Abstract: A shielding box for testing a transmission antenna and a reception antenna includes a first box, a second box, a third box, and an absorption material. The transmission antenna is positioned in the first box. The reception antenna is positioned in the third box. The absorption material is distributed over the inner surfaces of the first box, the second box, and the third box, respectively. The third box is connected through the second box to the first box. The second box provides a relatively narrow connection path for reducing the multipath interference between the transmission antenna and the reception antenna.

Abstract: A wireless communication module is disclosed. A circuit board includes a first sidewall, a second sidewall, and a third sidewall. The second sidewall is perpendicular to and connected between the first and third sidewalls. Multiple interlayer traces are formed in the circuit board. An antenna integrated circuit is disposed on the second sidewall of the circuit board and is connected to the interlayer traces. An antenna is formed on the first sidewall of the circuit board. One of the interlayer traces is connected between the antenna integrated circuit and the antenna. At least one external solder pad is formed on the third sidewall of the circuit board. Another one of the interlayer traces is connected between the antenna integrated circuit and the external solder pad.

Abstract: A wireless communication module is disclosed. A circuit board includes a first sidewall, a second sidewall, and a third sidewall. The second sidewall is perpendicular to and connected between the first and third sidewalls. Multiple interlayer traces are formed in the circuit board. An antenna integrated circuit is disposed on the second sidewall of the circuit board and is connected to the interlayer traces. An antenna is formed on the first sidewall of the circuit board. One of the interlayer traces is connected between the antenna integrated circuit and the antenna. At least one external solder pad is formed on the third sidewall of the circuit board. Another one of the interlayer traces is connected between the antenna integrated circuit and the external solder pad.

Abstract: An antenna module including a ground plate, a first radiating body and a second radiating body is provided. The first radiating body is disposed above the ground plate for receiving or transmitting a first signal emitted from at least an artificial satellite. The second radiating body is disposed between the ground plate and the first radiating body for receiving or transmitting a second signal emitted from various directions.

Abstract: An antenna module including a ground plate, a first radiating body and a second radiating body is provided. The first radiating body is disposed above the ground plate for receiving or transmitting a first signal emitted from at least an artificial satellite. The second radiating body is disposed between the ground plate and the first radiating body for receiving or transmitting a second signal emitted from various directions.