Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An optical calibration tool includes a first body, a light emitter, a light receiver, a second body, and a light reflecting member. The first body has a first engaging port and a second engaging port. The light emitter and the light receiver are disposed in the first body. The second body has a third engaging port and a channel communicated with each other. The third engaging port is configured to selectively engage one of the first engaging port and the second engaging port. When the third engaging port is engaged with the first engaging port, the light emitter is optically coupled to the light reflecting member. When the third engaging port is engaged with the second engaging port, the light receiver is optically coupled to the light reflecting member.

Abstract: An optical calibration tool includes a first body, a light emitter, a light receiver, a second body, and a light reflecting member. The first body has a first engaging port and a second engaging port. The light emitter and the light receiver are disposed in the first body. The second body has a third engaging port and a channel communicated with each other. The third engaging port is configured to selectively engage one of the first engaging port and the second engaging port. When the third engaging port is engaged with the first engaging port, the light emitter is optically coupled to the light reflecting member. When the third engaging port is engaged with the second engaging port, the light receiver is optically coupled to the light reflecting member.

Abstract: An optical calibration tool includes a first body, a light emitter, a light receiver, a second body, and a light reflecting member. The first body has a first engaging port and a second engaging port. The light emitter and the light receiver are disposed in the first body. The second body has a third engaging port and a channel communicated with each other. The third engaging port is configured to selectively engage one of the first engaging port and the second engaging port. When the third engaging port is engaged with the first engaging port, the light emitter is optically coupled to the light reflecting member. When the third engaging port is engaged with the second engaging port, the light receiver is optically coupled to the light reflecting member.

Abstract: In some examples, the disclosure describes a device that includes a first light sensor to determine a first quantity of light at a first location; a second light sensor to determine a second quantity of light at a second location; a display device to display images; a processor; and a non-transitory memory resource storing machine-readable instructions stored thereon that, when executed, cause the processor to: determine when a difference between the first quantity of light and the second quantity of light device exceeds a threshold quantity, select a light sensor from the first light sensor and the second light sensor based on the first quantity of light received by the first light sensor and the second quantity of light received by the second light sensor, and alter a brightness of the display device based on the selected light sensor.

Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.

Abstract: An optical calibration tool includes a first body, a light emitter, a light receiver, a second body, and a light reflecting member. The first body has a first engaging port and a second engaging port. The light emitter and the light receiver are disposed in the first body. The second body has a third engaging port and a channel communicated with each other. The third engaging port is configured to selectively engage one of the first engaging port and the second engaging port. When the third engaging port is engaged with the first engaging port, the light emitter is optically coupled to the light reflecting member. When the third engaging port is engaged with the second engaging port, the light receiver is optically coupled to the light reflecting member.

Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.

Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.

Abstract: A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.

Abstract: A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.

Abstract: A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.

Abstract: The application discloses an array-type light-emitting device comprising a substrate, a semiconductor light-emitting array formed on the substrate and emitting a first light with a first spectrum, wherein the semiconductor light-emitting array comprises a first light-emitting unit and a second light-emitting units, a first wavelength conversion layer formed on the first light-emitting unit for converting the first light into a third light with a third spectrum, and a circuit layer connecting the first light-emitting unit and the second light-emitting unit in a connection form to make the first light-emitting and the second light-emitting unit light alternately in accordance with a predetermined clock when driving by a power supply.

Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.

Abstract: This application discloses a light-emitting device with narrow dominant wavelength distribution and a method of making the same. The light-emitting device with narrow dominant wavelength distribution at least includes a substrate, a plurality of light-emitting stacked layers on the substrate, and a plurality of wavelength transforming layers on the light-emitting stacked layers, wherein the light-emitting stacked layer emits a first light with a first dominant wavelength variation; the wavelength transforming layer absorbs the first light and converts the first light into the second light with a second dominant wavelength variation; and the first dominant wavelength variation is larger than the second dominant wavelength variation.

Abstract: This application discloses a light-emitting device with narrow dominant wavelength distribution and a method of making the same. The light-emitting device with narrow dominant wavelength distribution at least includes a substrate, a plurality of light-emitting stacked layers on the substrate, and a plurality of wavelength transforming layers on the light-emitting stacked layers, wherein the light-emitting stacked layer emits a first light with a first dominant wavelength variation; the wavelength transforming layer absorbs the first light and converts the first light into the second light with a second dominant wavelength variation; and the first dominant wavelength variation is larger than the second dominant wavelength variation.

Abstract: A printed circuit board is disclosed. The printed circuit board includes a solder mask area and at least one chip attachment area. The at least one chip attachment area has an isolation solder mask layer such that the chip attachment area forms a plurality of chip sub-attachment areas to reduce an area of a solder paste smeared on the chip attachment area, and the isolation solder mask layer has at least one hole.