Abstract: The application discloses a chip fabrication process for improving LED chip light extraction efficiency and an LED chip. The LED chip comprises: a patterned sapphire substrate including a sapphire substrate and an oxide layer provided on the sapphire substrate; an LED chip epitaxial wafer provided on a patterned sapphire substrate, and the outer periphery of the LED chip epitaxial wafer is provided with an isolation groove; the LED chip epitaxial wafer comprises an N-type gallium nitride layer and a P-type gallium nitride layer, wherein the N-type gallium nitride layer is provided on a patterned sapphire substrate, the P-type gallium nitride layer is provided on the N-type gallium nitride layer, and the isolation groove is a multi-layer triangular cone, a semi-circle or a sphere.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.

Abstract: A lithium precipitation detection method may include: sending, when a battery management module in the battery pack determines that a change in a charging voltage of the battery pack meets a predetermined condition, a charging request containing a first current to a charging pile for charging, and controlling the battery pack to be charged with the first current for a first predetermined duration and a second predetermined duration, where the first predetermined duration is equal to the second predetermined duration; obtaining, by the battery management module, a first voltage change amount within the first predetermined duration and a second voltage change amount within the second predetermined duration; and determining, when the battery management module determines that a difference between the second voltage change amount and the first voltage change amount is greater than a predetermined voltage threshold, that lithium precipitation occurs in the battery pack.

Abstract: A non-invasive time domain reflection probe calibration method includes: using different volume ratio of ethanol and deionized water mixed solution to calculate a test target's medium weight coefficient and waveguide length of the non-invasive time domain reflection probes; using different concentrations of NaCl solutions to calibrate a waveguide geometric dimensioning of the non-invasive time domain reflection probes; preparing compacted soil samples with known different moisture contents and densities, and calibrating a correlation parameter of compacted soil samples' dielectric constant and conductivity with moisture content and density. The method not only determines the sensitivity of the test target medium of the non-invasive time domain reflection probes, but also obtains the waveguide length and geometric dimensioning of the probe, and realizes an accurate test of moisture content and density of the soil.

Abstract: The present disclosure belongs to polymercaptan compounds and application fields thereof, and particularly relates to a polymercaptan compound and a preparation method thereof, a curing agent, a resin composition, an adhesive and a sealant. The polymercaptan compound is represented by formula (I), wherein R1, R2, R3, R5, R7 and R8 are each independently selected from one of a hydrogen atom, an alkyl group with 1-5 carbon atoms and an alkoxy group with 1-5 carbon atoms, R4 and R6 are each independently selected from an alkylene group with 1-5 carbon atoms, and m and n are each independently 0, 1, 2 or 3.

Abstract: A power module includes a printed circuit board (PCB), a magnetic element, primary and secondary winding circuits and a regulator. The magnetic element is disposed on the PCB and has first to fourth sides. The second side is opposite to the first side, the fourth side is opposite to the third side. The primary winding circuit is disposed on the PCB and positioned in a vicinity of the first or second side. The secondary winding circuit is disposed on the first PCB and positioned in a vicinity of the third or fourth side. The regulator includes a switch disposed on the PCB, and coupled to the primary winding circuit. The at least one switch, the primary winding circuit, and the magnetic element are arranged in a first direction in order. A power device is also disclosed herein.

Abstract: The present disclosure provides a power conversion device. The power conversion device includes the multi-level power factor correction circuit, the at least one output capacitor, the at least one input capacitor group, the first resonant conversion circuit and the second resonant conversion circuit. The at least one input capacitor group includes the first input capacitor and the second input capacitor. The at least one output capacitor is connected to an output part of the multi-level power factor correction circuit. The at least one input capacitor group is connected to the at least one output capacitor in parallel. The second input capacitor is connected to the first input capacitor in series. The input part of the first resonant conversion circuit is connected to first input capacitor in parallel. The input part of the second resonant conversion circuit is connected to the second input capacitor in parallel.

Abstract: A display panel and a display apparatus, and the display panel includes a display area and a non-display area located on at least one side of the display area. The display panel includes: a substrate; and antenna modules arranged at a side of the substrate. An orthographic projection of at least one of the antenna modules on the substrate is located within a line winding area of the non-display area.

