Patents by Inventor Shuangquan HU

Shuangquan HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL CONDUCTIVE FILLER AND PREPARATION METHOD THEREOF
    Publication number: 20220289940
    Abstract: A method to prepare a thermal conductive filler, particularly a thermal conductive filler for preparation of a thermal conductive material with reduced viscosity, comprising the step of dry mixing a platelet boron nitride with a fumed silica or a fumed metal oxide with a primary particle size of 1-200 nm. A thermal conductive filler, a thermal conductive material and an electronic device are also provided.
    Type: Application
    Filed: August 24, 2020
    Publication date: September 15, 2022
    Applicant: EVONIK OPERATIONS GMBH
    Inventors: Shuangquan HU, Yuan-Chang HUANG