Patents by Inventor Shuaishuai Wei

Shuaishuai Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230304671
    Abstract: A latching structure for a cooking device and a cooking device having the same are provided. The cooking device has a casing and a door body. The latching structure has a flipping member, a first restoring member, a restricting member and a second restoring member. The first restoring member provides the flipping member with a first restoring force for allowing the flipping member to rotate towards a non-triggered position. The restricting member is movably disposed on the casing between a first position and a second position. The second restoring member is configured to provide the restricting member with a second restoring force for allowing the restricting member to move towards the first position. The latching structure is configured, such that a restoring speed at which the flipping member rotates towards the non-triggered position is greater than a restoring speed at which the restricting member moves towards the first position.
    Type: Application
    Filed: April 14, 2022
    Publication date: September 28, 2023
    Applicants: GUANGDONG MIDEA KITCHEN APPLIANCES MANUFACTURING CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Xin ZHANG, Yanqi WU, Shuaishuai WEI, Xinchao ZHU
  • Patent number: 11358223
    Abstract: The disclosure belongs to a technical field related to metamaterials and discloses a multi-scale three-dimensional pentamode metamaterial and an additive manufacturing method thereof. The multi-scale three-dimensional pentamode metamaterial has a body centered cubic (BCC) structure and includes a plurality of rods and a plurality of node structures. Two ends of each of the rods are connected to the node structures. Each of the rods has a cylindrical shape and is provided with a biconical through hole. From one end of the rod towards the other end of the rod, a diameter of the biconical through hole gradually decreases and then gradually increases. A chamber is formed inside each of the node structures, the biconical through hole communicates with the chamber, and the chamber is filled with a lattice structure.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: June 14, 2022
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Bo Song, Junxiang Fan, Shuaishuai Wei, Yusheng Shi
  • Publication number: 20220118518
    Abstract: The disclosure belongs to a technical field related to metamaterials and discloses a multi-scale three-dimensional pentamode metamaterial and an additive manufacturing method thereof. The multi-scale three-dimensional pentamode metamaterial has a body centered cubic (BCC) structure and includes a plurality of rods and a plurality of node structures. Two ends of each of the rods are connected to the node structures. Each of the rods has a cylindrical shape and is provided with a biconical through hole. From one end of the rod towards the other end of the rod, a diameter of the biconical through hole gradually decreases and then gradually increases. A chamber is formed inside each of the node structures, the biconical through hole communicates with the chamber, and the chamber is filled with a lattice structure.
    Type: Application
    Filed: August 13, 2021
    Publication date: April 21, 2022
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Bo Song, Junxiang Fan, Shuaishuai Wei, Yusheng SHI