Abstract: An electrothermal module includes a first conductive layer, a second conductive layer, and a heat generating layer. The first conductive layer and the second conductive layer respectively include silver metal. The heat generating layer has a first portion, the first portion is disposed between the first conductive layer and the second conductive layer to form an electrothermal conversion portion of the electrothermal module, and the heat generating layer includes a conductive carbon material.

Abstract: A semiconductor device includes a package structure, a first heat spreader, and a second heat spreader. The first heat spreader is aside the package structure. The second heat spreader is in physical contact with the first heat spreader. The second heat spreader covers a top surface and sidewalls of the package structure. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: A microscope device for observing a sample. The microscope device and the sample are located on an optical route. The microscope device includes an objective lens unit and an additional light source set. The light source set includes a circuit substrate, a battery and a light-emitting unit. The circuit substrate has a power source portion and a light source portion electrically connected to the power source portion. A connecting member and the battery are arranged at opposite sides of the power source portion. The light-emitting unit is arranged on the light source portion, and the distance between the light-emitting unit and the center axis of the optical route is greater than the radius of the objective lens unit. The battery activates the light-emitting unit to generate a light beam, and the light beam irradiates toward the center axis of the optical route.

Abstract: A method includes bonding a first package component over a second package component. The second package component includes a plurality of dielectric layers, and a plurality of redistribution lines in the plurality of dielectric layers. The method further includes dispensing a stress absorber on the second package component, curing the stress absorber, and forming an encapsulant on the second package component and the stress absorber.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.

Abstract: A semiconductor device includes a substrate, a package structure, a first heat spreader, and a second heat spreader. The package structure is disposed on the substrate. The first heat spreader is disposed on the substrate. The first heat spreader surrounds the package structure. The second heat spreader is disposed on the package structure. The second heat spreader is connected to the first heat spreader. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: A portable microscope apparatus operated with an image capture device includes a sample carrying module, a lens module, a first polarizer and a second polarizer. The sample carrying module includes a transparent carrier and a sample adhesive element including a substrate and a glue layer. The substrate has a concave portion and an extending portion. The concave portion is adjacently connected to the extending portion to form a first surface. The glue layer is at least partially disposed on the first surface and in an integrated form with the substrate. The lens module is detachably connected to the image capture device, and disposed between the sample carrying module and the image capture device. The first polarizer is disposed on an optical path on one side of the sample carrying module. The second polarizer is disposed on the optical path on the other side of the sample carrying module.

Abstract: The present invention discloses a portable microscope device which can be installed on the smartphone capable of capturing image. By combing these devices, users can observe the detection sample and capture the image of the sample instantly without environment limitation. Moreover, during operation, the user can observe the whole image of the sample by substituting the microscope lens of different magnification ratio or by shifting the position of the sample.

Abstract: A microscope apparatus includes a sample carrying module, a light source module and a lens module. The sample carrying module includes an adhesive element and a body having a light-transmission region and a sample viewing surface. The adhesive element is detachably adhered to the body, and at least partially covers the light-transmission region, such that the adhesive element is disposed adjacent to the sample viewing surface. The light source module is detachably disposed at a side of the body, and includes a base and a light source. The base has an aperture, and the sample carrying module is detachably disposed at a side of the aperture. The light source is disposed in the base. The lens module includes at least one lens, which is detachably disposed at one side of the sample carrying module and substantially focuses at the sample viewing surface, and corresponds to the light source module.

Abstract: A reflecting microscope module cooperating with an image capturing module includes a housing, a lens and a sample adhesive substance. The housing has a sample inspecting surface located on one side of the housing opposite to the image capturing module. The lens is disposed in the housing and the sample adhesive substance is detachably disposed on a bottom of the housing. The sample adhesive substance adjacently connected to the sample inspecting surface includes a substrate and a glue layer. The glue layer is integrally combined with the substrate to form one piece. A reflecting microscope device is also disclosed.

Abstract: A microscope module, which is cooperated with an image capturing module, includes a housing, a convex lens and an illumination assembly. The housing has a sample inspecting surface located on one side of the housing, which is opposite to the image capturing module. The convex lens is disposed in the housing, and the shortest distance between the sample inspecting surface and the convex lens ranges from 0.1 mm to 3.0 mm. The illumination assembly has a light source and is located between the image capturing module and the convex lens. The light emitted from the light source enters the convex lens through an input surface of the convex lens, leaves the convex lens through an output surface of the convex lens, and then reaches the sample inspecting surface. A microscope device containing the microscope module is also disclosed.

