Abstract: An object detection method and apparatus include obtaining a point cloud of a scene that includes location information of points. The point cloud is mapped to a 3D voxel representation. A convolution operation is performed on the feature information of the 3D voxel to obtain a convolution feature set and initial positioning information of a candidate object region is determined based on the convolution feature set. A target point is located in the candidate object region in the point cloud is determined and the initial positioning information of the candidate object region is adjusted based on the location information and target convolution feature information of the target point. Positioning information of a target object region is obtained to improve object detection accuracy.

Abstract: An adhesive promoter, an organic silicon encapsulant composition, and an organic silicon encapsulant are provided. The adhesive promoter used for the organic silicon encapsulant is formed from a borosiloxane polymer represented by a general formula of: (R1R22SiO1/2)x(R2R3SiO2/2)y(R3SiO3/2)z(SiO4/2)i(BO(3-k)/2)j(OR4)k. R1 is a hydrogen atom or a C2-C6 alkenyl group. R2 and R4 are respectively a C1-C6 alkyl group. R3 is a C6-C12 aromatic group. In the general formula, x, y, z, i, j, and k represent a molar ratio. In the general formula, x, y, z, i, and j are a non-negative number smaller than or equal to 1, and k is a positive number ?3. A sum of x, y, z, and i is 1, and x is larger than 0.

Abstract: A light emitting diode package structure includes a substrate, a light emitting unit, a wavelength conversion layer, and a reflective structure. The light emitting unit and the reflective structure are disposed on a mounting surface of the substrate. The wavelength conversion layer is disposed on the light emitting unit. The wavelength conversion layer has a light input surface, a top light output surface opposite to the light input surface, and a side light output surface connecting the light input surface and the top light output surface. The reflective structure surrounds the light emitting unit and the wavelength conversion layer. The reflective structure has a top reflecting surface located on a top of the reflective structure, and a height position of the top reflecting surface is higher than a height position of the light input surface and lower than a height position of the top light output surface.

Abstract: A light emitting diode structure including a light emitting unit having a blue LED chip to produce a first light beam, a first light conversion layer disposed on the light emitting unit to convert a part of the first light beam into a second light beam, and a second light conversion layer disposed on the first light conversion layer to convert another part of the first light beam into a third light beam is provided. A remaining part of the first light beam, the second light beam, and the third light beam are superposed to form a working light beam whose spectrum includes a first wave band ranging from 350 nm to 660 nm and a second wave band ranging from 660 nm to 1000 nm. A power of the working light beam in the second wave band is higher than that in the first wave band.

Abstract: A light emitting diode package structure includes a substrate, a light emitting unit, a wavelength conversion layer, and a reflective structure. The light emitting unit and the reflective structure are disposed on a mounting surface of the substrate. The wavelength conversion layer is disposed on the light emitting unit. The wavelength conversion layer has a light input surface, a top light output surface opposite to the light input surface, and a side light output surface connecting the light input surface and the top light output surface. The reflective structure surrounds the light emitting unit and the wavelength conversion layer. The reflective structure has a top reflecting surface located on a top of the reflective structure, and a height position of the top reflecting surface is higher than a height position of the light input surface and lower than a height position of the top light output surface.

Abstract: An adhesive promoter, an organic silicon encapsulant composition, and an organic silicon encapsulant are provided. The adhesive promoter used for the organic silicon encapsulant is formed from a borosiloxane polymer represented by a general formula of: (R1R22S1/2)x(R2R3SiO2/2)y(R3SiO3/2)z(SiO4/2)i(BO(3-k)/2)j(OR4)k. R1 is a hydrogen atom or a C2-C6 alkenyl group. R2 and R4 are respectively a C1-C6 alkyl group. R3 is a C6-C12 aromatic group. In the general formula, x, y, z, i, j, and k represent a molar ratio. In the general formula, x, y, z, i, and j are a non-negative number smaller than or equal to 1, and k is a positive number ?3. A sum of x, y, z, and i is 1, and x is larger than 0.

Abstract: A light-emitting device includes a package structure and a light-emitting chip. The package structure has a light exiting surface, a rear surface facing away from the light exiting surface, a groove inward recessed on the rear surface, and an outer surrounding side wall surrounding the groove. The light-emitting chip is disposed in the groove. The width of the package structure gradually decreases from the light exiting surface to the rear surface. The width of the groove gradually increases from inside to outside of the groove.

Abstract: An LED structure includes a substrate, an LED chip disposed on the substrate, a wavelength conversion layer disposed above a light-emitting surface of the LED chip, and a cut-on optical filter disposed on a central region of the wavelength conversion layer.

Abstract: A light-emitting device includes a package structure and a light-emitting chip. The package structure has a light exiting surface, a rear surface facing away from the light exiting surface, a groove inward recessed on the rear surface, and an outer surrounding side wall surrounding the groove. The light-emitting chip is disposed in the groove. The width of the package structure gradually decreases from the light exiting surface to the rear surface. The width of the groove gradually increases from inside to outside of the groove.

Abstract: An LED package structure with multiple color temperatures includes a substrate, a circuit layer disposed on the substrate, a plurality of first LED chips and a plurality of second LED chips disposed on the circuit layer, and a light conversion layer disposed on the substrate and the circuit layer. The light conversion layer has a spiral surface arranged away from the substrate. The light conversion layer includes a first light conversion portion and a second light conversion portion arranged around a lateral side of the first light conversion portion. The color temperature of the first light conversion portion is different from that of the second light conversion portion. The first LED chips are embedded in the first light conversion portion, and the second LED chips are embedded in the second light conversion portion. Thus, the LED package structure provided by the instant disclosure has good production efficiency.

Abstract: An LED structure includes a substrate, an LED chip disposed on the substrate, a wavelength conversion layer disposed above a light-emitting surface of the LED chip, and a cut-on optical filter disposed on a central region of the wavelength conversion layer.

Abstract: An LED package structure with multiple color temperatures includes a substrate, a circuit layer disposed on the substrate, a plurality of first LED chips and a plurality of second LED chips disposed on the circuit layer, and a light conversion layer disposed on the substrate and the circuit layer. The light conversion layer has a spiral surface arranged away from the substrate. The light conversion layer includes a first light conversion portion and a second light conversion portion arranged around a lateral side of the first light conversion portion. The color temperature of the first light conversion portion is different from that of the second light conversion portion. The first LED chips are embedded in the first light conversion portion, and the second LED chips are embedded in the second light conversion portion. Thus, the LED package structure provided by the instant disclosure has good production efficiency.