Patents by Inventor Shu Ting HUANG

Shu Ting HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126694
    Abstract: An out-of-order buffer includes an out-of-order queue and a controlling circuit. The out-of-order queue includes a request sequence table and a request storage device. The controlling circuit receives and temporarily stores the plural requests into the out-of-order queue. After the plural requests are transmitted to plural corresponding target devices, the controlling circuit retires the plural requests. The request sequence table contains m×n indicating units. The request sequence table contains m entry indicating rows. Each of the m entry indicating rows contains n indicating units. The request storage device includes m storage units corresponding to the m entry indicating rows in the request sequence table. The state of indicating whether one request is stored in the corresponding storage unit of the m storage units is recoded in the request sequence table. The storage sequence of the plural requests is recoded in the request sequence table.
    Type: Application
    Filed: November 18, 2022
    Publication date: April 18, 2024
    Inventors: Jyun-Yan LI, Po-Hsiang HUANG, Ya-Ting CHEN, Yao-An TSAI, Shu-Wei YI
  • Patent number: 11961324
    Abstract: An optical fingerprint recognition device includes a light-emitting diode (LED) array and a fingerprint sensing device. The LED array includes a central LED area and an edge LED area, and configured to display a light source pattern in response to a fingerprint sensing request. The light source pattern includes a central portion and a surrounding portion. During displaying the light source pattern, a plurality of red display subpixels of the central LED area are not illuminating and a plurality of red display subpixels of the edge LED area are illuminating. The fingerprint sensing device generates a first fingerprint image according to a plurality of first sensing signals obtained from a plurality of first sensing pixel area, and the first fingerprint image is adapted to be used for examining whether a finger which triggers the fingerprint sensing request is real or fake.
    Type: Grant
    Filed: December 26, 2022
    Date of Patent: April 16, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Shu-Fang Wang, Wan-Ting Huang, Kuan-Ting Lee
  • Patent number: 11945885
    Abstract: A vinyl-containing copolymer is copolymerized from (a) first compound, (b) second compound, and (c) third compound. (a) First compound is an aromatic compound having a single vinyl group. (b) Second compound is polybutadiene or polybutadiene-styrene having side vinyl groups. (c) Third compound is an acrylate compound. The vinyl-containing copolymer includes 0.003 mol/g to 0.010 mol/g of benzene ring, 0.0005 mol/g to 0.008 mol/g of vinyl group, and 1.2*10?5 mol/g to 2.4*10?4 mol/g of ester group.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: April 2, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Po Kuo, Shin-Liang Kuo, Shu-Chuan Huang, Yan-Ting Jiang, Jian-Yi Hang, Wen-Sheng Chang
  • Patent number: 11943935
    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
  • Publication number: 20240093267
    Abstract: A high-throughput automated preprocessing method and a system are applied to a nucleic acid preprocessing apparatus including a control system, a sample transfer area, a nucleic acid extraction area, and a reagent setup area. The control system includes a user interface and guides a user to set up on the user interface. In the sample transfer area, the method includes steps of: a user selecting a sampling tube type, a test protocol and an extraction protocol on the user interface, and the control system performing a sample transfer task. In the nucleic acid extraction area, the method includes steps of: the control system performing a nucleic acid extraction task based on the selected extraction protocol. In the reagent setup area, the method includes steps of: the control system performing a reagent deployment task based on the selected test protocol, and the control system performing a nucleic acid transfer task.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 21, 2024
    Inventors: Wei-Te Hsieh, Chia-Yen Lin, Kuang-An Wang, Keng-Ting Liu, Shu-Hui Huang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11934106
    Abstract: An optical proximity correction (OPC) device and method is provided. The OPC device includes an analysis unit, a reverse pattern addition unit, a first OPC unit, a second OPC unit and an output unit. The analysis unit is configured to analyze a defect pattern from a photomask layout. The reverse pattern addition unit is configured to provide a reverse pattern within the defect pattern. The first OPC unit is configured to perform a first OPC procedure on whole of the photomask layout. The second OPC unit is configured to perform a second OPC procedure on the defect pattern of the photomask layout to enhance an exposure tolerance window. The output unit is configured to output the photomask layout which is corrected.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: March 19, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shu-Yen Liu, Hui-Fang Kuo, Chian-Ting Huang, Wei-Cyuan Lo, Yung-Feng Cheng, Chung-Yi Chiu
  • Patent number: 11915977
    Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
  • Publication number: 20170145001
    Abstract: The present disclosure provides processes for preparing brexpiprazole. The present disclosure also provides processes for the purification of brexpiprazole. The processes for preparing and purifying brexpiprazole of the present invention provide substantial improvements over currently known methods. In certain embodiments, the conversion of Formula XI and XII to form XIII provides increased selectivity over previously reported methods. This offers increased yield and purity. The improved process for purifying brexpiprazole disclosed herein provides brexpiprazole with superior purity and is also more suitable for industrial production.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 25, 2017
    Inventors: Chia-Ying LEE, Shu Ting HUANG, Hsin-Chi WANG, Yuan-Xiu LIAO, Jiunn-Cheh GUO, Lung-Huang KUO