Abstract: A microscope module includes a light source assembly, a sampling assembly and a diffusing element. The light source assembly includes a light source and a light guide element. The light source is disposed close to the light incidence end of the light guide element. The sampling assembly includes a cover and a base. The cover and the base are combined to define a sample accommodating space, which is located at the light exit end of the light guide element. The diffusing element is disposed between the light source and the sample accommodating space. The light emitted from the light source passes through the diffusing element and then enters the sample accommodating space. A microscope device containing the microscope module is also disclosed.

Abstract: An optical viewing device includes a first assembly and a second assembly. The first assembly includes a first body and a light source. The second assembly includes a second body, a convex lens and an image capturing module. The first body has a first connecting portion and a light output hole, and the first connecting portion is disposed on at least one side of the light output hole. The light source is disposed within the first body. The second body has a second connecting portion, which is disposed corresponding to the first connecting portion. The convex lens and the image capturing module are disposed within the second body, and the light outputted from the light output hole passes through the convex lens and then enters the image capturing module. The first connecting portion and the second connecting portion are connected with each other to form a chamber.

Abstract: A reflecting microscope module cooperating with an image capturing module includes a housing, a lens and a sample adhesive substance. The housing has a sample inspecting surface located on one side of the housing opposite to the image capturing module. The lens is disposed in the housing and the sample adhesive substance is detachably disposed on a bottom of the housing. The sample adhesive substance adjacently connected to the sample inspecting surface includes a substrate and a glue layer. The glue layer is integrally combined with the substrate to form one piece. A reflecting microscope device is also disclosed.

Abstract: A portable microscope apparatus operated with an image capture device includes a sample carrying module, a lens module, a first polarizer and a second polarizer. The sample carrying module includes a transparent carrier and a sample adhesive element including a substrate and a glue layer. The substrate has a concave portion and an extending portion. The concave portion is adjacently connected to the extending portion to form a first surface. The glue layer is at least partially disposed on the first surface and in an integrated form with the substrate. The lens module is detachably connected to the image capture device, and disposed between the sample carrying module and the image capture device. The first polarizer is disposed on an optical path on one side of the sample carrying module. The second polarizer is disposed on the optical path on the other side of the sample carrying module.

Abstract: A sample detecting device is used in cooperation with an image capturing device. The sample detecting device includes a first assembly and a second assembly. The first assembly includes a light emitting unit and a light-permeable unit. The light-permeable unit is disposed at one side of the light emitting unit. The first assembly and the second assembly match and connect with each other to form a sample containing space. The second assembly includes a body and a convex lens. The body has a first cavity portion and a second cavity portion. The light-permeable unit is disposed in the first cavity portion, and the convex lens is disposed in the second cavity portion. The light emitted from the light emitting unit sequentially passes through the light-permeable unit and the convex lens and leaves the body.

Abstract: A microscope apparatus includes a sample carrying module, a light source module and a lens module. The sample carrying module includes an adhesive element and a body having a light-transmission region and a sample viewing surface. The adhesive element is detachably adhered to the body, and at least partially covers the light-transmission region, such that the adhesive element is disposed adjacent to the sample viewing surface. The light source module is detachably disposed at a side of the body, and includes a base and a light source. The base has an aperture, and the sample carrying module is detachably disposed at a side of the aperture. The light source is disposed in the base. The lens module includes at least one lens, which is detachably disposed at one side of the sample carrying module and substantially focuses at the sample viewing surface, and corresponds to the light source module.

Abstract: A microscope unit and a microscope device are disclosed. The microscope unit is used with an external image capture module or an image capture module of the microscope device. The microscope unit comprises a body, an optical assembly and a heating element. The body has a tunnel going through the body, and a specimen observation plane located in the tunnel. The optical assembly having a convex lens is disposed at one end of the tunnel. A minimum distance from the specimen observation plane to the convex lens ranges from 0.1 mm to 3.0 mm. The heating element is disposed corresponding to the specimen observation plane.