Patents by Inventor Shubhra M. Gangopadhyay

Shubhra M. Gangopadhyay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080197450
    Abstract: A metal-to-metal antifuse having a lower metal electrode, a lower thin adhesion promoting layer disposed over the lower metal electrode, an amorphous carbon antifuse material layer disposed over the thin adhesion promoting layer, an upper thin adhesion promoting layer disposed over said antifuse material layer, and an upper metal electrode. The thin adhesion promoting layers are about 2 angstroms to 20 angstroms in thickness, and are from a material selected from the group comprising SixCy and SixNy. The ratio of x to y in SixCy is in a range of about 1±0.4, and the ratio of x to y in SixNy is in a range of about 0.75±0.225.
    Type: Application
    Filed: April 15, 2008
    Publication date: August 21, 2008
    Applicants: ACTEL CORPORATION, TEXAS TECH UNIVERSITY SYSTEM
    Inventors: Frank W. Hawley, A. Farid Issaq, John L. McCollum, Shubhra M. Gangopadhyay, Jorge A. Lubguban, Jin Miao Shen
  • Patent number: 7358589
    Abstract: A metal-to-metal antifuse having a lower metal electrode, a lower thin adhesion promoting layer disposed over the lower metal electrode, an amorphous carbon antifuse material layer disposed over the thin adhesion promoting layer, an upper thin adhesion promoting layer disposed over said antifuse material layer, and an upper metal electrode. The thin adhesion promoting layers are about 2 angstroms to 20 angstroms in thickness, and are from a material selected from the group comprising SixCy and SixNy. The ratio of x to y in SixCy is in a range of about 1+/?0.4, and the ratio of x to y in SixNy is in a range of about 0.75+/?0.225.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: April 15, 2008
    Assignee: Actel Corporation
    Inventors: Frank W. Hawley, A. Farid Issaq, John L. McCollum, Shubhra M. Gangopadhyay, Jorge A. Lubguban, Jin Miao Shen
  • Patent number: 6965156
    Abstract: A metal-to-metal antifuse having a lower metal electrode, a lower thin adhesion promoting layer disposed over the lower metal electrode, an amorphous carbon antifuse material layer disposed over the thin adhesion promoting layer, an upper thin adhesion promoting layer disposed over said antifuse material layer, and an upper metal electrode. The thin adhesion promoting layers are about 2 angstroms to 20 angstroms in thickness, and are from a material selected from the group comprising SixCy and SixNy. The ratio of x to y in SixCy is in a range of about 1+/?0.4, and the ratio of x to y in SixNy is in a range of about 0.75+/?0.225.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: November 15, 2005
    Assignees: Actel Corporation, Texas Tech University System
    Inventors: Frank W. Hawley, A. Farid Issaq, John L. McCollum, Shubhra M. Gangopadhyay, Jorge A. Lubguban, Jin Miao Shen