Abstract: A method for performing a plasma etch process is provided. The method initiates with receiving a substrate into a chamber. A high frequency (HF) RF signal is generated, said HF RF signal being pulsed in at least a three-state cycle including a first state, a second state, and a third state. The first state is configured at a first power level; the second state is configured at a second power level less than the first power level; and, the third state is configured at a third power level less than the second power level. The second power level of the HF RF signal being in the range of about 0 W to 3500 W. The HF RF signal is applied to an electrode of the chamber for performing the plasma etch process.

Abstract: High aspect ratio features are formed in a substrate using etching and deposition processes. A partially etched feature is formed by exposure to plasma in a plasma etch chamber. A metal-based liner is subsequently deposited in the partially etched feature using the same plasma etch chamber. The metal-based liner is robust and prevents lateral etch in subsequent etching operations. The metal-based liner may be deposited at temperatures or pressures comparable to temperatures or pressures for etch processes. The metal-based liner may be localized in certain portions of the partially etched feature. Etching proceeds within the feature after deposition without lateral etching in regions where the metal-based liner is deposited.

Abstract: A method for controlling a critical dimension of a mask layer is described. The method includes receiving a first primary parameter level, a second primary parameter level, a first secondary parameter level, a second secondary parameter level, and a third secondary parameter level. The method also includes generating a primary signal having the first primary parameter level, and transitioning the primary signal from the first primary parameter level to the second primary parameter level. The method further includes generating a secondary radio frequency (RF) signal having the first secondary parameter level, and transitioning the secondary RF signal from the first secondary parameter level to the second secondary parameter level. The method includes transitioning the secondary RF signal from the second secondary parameter level to the third secondary parameter level.

Abstract: A memristive radio frequency (RF) switch circuit comprises a first metal electrode and a second metal electrode arranged on an insulating substrate and separated by an air gap, wherein the air gap is fifty nanometers (50 nm) or less, and wherein applying and removing an enabling voltage to the memristive RF switch enables the memristive RF switch to pass RF signals between the first electrode and the second electrode even when the enabling voltage is removed from the memristive switch, and wherein applying and removing a disabling voltage to the memristive switch disables the memristive switch.

Abstract: A memristive radio frequency (RF) switch circuit comprises a first metal electrode and a second metal electrode arranged on an insulating substrate and separated by an air gap, wherein the air gap is fifty nanometers (50 nm) or less, and wherein applying and removing an enabling voltage to the memristive RF switch enables the memristive RF switch to pass RF signals between the first electrode and the second electrode even when the enabling voltage is removed from the memristive switch, and wherein applying and removing a disabling voltage to the memristive switch disables the memristive switch.