Abstract: A portable security alarm device includes a subscriber identification module (SIM) card operable to store an international mobile subscriber identity (IMSI) number and a related key that together identify the PSAD to a mobile telephone carrier, a cellular antenna, a GPS antenna and a GPS receiver communicatively coupled to the GPS antenna, a battery coupled to a sense circuit and operable to power the PSAD, a quick release switch operable to provide a signal indicating an occurrence of a one-stroke activation of the quick release switch by a user, an alarm operable to provide a loud warning sound, and a microcontroller including one or more processors and memory, where the microcontroller is operatively coupled to hardware components of the device, and where the microcontroller is configured with an operating system and software components, the software components including software configured to control the hardware components of the PSAD and perform operations.

Abstract: A test structure and method are provided to facilitate developing or optimizing a fabrication process by determining values of one or more lithography process parameters for use in semiconductor device fabrication. The test structure is configured to facilitate determining values of the one or more fabrication process parameters, and includes a plurality of test structure components arranged on a substrate according to a test pattern. The test pattern may be based on: varying distances between the test structure components according to a first rule; varying distances between centers of the test structure components according to a second rule; and/or varying at least one dimension of the test structure components according to a third rule. The method may further include determining dimensions of one or more components of the test structure using, for example, scatterometry, and using the dimensions of the components to ascertain one or more fabrication process parameters.

Abstract: A test structure and method are provided to facilitate developing or optimizing a fabrication process by determining values of one or more lithography process parameters for use in semiconductor device fabrication. The test structure is configured to facilitate determining values of the one or more fabrication process parameters, and includes a plurality of test structure components arranged on a substrate according to a test pattern. The test pattern may be based on: varying distances between the test structure components according to a first rule; varying distances between centers of the test structure components according to a second rule; and/or varying at least one dimension of the test structure components according to a third rule. The method may further include determining dimensions of one or more components of the test structure using, for example, scatterometry, and using the dimensions of the components to ascertain one or more fabrication process parameters.