Abstract: Documents that have been compromised by malware are detected and recovered. A hash of a portion of a file of a document is generated. An identifier of the file includes a signature that is embedded in the file, with the identifier including the hash of the portion of the file and other file information, such as a pathname of the file. A list that includes the identifier of the file is consulted before generating a backup copy of the file. The file is restored from the backup copy of the file in response to detecting that the file has been encrypted.

Abstract: A fan assembly includes a fan, a bracket, and a retaining member. The fan defines a locking hole. A bracket receives the fan. The bracket includes a mounting wall. The retaining member includes a base panel and a mounting portion. The mounting portion includes a mounting tab extending from the base panel and a mounting protrusion extending from the mounting tab. The mounting protrusion extends through the mounting wall and inclining resists an inner side of the locking hole to prevent the fan from moving along a first direction substantially parallel to the mounting wall.

Abstract: Lists of keywords by type are collected that are associated with fake antivirus software. One more rules are created including the keywords that likely indicate fake antivirus software. The keywords and rules are stored in a local database on a computer. Each executing process of a computer is scanned using the rules. A match indicates that the scanned process is likely fake antivirus software. A check is then performed to determine if the scanned process is actually legitimate antivirus software (using a digital certificate, a white list, or a call to a function). If the check fails a determination is made that the identified process is fake antivirus software. The process may then be displayed, cleaned, quarantined, or permanently removed from the computer. The cursor may be dragged into the window of an executing process in order to selectively scan that process only. Or, any number of executing processes may be selected to be scanned by the rules.

Abstract: A computer includes a backplane, an enclosure, a motherboard, a shielding cover, a guiding plate, and a fan. The enclosure covers on the backplane. The motherboard is located on the backplane. The motherboard includes a plurality of heat generating elements. A shielding cover covers the motherboard and located in the enclosure. The shielding space is defined in the shielding cover. The guiding plate is located on the backplane adjacent to the shielding cover. A heat dissipating space is defined between the shielding cover and the guiding plate. The heat dissipating space communicates with the shielding space. The fan is located in the heat dissipating space. The fan is adapted to generate airflow from the shielding space and is adapted to dissipate the airflow through the heat dissipating space.

Abstract: An electronic device includes an enclosure, a circuit board, and an air duct. The enclosure includes a bottom plate, the bottom plate defining a vent opening. The circuit board is attached to the bottom plate. A first heat generating part and a second generating part are located on the circuit board. The air duct is secured to the circuit board. The air duct defines a first air flows guiding passage and a second airflow guiding passage. When air flows through the vent opening, the first air flows guiding passage is configured to guide air flows to dissipate heat generated by the first heat generating part, and the second air flows guiding passage is configured to guide air flows to dissipate heat generated by the second heat generating part.

Abstract: A fan assembly includes a fan, a bracket, and a retaining member. The fan defines a locking hole. A bracket receives the fan. The bracket includes a mounting wall. The retaining member includes a base panel and a mounting portion. The mounting portion includes a mounting tab extending from the base panel and a mounting protrusion extending from the mounting tab. The mounting protrusion extends through the mounting wall and inclining resists an inner side of the locking hole to prevent the fan from moving along a first direction substantially parallel to the mounting wall.

Abstract: A heat dissipating apparatus comprises a base, an air duct, and a cooling fan. The base comprises a first cooling portion and a second cooling portion. The air duct covers the first cooling portion, and defines an air inlet and an air outlet. The cooling fan is secured to the first cooling portion, and located below the air inlet. A blocking board is secured between the first cooling portion and the second cooling portion to prevent air flowing from the first cooling portion to the second cooling portion.

Abstract: A heat dissipating apparatus includes a base, a first fin assembly, a second fin assembly, and at least one heat pipe. The base includes a top surface and a bottom surface, the bottom surface makes contact with an electronic heat-generating component. The first fin assembly is disposed on the top surface of the base. The second fin assembly is separate from the first fin assembly. The at least one heat pipe includes a first contacting portion in contact with the base and a second contacting portion in contact with the second fin assembly.

