Abstract: An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a first dielectric layer, a first conductive feature, a second dielectric layer, and a barrier layer. The first conductive feature is disposed on the first dielectric layer, the second dielectric layer is disposed on the first dielectric layer and surrounds the sidewalls of the first conductive feature, the barrier layer is disposed between the first dielectric layer and the second dielectric layer and between the sidewalls of the first conductive feature and the second dielectric layer.

Abstract: Chip packages and methods for forming the same are provided. The method includes providing a substrate having a chip region and a scribe-line region surrounding the chip region and forming a dielectric layer on an upper surface of the substrate. A dummy structure is formed in the dielectric layer over the scribe-line region of the substrate and extends along edges of the chip region. The dummy structure includes a first stack of dummy metal layers and a second stack of dummy metal layers arranged concentrically from the inside to the outside. The method also includes performing a sawing process on a portion of the dielectric layer that surrounds the dummy structure, so as to form a saw opening through the dielectric layer. At least the first stack of dummy metal layers remains in the dielectric layer after the sawing process is performed.

Abstract: A curable composition includes an epoxy monomer component and an aniline-based hardener. The epoxy monomer component is a first component formed from a first epoxy monomer represented by Formula (I), or a second component including the first epoxy monomer represented by Formula (I) and a second epoxy monomer different from the first epoxy monomer represented by Formula (I), wherein each of the substituents in Formula (I) is given the definitions as set forth in the Specification and Claims. Based on 100 wt % of the epoxy monomer component, an amount of the first epoxy monomer represented by Formula (I) is not smaller than 25 wt % and less than 100 wt % and an amount of the second epoxy monomer is greater than 0% and not greater than 75 wt %. A cured product formed from the curable composition, and a method for encapsulating a semiconductor device using the curable composition are also provided.

Abstract: Chip packages and methods for forming the same are provided. The method includes providing a substrate having upper and lower surfaces, and having a chip region and a scribe-line region surrounding the chip region. The substrate has a dielectric layer on its upper surface. A masking layer is formed over the substrate to cover the dielectric layer. The masking layer has a first opening exposing the dielectric layer and extending in the extending direction of the scribe-line region to surround the chip region. An etching process is performed on the dielectric layer directly below the first opening, to form a second opening that is in the dielectric layer directly below the first opening. The masking layer is removed to expose the dielectric layer having the second opening. A dicing process is performed on the substrate through the second opening.

Abstract: A moisture-permeable composite membrane is manufactured by the step of subjecting a mixture to a crosslinking treatment. The mixture contains a polyisoprene, a polyurethane with a polar functional group, a crosslinking agent, and a vulcanizing agent. In the mixture, a weight ratio of the polyurethane with the polar functional group to the polyisoprene ranges from 1:0.55 to 1:6.60. A method for manufacturing the moisture-permeable composite membrane is also provided.

Abstract: A complementary current-steering digital-to-analog converter (DAC) including a p-type DAC as well as an n-type DAC is shown. The p-type DAC has p-type current sources, and the n-type DAC has n-type current sources. The p-type and n-type current sources are coupled to a first input terminal or a second input terminal of a transimpedance amplifier (TIA) according to the digital input of the complementary current-steering DAC. In response to the digital input changing from a first value to a second value that is greater than the first value, one or more n-type current sources connected to the second input terminal of the TIA are switched so that they are connected to the first input terminal of the TIA.

Abstract: A circuit with a pseudo class-AB structure is shown. The circuit has an output stage, a first capacitor, and a first impedance component. The output stage has a first PMOS (p-type Metal-Oxide-Semiconductor Field-Effect Transistor) and a first NMOS (n-type MOSFET). The first connection node between the drain terminal of the first PMOS and the drain terminal of the first NMOS is coupled to the first output terminal of the circuit. The first capacitor is coupled between the gate terminal of the first PMOS and the gate terminal of the first NMOS. The first impedance component is coupled in parallel with the first capacitor between the gate terminal of the first PMOS and the gate terminal of the first NMOS.

