Patents by Inventor Shu-Ping Hsu

Shu-Ping Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11479027
    Abstract: A photosensitive electrically conductive structure includes: a substrate; a releasing photosensitizing resin layer disposed on the substrate; a nano silver layer disposed on the releasing photosensitizing resin layer; and a photosensitive electrically conductive layer disposed on an edge of the nano silver layer. A visible region is defined in the photosensitive electrically conductive structure where the nano silver layer is not covered by the photosensitive electrically conductive layer and a peripheral wiring region is defined in the photosensitive electrically conductive structure where the nano silver layer is covered by the photosensitive electrically conductive layer. The releasing photosensitizing resin layer has an average molecular weight (Mn) greater than 3,000 but less than 100,000, and the releasing photosensitizing resin layer, the nano silver layer, and the photosensitive electrically conductive layer are patterned.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: October 25, 2022
    Assignee: Cambrios Film Solutions Corporation
    Inventors: Chung-Chin Hsiao, Siou-Cheng Lien, Chia-Yang Tsai, Shu-Ping Hsu
  • Publication number: 20220088909
    Abstract: A photosensitive electrically conductive structure includes: a substrate; a releasing photosensitizing resin layer disposed on the substrate; a nano silver layer disposed on the releasing photosensitizing resin layer; and a photosensitive electrically conductive layer disposed on an edge of the nano silver layer. A visible region is defined in the photosensitive electrically conductive structure where the nano silver layer is not covered by the photosensitive electrically conductive layer and a peripheral wiring region is defined in the photosensitive electrically conductive structure where the nano silver layer is covered by the photosensitive electrically conductive layer. The releasing photosensitizing resin layer has an average molecular weight (Mn) greater than 3,000 but less than 100,000, and the releasing photosensitizing resin layer, the nano silver layer, and the photosensitive electrically conductive layer are patterned.
    Type: Application
    Filed: September 24, 2020
    Publication date: March 24, 2022
    Inventors: Chung-Chin Hsiao, Siou-Cheng Lien, Chia-Yang Tsai, Shu-Ping Hsu
  • Patent number: 10963118
    Abstract: An electrode structure and a touch panel including the electrode structure are provided. The electrode structure includes a membrane layer and a metallic nanowires layer having metallic nanowires. A first portion of the metallic nanowires layer is covered by the membrane layer, and a second portion of the metallic nanowires layer is exposed out of the membrane layer. The membrane layer is made of a copolymer formed by mixing two or more materials having different functional groups.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: March 30, 2021
    Assignee: Cambrios Film Solutions Corporation
    Inventors: Chung-Chin Hsiao, Siou-Cheng Lien, Chia-Yang Tsai, Yi-Wen Chiu, Shu-Ping Hsu
  • Publication number: 20200272263
    Abstract: An electrode structure and a touch panel including the electrode structure are provided. The electrode structure includes a membrane layer and a metallic nanowires layer having metallic nanowires. A first portion of the metallic nanowires layer is covered by the membrane layer, and a second portion of the metallic nanowires layer is exposed out of the membrane layer. The membrane layer is made of a copolymer formed by mixing two or more materials having different functional groups.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 27, 2020
    Inventors: Chung-Chin HSIAO, Siou-Cheng LIEN, Chia-Yang TSAI, Yi-Wen CHIU, Shu-Ping HSU
  • Patent number: 7602471
    Abstract: The present disclosure provides an immersion lithography system. The system includes an imaging lens having a front surface; a substrate stage positioned underlying the front surface of the imaging lens; an immersion fluid retaining structure having a fluid inlet and a fluid outlet, configured to hold a fluid from the fluid inlet, at least partially filling a space between the front surface and a substrate on the substrate stage, and flowing the fluid out through the fluid outlet; and a particle monitor module integrated with the immersion fluid retaining structure.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: October 13, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzung Chi Fu, Shu-Ping Hsu, Hsiu-Yu Chang
  • Patent number: 7430235
    Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: September 30, 2008
    Assignee: Mediatek Inc.
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
  • Publication number: 20070268469
    Abstract: The present disclosure provides an immersion lithography system. The system includes an imaging lens having a front surface; a substrate stage positioned underlying the front surface of the imaging lens; an immersion fluid retaining structure having a fluid inlet and a fluid outlet, configured to hold a fluid from the fluid inlet, at least partially filling a space between the front surface and a substrate on the substrate stage, and flowing the fluid out through the fluid outlet; and a particle monitor module integrated with the immersion fluid retaining structure.
    Type: Application
    Filed: May 17, 2006
    Publication date: November 22, 2007
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tzung Chi Fu, Shu-Ping Hsu, H.Y. Chang
  • Patent number: 7088789
    Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: August 8, 2006
    Assignee: Mediatek Inc.
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
  • Publication number: 20060126758
    Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.
    Type: Application
    Filed: February 8, 2006
    Publication date: June 15, 2006
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
  • Publication number: 20040013179
    Abstract: An apparatus for providing a multi-mode interface between a baseband transmitter and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a digital-to-analog converter, a single-ended-to-differential converter and a voltage-to-current converter. The digital-to-analog converter receives the digital signal from a baseband processor and converts the digital signal into a single-ended voltage signal. The single-ended-to-differential converter receives the single-ended voltage signal and converts it into a pair of differential voltage signals. Further, the voltage-to-current converter receives the pair of differential voltage signals and converts the voltage signal pair into a pair of differential current signals. Thus, the digital signal, the single-ended voltage signal, the differential voltage signal pair and the differential current signal pair together form the multi-mode interface to the RF circuitry.
    Type: Application
    Filed: November 18, 2002
    Publication date: January 22, 2004
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
  • Publication number: 20040013181
    Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.
    Type: Application
    Filed: November 18, 2002
    Publication date: January 22, 2004
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu