Patents by Inventor Shuen-Liang Tseng
Shuen-Liang Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12020917Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the operations of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.Type: GrantFiled: March 31, 2022Date of Patent: June 25, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Jie He, Shawn Yang, Szu-Hsien Lo, Shuen-Liang Tseng, Wen-Cheng Cheng, Chen-Fang Chung, Chia-Lin Hsueh, Kuo-Pin Chuang
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Patent number: 11390520Abstract: In an embodiment, a system includes: a chamber; and a magnetic assembly contained within the chamber. The magnetic assembly comprises: an inner magnetic portion comprising first magnets; and an outer magnetic portion comprising second magnets. At least two adjacent magnets, of either the first magnets or the second magnets, have different vertical displacements, and the magnetic assembly is configured to rotate around an axis to generate an electromagnetic field that moves ions toward a target region within the chamber.Type: GrantFiled: May 25, 2018Date of Patent: July 19, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Tsez-Chong Tsai, Shuen-Liang Tseng, Szu-Hsien Lo, Po-Wen Yang, Ming-Jie He
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Publication number: 20220223391Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the operations of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.Type: ApplicationFiled: March 31, 2022Publication date: July 14, 2022Inventors: Ming-Jie HE, Shawn YANG, Szu-Hsien LO, Shuen-Liang TSENG, Wen-Cheng CHENG, Chen-Fang CHUNG, Chia-Lin HSUEH, Kuo-Pin CHUANG
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Patent number: 11322338Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.Type: GrantFiled: March 29, 2018Date of Patent: May 3, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Jie He, Shawn Yang, Szu-Hsien Lo, Shuen-Liang Tseng, Wen-Cheng Cheng, Chen-Fang Chung, Chia-Lin Hsueh, Kuo-Pin Chuang
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Publication number: 20190066988Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.Type: ApplicationFiled: March 29, 2018Publication date: February 28, 2019Inventors: Ming-Jie HE, Shawn YANG, Szu-Hsien LO, Shuen-Liang TSENG, Wen-Cheng CHENG, Chen-Fang CHUNG, Chia-Lin HSUEH, Kuo-Pin CHUANG
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Publication number: 20190035611Abstract: In an embodiment, a system includes: a chamber; and a magnetic assembly contained within the chamber. The magnetic assembly comprises: an inner magnetic portion comprising first magnets; and an outer magnetic portion comprising second magnets. At least two adjacent magnets, of either the first magnets or the second magnets, have different vertical displacements, and the magnetic assembly is configured to rotate around an axis to generate an electromagnetic field that moves ions toward a target region within the chamber.Type: ApplicationFiled: May 25, 2018Publication date: January 31, 2019Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Tsez-Chong Tsai, Shuen-Liang Tseng, Szu-Hsien Lo, Shawn Yang, Ming-Jie He
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Patent number: 9799497Abstract: Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing.Type: GrantFiled: August 16, 2013Date of Patent: October 24, 2017Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chen-Fang Chung, Chih-Tsang Tseng, Hsiao-Chuan Lee, Kuo-Pin Chuang, Shuen-Liang Tseng
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Publication number: 20150047563Abstract: Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing.Type: ApplicationFiled: August 16, 2013Publication date: February 19, 2015Applicant: Taiwan Semiconductor Manufacturing Company LimitedInventors: CHEN-FANG CHUNG, Chih-Tsang Tseng, Hsiao-Chuan Lee, KUO-PIN CHUANG, Shuen-Liang Tseng
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Publication number: 20080078326Abstract: Pre-cleaning tools and semiconductor processing apparatuses using the same are provided. An exemplary pre-cleaning tool comprises a support unit for supporting a substrate, a dome unit for substantially covering the support unit, a first RF unit connected to the support unit and a second RF unit connected to the dome unit. The dome unit is partially ceramic bead-blasted at an inner surface thereof.Type: ApplicationFiled: September 29, 2006Publication date: April 3, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuo-Liang Sung, Wen-Sheng Wu, Victor Chen, Shuen-Liang Tseng