Patents by Inventor Shuangfu Wang

Shuangfu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Merged power pad for improving integrated circuit power delivery
    Patent number: 11688704
    Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: June 27, 2023
    Assignee: Futurewei Technologies, Inc.
    Inventors: Shiqun Gu, Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie, Shuangfu Wang, Hong Liu, Liming Zhao, Hongquan Sun
  • MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY
    Publication number: 20220148988
    Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.
    Type: Application
    Filed: January 21, 2022
    Publication date: May 12, 2022
    Applicant: Futurewei Technologies, Inc.
    Inventors: Shiqun Gu, Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie, Shuangfu Wang, Hong Liu, Liming Zhao, Hongquan Sun
  • Merged power pad for improving integrated circuit power delivery
    Patent number: 11233025
    Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: January 25, 2022
    Assignee: Futurewei Technologies, Inc.
    Inventors: Shiqun Gu, Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie, Shuangfu Wang, Hong Liu, Liming Zhao, Hongquan Sun
  • MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY
    Publication number: 20180350762
    Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.
    Type: Application
    Filed: January 25, 2018
    Publication date: December 6, 2018
    Inventors: Shiqun Gu, Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie, Shuangfu Wang, Hong Liu, Liming Zhao, Hongquan Sun