Abstract: The present invention discloses a welding method of a demetallized ceramic substrate having a surface capillary microgroove structure. The demetallized ceramic substrate includes a ceramic substrate main body and surface capillary microstructures. The surface capillary microstructures are arranged on two lateral sides of the ceramic substrate main body and the surface capillary microstructures specifically are capillary microgrooves. The welding method includes the following steps: fixing a chip to an upper surface of the demetallized ceramic substrate having the surface capillary microgroove structure, fixing the ceramic substrate with the chip to a printed circuit board having a bonding pad, and placing melted solder on the bonding pad, and driving the solder to ascend to an electrode of the chip from the bonding pad in a lower layer by means of a capillary force, thereby realizing an electrical connection between the chip and the printed circuit board.

Abstract: Disclosed are a device and a method for pressure-molding an anti-overheating CSP fluorescent membrane. The device comprises a frame, a mould pressing device, a force measuring device, a control device and a feeding device; and the mould pressing device comprises an upper pressing mould, an upper clamp, a lower pressing mould, a guide post, an elastic supporting structure, and a lower clamp. As the stage of pressing the elastic supporting structure is added to the course of pressure molding, a mould clamping force of the pressure molding increases in a relatively steady way, and a force impact of a mould clamping device is reduced, thereby easily determining an initial point for maintain temperature of the pressure molding.

Abstract: Disclosed are a device and a method for pressure-molding an anti-overheating CSP fluorescent membrane. The device comprises a frame, a mould pressing device, a force measuring device, a control device and a feeding device; and the mould pressing device comprises an upper pressing mould, an upper clamp, a lower pressing mould, a guide post, an elastic supporting structure, and a lower clamp. As the stage of pressing the elastic supporting structure is added to the course of pressure molding, a mould clamping force of the pressure molding increases in a relatively steady way, and a force impact of a mould clamping device is reduced, thereby easily determining an initial point for maintain temperature of the pressure molding.

Abstract: A novel class of inhibitors of protein kinases that are useful in the treatment of cell proliferative diseases and conditions, and especially those characterised by over-expression of CDK4, CDK6 and/or cyclin D, including certain cancers of lung, breast, brain, central nervous system, colorectal cancer and leukaemias.