Patents by Inventor Shubhra Bansal
Shubhra Bansal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8779886Abstract: A device, such as a switch structure, is provided. The switch structure can include a contact and a conductive element each respectively disposed on a substrate. The conductive element can be composed substantially of metallic material, and can be configured to be deformable between a first position, in which the conductive element is separated from the contact by a separation distance, and a second position, in which the conductive element contacts the contact and stores mechanical energy. The conductive element can be further configured such that, subsequent to being deformed into the second position at a temperature between about room temperature and about half of a melting temperature of the metallic material for a cumulative time of at least 107 seconds, the separation distance in the absence of external forces varies by less than 20 percent over the cumulative time. Associated methods are also provided.Type: GrantFiled: November 30, 2009Date of Patent: July 15, 2014Assignee: General Electric CompanyInventors: Marco Francesco Aimi, Shubhra Bansal, Christopher Fred Keimel, Kuna Venkat Satya Rama Kishore, Sairam Sundaram, Parag Thakre
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Patent number: 8354899Abstract: Provided is a device, such as a switch structure, that includes a contact and a conductive element that is configured to be deformable between a first position in which the conductive element is separated from the contact and a second position in which the conductive element contacts the contact. The conductive element can be formed substantially of metallic material configured to inhibit time-dependent deformation. For example, the metallic material may be configured to exhibit a maximum steady-state plastic strain rate of less than 10?12 s?1 when subject to a stress of at least about 25 percent of a yield strength of the metallic material and a temperature less than or equal to about half of a melting temperature of the metallic material. The contact and the conductive element may be part of a microelectromechanical device or a nanoelectromechanical device. Associated methods are also provided.Type: GrantFiled: September 23, 2009Date of Patent: January 15, 2013Assignee: General Electric CompanyInventors: Christopher Fred Keimel, Marco Francesco Aimi, Shubhra Bansal, Reed Roeder Corderman, Kuna Venkat Satya Rama Kishore, Eddula Sudhakar Reddy, Atanu Saha, Kanakasabapathi Subramanian, Parag Thakre, Alex David Corwin
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Patent number: 8345508Abstract: A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.Type: GrantFiled: February 26, 2010Date of Patent: January 1, 2013Assignee: General Electric CompanyInventors: Robert Gideon Wodnicki, Rayette Ann Fisher, Charles Gerard Woychik, Shubhra Bansal, Albert Taesung Byun
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Publication number: 20110128112Abstract: A device, such as a switch structure, is provided. The switch structure can include a contact and a conductive element each respectively disposed on a substrate. The conductive element can be composed substantially of metallic material, and can be configured to be deformable between a first position, in which the conductive element is separated from the contact by a separation distance, and a second position, in which the conductive element contacts the contact and stores mechanical energy. The conductive element can be further configured such that, subsequent to being deformed into the second position at a temperature between about room temperature and about half of a melting temperature of the metallic material for a cumulative time of at least 107 seconds, the separation distance in the absence of external forces varies by less than 20 percent over the cumulative time. Associated methods are also provided.Type: ApplicationFiled: November 30, 2009Publication date: June 2, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Marco Francesco Aimi, Shubhra Bansal, Christopher Fred Keimel, Kuna Venkat Satya Rama Kishore, Sairam Sundaram, Parag Thakre
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Patent number: 7928333Abstract: A device, such as a switch structure, is provided, the device including a contact and a conductive element. The conductive element can be configured to be selectively moveable between a non-contacting position, in which the conductive element is separated from the contact (in some cases by a distance less than or equal to about 4 ?m, and in others by less than or equal to about 1 ?m), and a contacting position, in which the conductive element contacts and establishes electrical communication with the contact. When the conductive element is disposed in the non-contacting position, the contact and the conductive element can be configured to support an electric field therebetween with a magnitude of greater than 320 V ?m?1 and/or a potential difference of about 330 V or more.Type: GrantFiled: August 14, 2009Date of Patent: April 19, 2011Assignee: General Electric CompanyInventors: Xuefeng Wang, Marco Francesco Aimi, Shubhra Bansal, Christopher Fred Keimel, Kuna Venkat Satya Rama Kishore, Kanakasabapathi Subramanian
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Publication number: 20110071397Abstract: A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.Type: ApplicationFiled: February 26, 2010Publication date: March 24, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Robert Gideon Wodnicki, Rayette Ann Fisher, Charles Gerard Woychik, Shubhra Bansal, Albert Taesung Byun
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Publication number: 20110067983Abstract: Provided is a device, such as a switch structure, that includes a contact and a conductive element that is configured to be deformable between a first position in which the conductive element is separated from the contact and a second position in which the conductive element contacts the contact. The conductive element can be formed substantially of metallic material configured to inhibit time-dependent deformation. For example, the metallic material may be configured to exhibit a maximum steady-state plastic strain rate of less than 10?12 s?1 when subject to a stress of at least about 25 percent of a yield strength of the metallic material and a temperature less than or equal to about half of a melting temperature of the metallic material. The contact and the conductive element may be part of a microelectromechanical device or a nanoelectromechanical device. Associated methods are also provided.Type: ApplicationFiled: September 23, 2009Publication date: March 24, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Christopher Fred Keimel, Marco Francesco Aimi, Shubhra Bansal, Reed Roeder Corderman, Kuna Venkat Satya Rama Kishore, Eddula Sudhakar Reddy, Atanu Saha, Kanakasabapathi Subramanian, Parag Thakre, Alex David Corwin
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Publication number: 20110036690Abstract: A device, such as a switch structure, is provided, the device including a contact and a conductive element. The conductive element can be configured to be selectively moveable between a non-contacting position, in which the conductive element is separated from the contact (in some cases by a distance less than or equal to about 4 ?m, and in others by less than or equal to about 1 ?m), and a contacting position, in which the conductive element contacts and establishes electrical communication with the contact. When the conductive element is disposed in the non-contacting position, the contact and the conductive element can be configured to support an electric field therebetween with a magnitude of greater than 320 V ?m?1 and/or a potential difference of about 330 V or more.Type: ApplicationFiled: August 14, 2009Publication date: February 17, 2011Applicant: General Electric CompanyInventors: Xuefeng Wang, Marco Francesco Aimi, Shubhra Bansal, Christopher Fred Keimel, Kuna Venkat Satya Rama Kishore, Kanakasabapathi Subramanian