Patents by Inventor Shu Okasaka

Shu Okasaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11765872
    Abstract: A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 ?m or more and 30 ?m or less.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: September 19, 2023
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Yuki Ochiai, Shunsuke Mochizuki, Shu Okasaka
  • Publication number: 20230045717
    Abstract: A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 ?m or more and 30 ?m or less.
    Type: Application
    Filed: November 19, 2020
    Publication date: February 9, 2023
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Yuki Ochiai, Shunsuke Mochizuki, Shu Okasaka
  • Publication number: 20220380563
    Abstract: A structure (piping part (121)) has a cured product of a thermosetting resin composition (resin molded body (101)) and a plating layer (103) formed on a surface of the cured product, in which the plating layer (103) has a Cu layer (second plating layer (107)) and a thickness of the Cu layer (second plating layer (107)) is 2 ?m or more and 50 ?m or less.
    Type: Application
    Filed: November 19, 2020
    Publication date: December 1, 2022
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Yuki Ochiai, Shunsuke Mochizuki, Shu Okasaka
  • Publication number: 20220082061
    Abstract: An engine block (10) includes a cylinder liner (120) and a resin block (200). The cylinder liner (120) has a metal outer circumferential surface (122). The resin block (200) includes a first portion (210) and a gap (230). The first portion (210) covers the metal outer circumferential surface (122) of the cylinder liner (120). The gap (230) is positioned outside the first portion (210) and defines a water jacket (232).
    Type: Application
    Filed: January 8, 2020
    Publication date: March 17, 2022
    Applicants: SUMITOMO BAKELITE CO., LTD., NAGOYA ELECTRICAL EDUCATIONAL FOUNDATION
    Inventors: Shu Okasaka, Toshio Fujimura
  • Patent number: 10473104
    Abstract: A water pump has a pump housing (2) having therein a pump chamber (3); a drive shaft (7) rotatably supported in the pump housing (2); a pulley (5) having a flange wall (5a) fixed to one end portion of the drive shaft (7), the pulley (5) being formed integrally with the drive shaft (7) with synthetic resin material containing glass fiber material (25); and an impeller (8) secured to the other end portion of the drive shaft (7) so as to be able to rotate integrally with the drive shaft (7), the impeller (8) being accommodated in the pump chamber (3). Six penetration holes (23) are formed at the flange wall (5a), and the glass fiber material (25) existing around the penetration hole (23) is oriented at random. With this, decrease in strength of the pulley (5) can be suppressed.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: November 12, 2019
    Assignees: HITACHI AUTOMOTIVE SYSTEMS, LTD., SUMITOMO BAKELITE CO., LTD.
    Inventors: Yusuke Furusawa, Hideaki Nakamura, Hisanori Sakuma, Shu Okasaka
  • Patent number: 10072647
    Abstract: A housing (10) of a compressor (1) according to the present embodiment includes at least one compression chamber (101) that compresses a gas aspirated into the inside thereof and is composed of a metal-resin composite (16) in which a resin member (14) composed of a thermosetting resin composition and a metal member (12) are bonded to each other.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: September 11, 2018
    Assignee: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Shu Okasaka, Shinya Yamamoto
  • Publication number: 20170030343
    Abstract: A housing (10) of a compressor (1) according to the present embodiment includes at least one compression chamber (101) that compresses a gas aspirated into the inside thereof and is composed of a metal-resin composite (16) in which a resin member (14) composed of a thermosetting resin composition and a metal member (12) are bonded to each other.
    Type: Application
    Filed: April 1, 2015
    Publication date: February 2, 2017
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shu Okasaka, Shinya Yamamoto
  • Publication number: 20150366054
    Abstract: A metal foil-clad substrate used for forming a circuit board mounting and electrically connecting an electronic component is provided. The metal foil-clad substrate includes a metal foil having a one surface, a resin layer formed on the one surface of the metal foil; an insulating part formed on a surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin. The resin layer is constituted of a cured material or solidified material of a second resin composition containing a resin material.
    Type: Application
    Filed: June 8, 2015
    Publication date: December 17, 2015
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shu Okasaka, Toshio Komiyatani, Koji Koizumi, Takayuki Baba
  • Publication number: 20150366047
    Abstract: A metal foil-clad substrate used for forming a circuit board mounting and electrically connecting a heat element is provided. The metal foil-clad substrate includes: a metal foil having one surface; a resin layer formed on the one surface of the metal foil; a heat radiation metal plate formed on a surface of the resin layer opposite to the metal foil; an insulating part formed on the surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin. The resin layer is constituted of a cured material or a solidified material of a second resin composition containing a resin material.
    Type: Application
    Filed: June 5, 2015
    Publication date: December 17, 2015
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shu Okasaka, Toshio Komiyatani, Koji Koizumi, Takayuki Baba