Abstract: A heat dissipating apparatus includes a base, a first fin assembly, a second fin assembly, a first heat pipe, and a second heat pipe. The first fin assembly and the second fin assembly are disposed on the top surface of the base. The first fin assembly defines a first through hole. The second fin assembly defines a second through hole. The second fin assembly is a structural mirror image of the first fin assembly. The first heat pipe includes a first contacting portion in contact with the base and a second contacting portion received in the first through hole of the first fin assembly. The second heat pipe includes a third contacting portion in contact with the base and a fourth contacting portion received in the second through hole of the second fin assembly.

Abstract: A retaining module secures a fan. The bracket receives the fan. The bracket includes a front wall. The front wall defines a vent. A retaining member includes a body, a number of locking portions, and two retaining portions. The body defines an opening to communicate with the vent of bracket. The locking portions extends through the front wall. The retaining portions are engaged with the front wall to attach the retaining member to the bracket.

Abstract: A fan assembly includes a rack, a fan, and a shield. The rack defines a first vent opening and a second vent opening. A pair of notches are located adjacent the first vent opening. The fan is aligned with the second vent opening. The shield is aligned with the first vent opening. A pair of symmetrical locks are connected to the shield. Each of the pair of locks includes an engaging tab which comprises a slant guiding edge. The engaging tabs are configured to move between a locking position and a release position. In the locking position, the engaging tabs are engaged in the pair of notches to secure the shield in the rack. In the release position, the engaging tabs are guided by the guiding edges to escape from the pair of notches by elastically bent the pair of locks towards each other.

Abstract: A computer includes a backplane, an enclosure, a motherboard, a shielding cover, a guiding plate, and a fan. The enclosure covers on the backplane. The motherboard is located on the backplane. The motherboard includes a plurality of heat generating elements. A shielding cover covers the motherboard and located in the enclosure. The shielding space is defined in the shielding cover. The guiding plate is located on the backplane adjacent to the shielding cover. A heat dissipating space is defined between the shielding cover and the guiding plate. The heat dissipating space communicates with the shielding space. The fan is located in the heat dissipating space. The fan is adapted to generate airflow from the shielding space and is adapted to dissipate the airflow through the heat dissipating space.

Abstract: An electronic device includes a display module, a motherboard, a heat dissipating device, a case, and a cover. The motherboard is secured on the display module. A first heat generating member is secured to the motherboard. The heat dissipating device is secured to the motherboard. The heat dissipating device includes a heat sink and a heat pipe secured to the heat sink. The heat pipe capable of transferring heat generated from the first heat generating member to the heat sink. The case is secured to the display module and covers the motherboard. A fan module is secured to the case above the first heat generating member and capable of directing air out of the case. The cover is secured to the display module and covers the heat dissipating device and the case. The heat sink is located in the case and out of the cover.

Abstract: A heat dissipating apparatus comprises a base, an air duct, and a cooling fan. The base comprises a first cooling portion and a second cooling portion. The air duct covers the first cooling portion, and defines an air inlet and an air outlet. The cooling fan is secured to the first cooling portion, and located below the air inlet. A blocking board is secured between the first cooling portion and the second cooling portion to prevent air flowing from the first cooling portion to the second cooling portion.

Abstract: A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.

Abstract: A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.

Abstract: A computer system includes a chassis and an airflow blocking plate. The chassis comprising a first chassis sidewall, a second chassis sidewall, and a drive bracket which is used to mount a disk drive. The drive bracket is secured in the chassis and abuts the first chassis sidewall, and the first chassis sidewall defines a first ventilation hole. The air flows into the chassis via the first ventilation hole. The airflow blocking plate secured in the chassis and located between the first chassis sidewall and the second chassis sidewall. The airflow blocking plate prevents the air from flowing back to the drive bracket.

Abstract: A computer system includes a chassis and an airflow blocking plate. The chassis comprising a first chassis sidewall, a second chassis sidewall, and a drive bracket which is used to mount a disk drive. The drive bracket is secured in the chassis and abuts the first chassis sidewall, and the first chassis sidewall defines a first ventilation hole. The air flows into the chassis via the first ventilation hole. The airflow blocking plate secured in the chassis and located between the first chassis sidewall and the second chassis sidewall. The airflow blocking plate prevents the air from flowing back to the drive bracket.

Abstract: A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.

Abstract: A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.