Patents by Inventor Shu Ting MAI

Shu Ting MAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE
    Publication number: 20230324308
    Abstract: An electronic device is disclosed. The electronic device includes a carrier, an optical component disposed on the carrier and a humidity indicator within the electronic package. A position of the humidity indicator within the electronic package is arranged such that at least a part of the humidity indicator is visible from a viewpoint outside of the electronic package.
    Type: Application
    Filed: April 8, 2022
    Publication date: October 12, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shu Ting MAI, Tzu Hsing CHIANG