Abstract: An integrated lithography equipment is disclosed. The equipment includes an input/output area for loading at least one wafer, a coating a developing area for performing coating and developing processes on the wafer, an exposure processing area for exposing the wafer, and an idle and transport area disposed between the coating and developing area and the exposure processing area for isothermally or adiabatically transferring wafers between the coating and developing area and the exposure processing area and holding wafers isothermally or adiabatically.

Abstract: A semiconductor device having assist features and manufacturing method thereof includes a substrate having at least an active region and a peripheral region defined thereon. The semiconductor device also includes a plurality of assist features positioned in the peripheral region, or in the active region with a dotted line pattern. The assist features are electrically connected to active circuits formed in the active region, respectively, for serving as redundant circuits that repair or replace defective circuits.