Patents by Inventor Shu-Shu Shih

Shu-Shu Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070166535
    Abstract: A thermoplastic polyimide composition characterized by improved thermal resistance, adhesion and flatness for use in copper clad laminates. The polyimide contains repeating units represented by the formulae I and II, wherein each of Ar1 and Ar2, independently, represents a bivalent aromatic group, and X represents a quadrivalent aromatic group.
    Type: Application
    Filed: August 29, 2006
    Publication date: July 19, 2007
    Inventors: Charng-Shing Lu, Jinn-Shing King, Shu-Shu Shih