Abstract: Disclosed is a differential amplifier including an input circuit, a detecting and controlling circuit, and an output circuit. The input circuit outputs input current to two output nodes according to the voltage of a differential input signal and the voltage of a bias node. The detecting and controlling circuit outputs compensative current to the two output nodes according to control bias voltage and the voltage of the bias node, in which the voltage of the bias node and the compensative current relate to the voltage of the differential input signal. The output circuit is coupled to the two output nodes and outputs a differential output signal according to the sum of the input current and the compensative current. Due to the detecting and controlling circuit outputting the compensative current, the differential amplifier prevents itself from entering a deadlock state even though the input current is insufficient or zero.

Abstract: Disclosed is a differential amplifier including an input circuit, a detecting and controlling circuit, and an output circuit. The input circuit outputs input current to two output nodes according to the voltage of a differential input signal and the voltage of a bias node. The detecting and controlling circuit outputs compensative current to the two output nodes according to control bias voltage and the voltage of the bias node, in which the voltage of the bias node and the compensative current relate to the voltage of the differential input signal. The output circuit is coupled to the two output nodes and outputs a differential output signal according to the sum of the input current and the compensative current. Due to the detecting and controlling circuit outputting the compensative current, the differential amplifier prevents itself from entering a deadlock state even though the input current is insufficient or zero.

Abstract: A method of treating a Th1-mediated disorder includes administering to a subject in need of the treatment an effective amount of a compound of the formula I: wherein R1 is H, alkyl, aryl, or cyclyl; R2 is pyranose; R3 is H or alkyl; m is 2, 3, 4, 5, or 6; n is 0, 1, 2, or 3; o is 0, 1, 2, 3, 4; p is 1, 2, 3, or 4; and the Th1-mediated disorder is non-obese diabetes, Crohn's colitis, autoimmune hemolytic anemia, rheumatoid arthritis, autoimmune encephalitis, multiple sclerosis, or autoimmune myocarditis. Also disclosed is a pharmaceutical composition including a compound of formula I above and a pharmaceutically acceptable carrier.

Abstract: Methods useful, for example, in identifying plant compositions that have immunomodulatory activity. Also disclosed is an Asteraceae plant immunomodulatory composition useful for increasing an immune response, e.g., IFN ? or IL-2 transcription.

Abstract: A method of treating a Th1-mediated disorder includes administering to a subject in need of the treatment an effective amount of a compound of the formula I: wherein R1 is H, alkyl, aryl, or cyclyl; R2 is pyranose; R3 is H or alkyl; m is 2, 3, 4, 5, or 6; n is 0, 1, 2, or 3; o is 0, 1, 2, 3, 4; p is 1, 2, 3, or 4; and the Th1-mediated disorder is non-obese diabetes, Crohn's colitis, autoimmune hemolytic anemia, rheumatoid arthritis, autoimmune encephalitis, multiple sclerosis, or autoimmune myocarditis. Also disclosed is a pharmaceutical composition including a compound of formula I above and a pharmaceutically acceptable carrier.

Abstract: A method for treating a bacterial infection in a subject by administration of an effective amount of centaurein alone or in combination with a bacteriocide. Also described is a composition containing an effective combined amount of centaurein and a bacteriocide useful for treating a bacterial infection in a subject.

Abstract: A compound of the formula: wherein R1 is H, alkyl, aryl, or cyclyl; R2 is pyranose; R3 is H or alkyl; m is 2, 3, 4, 5, or 6; n is 0, 1, 2, or 3; o is 0, 1, 2, 3, 4; and p is 1, 2, 3, or 4. Also disclosed is use of the compound to inhibit Th1 differentiation, promote Th2 differentiation, and treat certain disorders.

Abstract: A method for treating a bacterial infection in a subject by administration of an effective amount of centaurein alone or in combination with a bacteriocide. Also described is a composition containing an effective combined amount of centaurein and a bacteriocide useful for treating a bacterial infection in a subject.

Abstract: Methods useful, for example, in identifying plant compositions that have immunomodulatory activity. Also disclosed is an Asteraceae plant immunomodulatory composition useful for increasing an immune response, e.g., IFN ? or IL-2 transcription.