Abstract: The present disclosure provides an electronic device including a first sensing circuit, a second sensing circuit and a power line. The first sensing circuit includes a first sensing unit and a first transistor, and a first end of the first sensing unit is coupled to a control end of the first transistor. The second sensing circuit includes a second sensing unit and a second transistor, and a first end of the second sensing unit is coupled to a control end of the second transistor. A first end of the first transistor and a first end of the second transistor are coupled to the power line.

Abstract: Embodiments described herein relate to plasma processes. A plasma process includes generating a plasma containing negatively charged oxygen ions. A substrate is exposed to the plasma. The substrate is disposed on a pedestal while being exposed to the plasma. While exposing the substrate to the plasma, a negative direct current (DC) bias voltage is applied to the pedestal to repel the negatively charged oxygen ions from the substrate.

Abstract: A bonding structure is applied to electrically connect a chip and a circuit board, such as a micro-strip line, for signal transmission between each other. The bonding structure includes a metallic plate and a capacitor. The chip and the micro-strip line are placed on the metallic plate but do not overlap or contact with each other. In particular, the capacitor is used to connect a signal pad of the chip and a signal line of the micro-strip line for signal transmission at high frequencies.