Abstract: A chassis with built-in handles which do not add to dimensional clearance required for the chassis to be placed in a cavity includes a side plate, a mounting unit, and a handle. A mounting groove is defined on the side plate. The mounting unit is coupled to the side plate. The handle is partially clamped by the side plate and the mounting unit, and rotatably coupled with the side plate. By rotating the handle, the handle can be stored at least flush in the mounting groove.

Abstract: A locking assembly can lock a workpiece. The workpiece includes a locking hole. The locking assembly includes a housing, a movable component, and an unlocking handle. The movable component includes a sleeve, a pin, and an unlocking cover. The sleeve is mounted on the housing. The pin is accommodated in the sleeve, and a portion of the pin protrudes from the housing and accommodated in the locking hole. The unlocking cover is fixed to the pin. The unlocking handle is disposed between the unlocking cover and the sleeve. The unlocking cover can be pulled from a first direction to move the pin out of the locking hole; or the unlocking handle can be pulled from a second direction intersecting with the first direction, and the unlocking handle can abut against the unlocking cover to drive the pin to move out of the locking hole.

Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.

Abstract: Embodiments disclosed herein relate generally to forming a gate layer in high aspect ratio trenches using a cyclic deposition-etch process. In an embodiment, a method for semiconductor processing is provided. The method includes performing a first deposition process to form a conformal film over a bottom surface and along sidewall surfaces of a feature on a substrate. The method includes performing an etch process to remove a portion of the conformal film. The method includes repeating the first deposition process and the etch process to fill the feature with the conformal film. The method includes exposing the conformal film to ultraviolet light.

Abstract: Embodiments disclosed herein relate generally to forming a gate layer in high aspect ratio trenches using a cyclic deposition-etch process. In an embodiment, a method for semiconductor processing is provided. The method includes performing a first deposition process to form a conformal film over a bottom surface and along sidewall surfaces of a feature on a substrate. The method includes performing an etch process to remove a portion of the conformal film. The method includes repeating the first deposition process and the etch process to fill the feature with the conformal film. The method includes exposing the conformal film to ultraviolet light.

Abstract: Embodiments disclosed herein relate generally to forming a gate layer in high aspect ratio trenches using a cyclic deposition-etch process. In an embodiment, a method for semiconductor processing is provided. The method includes performing a first deposition process to form a conformal film over a bottom surface and along sidewall surfaces of a feature on a substrate. The method includes performing an etch process to remove a portion of the conformal film. The method includes repeating the first deposition process and the etch process to fill the feature with the conformal film. The method includes exposing the conformal film to ultraviolet light.

Abstract: A powder shaping method comprises: providing a powder on a target surface; providing a laser beam to illuminate the powder so as to form a pre-treated powder; and providing an energy beam to illuminate the pre-treated powder for enabling a shaping process. In addition, a powder shaping apparatus comprises a base, a target surface, a powder supply unit and an energy beam source system. The target surface is disposed on the base and can be fixed or moved on the base. The powder supply unit provides a powder on the target surface. The energy beam source system has a laser source and an energy source, the laser source provides a laser beam to illuminate the powder to form a pre-treated powder, and the energy source provides an energy beam to further illuminate the pre-treated powder to make a shaping process.

Abstract: A powder shaping method comprises: providing a powder on a target surface; providing a laser beam to illuminate the powder so as to form a pre-treated powder; and providing an energy beam to illuminate the pre-treated powder for enabling a shaping process. In addition, a powder shaping apparatus comprises a base, a target surface, a powder supply unit and an energy beam source system. The target surface is disposed on the base and can be fixed or moved on the base. The powder supply unit provides a powder on the target surface. The energy beam source system has a laser source and an energy source, the laser source provides a laser beam to illuminate the powder to form a pre-treated powder, and the energy source provides an energy beam to further illuminate the pre-treated powder to make a shaping process.

Abstract: An upper limb training device includes a first rod, a second rod, a third rod, a first resilient element, and a second resilient element. The second rod is pivoted to the first rod by a first revolution element. The third rod is pivoted to the second rod by a second revolution element. Two ends of the first resilient element respectively connect with the first rod and the third rod for providing resistance when the first rod and the second rod rotate relative to the third rod. Two ends of the second resilient element respectively connect with the first rod and the third rod for providing resistance when the first rod rotates relative to the second rod. The first revolution element is disposed between two connecting points at which the first resilient element and the second resilient element connect with the first rod.

Abstract: An upper limb training device is disclosed. It includes a first rod, a second rod, a third rod, a first resilient element, and a second resilient element. The second rod is pivoted to the first rod by means of a first revolution element. The third rod is pivoted to the second rod by means of a second revolution element. Two ends of the first resilient element respectively connect with the first rod and the third rod for providing resistance when the first rod and the second rod rotate relative to the third rod. Two ends of the second resilient element respectively connect with the first rod and the third rod for providing resistance when the first rod rotates relative to the second rod. The first revolution element is disposed between two connecting points at which the first resilient element and the second resilient element connect with the first rod.