Abstract: The invention is a driving apparatus and circuit for efficiently converting a direct current (DC) signal into an alternating current (AC) signal to drive a fluorescent lamp. A semi class E configuration which utilizes only one transistor is employed in the invention. The invention comprises a power transistor, a transformer wherein a primary winding is used as a load for the power transistor and a secondary winding is used to transfer energy to the load for the driving apparatus, i.e. the CCFL tube, and control means which extracts the frequency and current of the power transistor and corrects the deviation between the frequency of the power transistor and that of the control means.

Abstract: This invention provides a magnetic shielding package structure of a magnetic memory device, in which at least a magnetic memory device is embedded between a magnetic shielding substrate and a magnetic shielding layer. A plurality of through vias is formed in the magnetic shielding substrate or the magnetic shielding layer, and a plurality of conductive contacts passes through the through vias such that electrical connection between the magnetic memory device and the external is established.

Abstract: This invention provides a substrate having at least one bottom electrode formed therein. A plurality of dice each having at least one opening formed therein are vertically stacked together one by one by a polymer insulating layer acting as an adhering layer between them, along with the openings thereof aligned to each other to form a through hole passing through said dice. The stacked dice are joined to a bottom of the substrate with the polymer insulating layer acting as an adhering layer, making the bottom electrode of the substrate contact the through hole. An electroplating process is performed with the bottom electrode serving as an electroplating electrode to form a conductive contact passing through the dice.

Abstract: This invention provides an image sensor module with a three-dimensional die-stacking structure. By filling a conductive material into through silicon vias within at least one image sensor die, and into via holes within an insulating layer, vertical electrical connections are formed between the image sensor die and an image processor buried in the insulating layer. A plurality of solder bumps is formed on a backside of the image sensor module so that the module can be directly assembled onto a circuit board. The image sensor module of this invention is characterized by a wafer-level packaging architecture and a three-dimensional die-stacking structure, which reduces electrical connection lengths within the module and thus reduces an area and height of the whole packaged module.

Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.

Abstract: An LCD (liquid crystal display) power supply includes an AC to DC converter circuit, a transformer, a DC to AC converter, and a feedback circuit. The AC to DC converter circuit couples an AC power supply to generate a DC signal. The DC to AC converter couples the DC signal to a primary side of the transformer and alternates polarities thereof so that an AC signal is generated on a secondary side of the transformer to supply for a load. The feedback circuit receives a first feedback signal indicative of power being supplied to the load and modulates the DC signal generated by the AC to DC converter circuit according to the first feedback signal.

Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.

Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.

Abstract: A wafer level package includes a substrate, a passivation layer, an elastic layer, a first insulation layer, a metal trace, a second insulation layer, and a bump. The passivation layer is formed on the substrate, and has one pad. The elastic layer is formed on the passivation layer. The first insulation layer is formed on the passivation layer and the elastic layer, and has a junction in contact with the pad. The metal trace is formed on the first insulation layer. The second insulation layer is formed on the metal trace, and a groove is formed correspondingly above the elastic layer. The bump is formed in the groove. An annular trench can be further formed around the bump. A groove can be furthermore formed in the first insulation layer correspondingly below the bump.

Abstract: A backlight module and a current providing circuit thereof are provided. The current providing circuit includes a signal generating unit, a switching unit, a first capacitor, a transformer and an output node. The signal generating unit generates a PWM signal according to a level of a power source. The switching unit determines whether a first signal end and a second signal end of the switching unit are conducted according to the PWM signal received by a control end of the switching unit. Following a switch performed by the switching unit, the first capacitor charges and discharges through a current path provided by a primary coil of the transformer. Thereby, a secondary coil of the transformer generates a corresponding AC voltage by sensing a current change in the primary coil and outputs the AC voltage through the output node.

Abstract: An HCG to HDL translation method, which can automatically generate VHDL codes. The method reads a hardware component graph (HCG) to find a start node and obtain a corresponding hardware component subgraph of the start node, analyzes all information of the start node to thereby add input and output components and generate a VHDL entity, determines types on all nodes of the hardware component, graph to thereby generate corresponding VHDL components and write associated information in a VHDL architecture, generates corresponding signal connections of VHDL components in accordance with edges of the hardware component graph, and outputs the VHDL entity and architecture to a file in a text form.