Abstract: A resonant converter includes primary and secondary circuits, a transformer, a resonant network and a control circuit. The control circuit is coupled to the primary circuit and the secondary circuit, and configured to control primary switches of the primary circuit operating with a switching frequency. At least one of primary switches is configured to be turned on from a first switching moment until a second switching moment. The control circuit is configured to control secondary switches of the secondary circuit, such that at least one of secondary switches is turned on during a first time interval to increase a current of the resonant network in a first flowing direction and an output current in a second flowing direction or equal to zero.

Abstract: An electronic package is provided, in which a plurality of electronic elements are disposed on a plurality of carrier structures, and at least one bridging element is disposed between at least two of the carrier structures to electrically bridge the two carrier structures. Therefore, when there is a need to increase the function of the electronic package, only one electronic element is arranged on a single carrier structure, and there is no need to increase the panel area of the carrier structure, so as to facilitate the control of the panel area of the carrier structure and avoid warpage of the carrier structure due to the oversized panel.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic device includes a memory, a processor, and functional hardware. The memory includes a queue. The processor is configured to write a processing instruction into a target area of the queue. The functional hardware is configured to read the processing instruction from the target area and reserve the target area. The functional hardware generates a completion message according to the processing instruction, and writes the completion message into the target area after the processing instruction is executed. The completion message corresponds to the processing instruction.

Abstract: A touch sensing device, a touch display panel and a touch display panel motherboard. The touch sensing device includes: a first substrate; a plurality of patterned electrodes; and at least two lead layers, each lead layer includes a plurality of electrode leads, the plurality of electrode leads have a one-to-one correspondence relationship with the plurality of patterned electrodes, and each of the plurality of electrode leads is electrically connected to a corresponding one of the plurality of patterned electrodes.

Abstract: A resonant converter includes a transformer, a resonant network, control circuit, primary and secondary circuits. One of the primary switches is turned on from a first switching moment until a second switching moment. The resonant network is coupled between the primary circuit and the primary winding. A current of the resonant network changes a direction at a first moment between the first and second switching moments. The secondary circuit is coupled to the secondary winding. One of the secondary switches is turned on during first and second preset time interval to increase the current in a direction by the secondary winding being clamped by a preset voltage, in which the output current is increased in an opposite direction or equal to zero.

Abstract: A resonant converter includes primary and secondary circuits, a transformer, a resonant network and a control circuit. The control circuit is coupled to the primary circuit and the secondary circuit, and configured to control primary switches of the primary circuit operating with a switching frequency. At least one of primary switches is configured to be turned on from a first switching moment until a second switching moment. The control circuit is configured to control secondary switches of the secondary circuit, such that at least one of secondary switches is turned on during a first time interval to increase a current of the resonant network in a first flowing direction and an output current in a second flowing direction or equal to zero.

Abstract: A resonant converter includes a transformer, a resonant network, control circuit, primary and secondary circuits. One of the primary switches is turned on from a first switching moment until a second switching moment. The resonant network is coupled between the primary circuit and the primary winding. A current of the resonant network changes a direction at a first moment between the first and second switching moments. The secondary circuit is coupled to the secondary winding. One of the secondary switches is turned on during first and second preset time interval to increase the current in a direction by the secondary winding being clamped by a preset voltage, in which the output current is increased in an opposite direction or equal to zero.

Abstract: The present disclosure provides a power conversion device. The power conversion device includes the multi-level power factor correction circuit, the at least one output capacitor, the at least one input capacitor group, the first resonant conversion circuit and the second resonant conversion circuit. The at least one input capacitor group includes the first input capacitor and the second input capacitor. The at least one output capacitor is connected to an output part of the multi-level power factor correction circuit. The at least one input capacitor group is connected to the at least one output capacitor in parallel. The second input capacitor is connected to the first input capacitor in series. The input part of the first resonant conversion circuit is connected to first input capacitor in parallel. The input part of the second resonant conversion circuit is connected to the second input capacitor in parallel.

Abstract: An array substrate and a manufacturing method thereof are provided. A plurality of groups of bonding terminals are formed on a substrate, a first electrostatic protection wire is formed on a marginal region of the substrate, and a second electrostatic protection wire is formed to connect the bonding terminals and the first electrostatic protection wire.