smoother driving, an easier and labor-saving operation.
    Type: Application
    Filed: December 21, 2001
    Publication date: June 26, 2003
    Inventors: Shu-Li Chen, Shiu-Mei Chen
  • Patent number: 6396089
    Abstract: A semiconductor image sensor includes a bonding pad formed on a semiconductor substrate. An oxide layer is disposed over the semiconductor substrate to cover the bonding pad. A SOG is disposed on the oxide layer, a silicon-oxy-nitride layer is disposed on the SOG and a color filter is disposed thereon. By using the high transmittance of the SOG and the silicon-oxy-nitride layer, the blue light transmittance by the semiconductor image sensor is therefore enhanced.
    Type: Grant
    Filed: April 15, 1999
    Date of Patent: May 28, 2002
    Assignee: United Microelectronics Corp.
    Inventors: Shih-Yao Lin, Shu-Li Chen, Jeenh-Bang Yeh
  • Patent number: 6242730
    Abstract: A semiconductor image sensor includes a metal layer formed on a semiconductor substrate. An oxide layer is disposed over the semiconductor substrate to cover the metal layer. A SOG is disposed on the oxide layer, a color filter is disposed on the SOG and a silicon-oxy-nitride layer is disposed thereon. By using the high transmittance of the SOG and the silicon-oxy-nitride layer, the blue light transmittance by the semiconductor image sensor is therefore enhanced.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: June 5, 2001
    Assignee: United Microelectronics Corp.
    Inventors: Shih-Yao Lin, Shu-Li Chen, Jeenh-Bang Yeh, Yuan-Sheng Chiang
  • Patent number: D469007
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: January 21, 2003
    Inventors: Shiu-Mei Chen, Shu-Li Chen