Abstract: A backlight driver circuit has a transformer, a switching circuit and a plurality of switch devices. The switching circuit couples a DC voltage to a primary side of the transformer and alternates polarities thereof so that an AC voltage is generated on a secondary side of the transformer to turn on the backlight blocks. The switch devices are respectively connected between one of the backlight blocks and the transformer, and the AC voltage turns the backlight blocks on when the switch devices are turned on.

Abstract: A power supply circuit for transforming a direct-current voltage into an alternating-current voltage for a light source is provided. The power supply circuit includes a drive circuit, a switch, a transformer and a capacitor. The switch has a control terminal coupled to the drive circuit and a ground terminal coupled to a ground. The transformer has a primary side and a secondary side, and a winding on the primary side is coupled between the direct-current voltage and a signal terminal of the switch to generate the alternating-current voltage on the secondary side. The capacitor is coupled between the ground terminal and the signal terminal of the switch.

Abstract: A packaging structure with protective layers and a packaging method thereof are provided. A protective layer is formed on the surface and the pre-dicing line of the wafer to protect the chip and the die during the wafer grinding process, so as to prevent the wafer from being damaged due to the collision during the transportation process, and thereby reinforcing the mechanical strength of the wafer and the chip, which is useful for the subsequent packaging process.

Abstract: A wafer level chip scale packaging structure and the method of fabricating the same are disclosed to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the PCB is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the adjacent layers will peel or the sacrificial layer material will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.

Abstract: The invention is a driving apparatus and circuit for efficiently converting a direct current (DC) signal into an alternating current (AC) signal to drive a fluorescent lamp. A semi class E configuration which utilizes only one transistor is employed in the invention. The invention comprises a power transistor, a transformer wherein a primary winding is used as a load for the power transistor and a secondary winding is used to transfer energy to the load for the driving apparatus, i.e. the CCFL tube, and control means which extracts the frequency and current of the power transistor and corrects the deviation between the frequency of the power transistor and that of the control means.

Abstract: An image-displaying control circuit used in a scan-backlight LCD is disclosed. The image-displaying control circuit comprises a driver control circuit, a plurality of gate driver groups, a backlight control circuit and a plurality of backlight driver groups. Each of the gate driver groups is used to drive one of the display blocks, and the driver control circuit outputs a gate sequence signal to the gate driver groups. The gate drive groups can respectively drive the display blocks in a driving sequence according to the gate sequence signal. The backlight driver groups controlled by the backlight control circuit are respectively used to turn on one of the backlight blocks, and the driver control circuit outputs a backlight sequence signal to the backlight control circuit. Then, the backlight control circuit can control the backlight driver groups to respectively turn on the backlight blocks in the same driving sequence as the display blocks.

Abstract: A power control apparatus and method for an optical drive is disclosed. The power control apparatus estimates the temperature rising effect of a laser diode and performs a partial open-loop power control, achieving accurate write power control. Therefore, regarding to a high-speed, high-density optical disk recording medium combined with multi-pulse write waveforms, the invention can also achieve accurate write power control even though the response speed of a front photodiode is much slower than the modulation speed of recording pulses of the laser diode.

Abstract: A backlight driver circuit has a transformer, a switching circuit and a plurality of switch devices. The switching circuit couples a DC voltage to a primary side of the transformer and alternates polarities thereof so that an AC voltage is generated on a secondary side of the transformer to turn on the backlight blocks. The switch devices are respectively connected between one of the backlight blocks and the transformer, and the AC voltage turns the backlight blocks on when the switch devices are turned on.

Abstract: A process of automatically translating a high level programming language into an extended activity diagram (EAD), which can translate source codes coded by the high level programming language into a corresponding activity diagram (AD) before the high level language is translated into a hardware description language (HDL). The process adds a new translation rule in a compiler and modifies the AD specification of a unified modeling language (UML) to accordingly translate the source codes into the AD and present the programming logic and executing flow of the source codes in a visualization form. In addition, the process can translate the high level programming language into a unified format for representation, and the AD can benefit simulation and requirement in a following HDL translation.