Patents by Inventor Shu-Ni Yi

Shu-Ni Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9773084
    Abstract: A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: September 26, 2017
    Assignee: ScienBiziP Consulting(Shenzhen)Co., Ltd.
    Inventors: Wan-Li Ning, Li-Ren Fu, Yu Han, Jun-Hui Wang, Al-Ling He, He Feng, Kun Li, Shu-Ni Yi, Lei Liu, An-Gang Liang, Ping-Chuan Deng, Ming-Yu Liu, Xia-Bing Gao, Han-Bing Zhang, Zheng-Heng Sun
  • Patent number: 9049802
    Abstract: An apparatus includes a server cabinet configured to receive a plurality of servers therein, and a single heat dissipation device mounted on the server cabinet and positioned outside of the plurality of servers. The heat dissipation device includes a plurality of fans, and each of the plurality of fans is configured to dissipate heat generated in the overall server cabinet.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: June 2, 2015
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Shu-Ni Yi, Hung-Yi Wu
  • Publication number: 20150006139
    Abstract: A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.
    Type: Application
    Filed: June 25, 2014
    Publication date: January 1, 2015
    Inventors: WAN-LI NING, LI-REN FU, YU HAN, JUN-HUI WANG, AI-LING HE, HE FENG, KUN LI, SHU-NI YI, LEI LIU, AN-GANG LIANG, PING-CHUAN DENG, MING-YU LIU, XIA-BING GAO, HAN-BING ZHANG, ZHENG-HENG SUN
  • Publication number: 20130321997
    Abstract: A server includes a chassis, a switch cable received in the chassis, and a power cord located out of the chassis. Interfaces for connecting data lines are attached to a front plate of the chassis. A power interface is attached to a rear plate of the chassis. The switch cable includes a first connector and a second connector at opposite ends of the switch cable. The first connector is connected to the power interface. The second connector is fastened to the front plate of the chassis. The power cord is connected to the second connector.
    Type: Application
    Filed: June 22, 2012
    Publication date: December 5, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD.
    Inventor: Shu-Ni YI
  • Publication number: 20130321998
    Abstract: A protection cover for a connector includes a non-conductive installing block. The installation block defines a number of positioning holes and a receiving slot. Some pins of the connector are inserted into the positioning holes, and other pins of the connector are received in the receiving slot.
    Type: Application
    Filed: June 22, 2012
    Publication date: December 5, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: YU HAN, LEI LIU, SHU-NI YI, KUN LI, ZHENG-HENG SUN
  • Publication number: 20130258591
    Abstract: An electronic device includes an air dam module. The air dam module includes a frame and a rotating member. The frame defines a vent. The rotating member is received in the vent and includes a pivot rotatably connected to midpoints of opposite sides of the frame, a first shield plate extending up from a top side of the pivot, to vertically block an upper half of the vent. In addition, a second shield plate heavier than the first shield plate and extending down from a bottom side of the pivot, to vertically block a lower half of the vent by gravity.
    Type: Application
    Filed: August 2, 2012
    Publication date: October 3, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO.. LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: ZHENG-HENG SUN, LEI LIU, SHU-NI YI, PING-CHUAN DENG
  • Publication number: 20130242503
    Abstract: An apparatus includes a server cabinet configured to receive a plurality of servers therein, and a single heat dissipation device mounted on the server cabinet and positioned outside of the plurality of servers. The heat dissipation device includes a plurality of fans, and each of the plurality of fans is configured to dissipate heat generated in the overall server cabinet.
    Type: Application
    Filed: November 13, 2012
    Publication date: September 19, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: SHU-NI YI, HUNG-YI WU
  • Patent number: 8323052
    Abstract: A connector assembly includes a connector and two screws. The connector includes a main body, a cable connected to a rear side of the main body, and a connection portion protruding from a front side of the main body. Two threaded holes are defined in opposite ends of the main body, respectively. Two resilient fixing portions protrude from the rear side of the main body. A through hole is defined in each of the fixing portions. The screws are detachably received into the corresponding through holes of the fixing portions, and operable to mount the connector to an object by extending through the threaded holes to engage with the object.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: December 4, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zheng-Heng Sun, Li-Ren Fu, Jun-Hui Wang, Ai-Ling He, Han-Bing Zhang, Jun He, An-Gang Liang, Lei Liu, Shu-Ni Yi, Ping-Chuan Deng, Lin Du
  • Publication number: 20120231659
    Abstract: A connector assembly includes a connector and two screws. The connector includes a main body, a cable connected to a rear side of the main body, and a connection portion protruding from a front side of the main body. Two threaded holes are defined in opposite ends of the main body, respectively. Two resilient fixing portions protrude from the rear side of the main body. A through hole is defined in each of the fixing portions. The screws are detachably received into the corresponding through holes of the fixing portions, and operable to mount the connector to an object by extending through the threaded holes to engage with the object.
    Type: Application
    Filed: May 25, 2011
    Publication date: September 13, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: ZHENG-HENG SUN, LI-REN FU, JUN-HUI WANG, AI-LING HE, HAN-BING ZHANG, JUN HE, AN-GANG LIANG, LEI LIU, SHU-NI YI, PING-CHUAN DENG, LIN DU
  • Patent number: 8254119
    Abstract: A computer includes a monitor and a host computer coupled to a monitor. The monitor includes a back cover and a plurality of sides extending forwards form the back cover. The host computer includes a computer enclosure and a plurality electronic element. The computer enclosure includes a bottom board and a plurality of sideboard extending forward from the bottom board to abut against the plurality of sides of the monitor. A receiving space is formed between the back cover of the monitor and the bottom board of the computer enclosure. The number of electronic elements are received in the receiving space and mounted on the bottom board of the computer enclosure.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: August 28, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Shu-Ni Yi, Lei Liu
  • Publication number: 20110110025
    Abstract: A computer includes a monitor and a host computer coupled to a monitor. The monitor includes a back cover and a plurality of sides extending forwards form the back cover. The host computer includes a computer enclosure and a plurality electronic element. The computer enclosure includes a bottom board and a plurality of sideboard extending forward from the bottom board to abut against the plurality of sides of the monitor. A receiving space is formed between the back cover of the monitor and the bottom board of the computer enclosure. The number of electronic elements are received in the receiving space and mounted on the bottom board of the computer enclosure.
    Type: Application
    Filed: January 28, 2010
    Publication date: May 12, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD ., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHU-NI YI, LEI LIU
  • Publication number: 20100328873
    Abstract: A monitor comprises a back cover defining a depressed portion to receive a hard disk, a motherboard, and a power supply. The depressed portion comprises a bottom board and a side wall connected between the bottom board and a baseboard of the back cover. An opening corresponding to a plurality of input/output interfaces of the motherboard is defined in the side wall of the depressed portion.
    Type: Application
    Filed: August 20, 2009
    Publication date: December 30, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Lei Liu, Shu-Ni Yi