Patents by Inventor Shuang-Chin Wu

Shuang-Chin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10445551
    Abstract: A fingerprint identification device and a method for manufacturing the fingerprint identification device are provided. The fingerprint identification device includes a solder ball array, a re-distribution layer, an image sensing integrated circuit (IC), a light emitting circuit, a photic layer and a molding material. The re-distribution layer disposed on the solder ball array is electrically connected to a plurality of solder balls. The image sensing IC includes a plurality of through silicon vias (TSVs), and the TSVs are correspondingly electrically connected to the solder balls, respectively, through the re-distribution layer. The light emitting circuit is disposed on one side of the image sensing IC, and electrically connected to the image sensing IC through the re-distribution layer. The image sensing IC controls the light emitting circuit. The photic layer is disposed on the image sensing IC. The molding material encloses the image sensing IC.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: October 15, 2019
    Assignee: EOSMEM CORPORATION
    Inventors: Chern-Lin Chen, Shuang-Chin Wu, Ying-Yi Wu
  • Publication number: 20180181788
    Abstract: A fingerprint identification device and a method for manufacturing the fingerprint identification device are provided. The fingerprint identification device includes a solder ball array, a re-distribution layer, an image sensing integrated circuit (IC), a light emitting circuit, a photic layer and a molding material. The re-distribution layer disposed on the solder ball array is electrically connected to a plurality of solder balls. The image sensing IC includes a plurality of through silicon vias (TSVs), and the TSVs are correspondingly electrically connected to the solder balls, respectively, through the re-distribution layer. The light emitting circuit is disposed on one side of the image sensing IC, and electrically connected to the image sensing IC through the re-distribution layer. The image sensing IC controls the light emitting circuit. The photic layer is disposed on the image sensing IC. The molding material encloses the image sensing IC.
    Type: Application
    Filed: December 26, 2017
    Publication date: June 28, 2018
    Inventors: CHERN-LIN CHEN, SHUANG-CHIN WU, YING-YI WU
  • Patent number: 7298309
    Abstract: A digital-to-analog converter (DAC) for generating an analog output voltage according to a digital input value includes a plurality of pulse width modulation (PWM) units and a voltage generating unit. The digital input value includes a plurality of bit segments. The plurality of PWM units generates a plurality of PWM signals according to the plurality of bit segments of the digital input value. The voltage generating unit is coupled to the plurality of PWM units and generates the analog output voltage according to the plurality of PWM signals.
    Type: Grant
    Filed: August 16, 2006
    Date of Patent: November 20, 2007
    Assignee: MStar Semiconductor, Inc.
    Inventors: Shuang-Chin Wu, Wei-Kuo Lee