Patents by Inventor Shufun Ho

Shufun Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9514773
    Abstract: A head stack assembly (HSA) includes a flexible printed circuit (FPC) having a mouth with an upper mouth edge and a lower mouth edge. The FPC includes a first plurality of conductive terminals immediately adjacent the upper mouth edge and a second plurality of conductive terminals immediately adjacent the lower mouth edge. The mouth is bisected by a mouth centerline that is substantially parallel to and substantially equidistant from first and second actuator arms of the HSA. A head gimbal assembly (HGA) is attached to each of the first and second actuator arms. Each HGA includes a flexure tail laminate having a dielectric layer disposed between a plurality of conductive traces and a structural layer. The plurality of conductive traces is electrically connected to either the first or second plurality of conductive terminals via a plurality of openings in the structural layer and in the dielectric layer.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: December 6, 2016
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Tzong-Shii Pan, Shufun Ho
  • Patent number: 9324346
    Abstract: A novel head stack assembly (HSA) is disclosed and claimed. The HSA includes a flexible printed circuit (FPC) having a mouth with an upper mouth edge and a lower mouth edge. The FPC includes a first plurality of conductive terminals immediately adjacent the upper mouth edge and a second plurality of conductive terminals immediately adjacent the lower mouth edge. The mouth defines and is bisected by a mouth centerline disposed equidistant from the upper mouth edge and the lower mouth edge. The mouth centerline is substantially parallel to and substantially equidistant from first and second actuator arms of the HSA. A first plurality of conductive traces of a first head gimbal assembly (HGA) is electrically connected to the first plurality of conductive terminals, and a second plurality of conductive traces of a second HGA is electrically connected to the second plurality of conductive terminals.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: April 26, 2016
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Shufun Ho
  • Publication number: 20160086624
    Abstract: A head stack assembly (HSA) includes a flexible printed circuit (FPC) having a mouth with an upper mouth edge and a lower mouth edge. The FPC includes a first plurality of conductive terminals immediately adjacent the upper mouth edge and a second plurality of conductive terminals immediately adjacent the lower mouth edge. The mouth is bisected by a mouth centerline that is substantially parallel to and substantially equidistant from first and second actuator arms of the HSA. A head gimbal assembly (HGA) is attached to each of the first and second actuator arms. Each HGA includes a flexure tail laminate having a dielectric layer disposed between a plurality of conductive traces and a structural layer. The plurality of conductive traces is electrically connected to either the first or second plurality of conductive terminals via a plurality of openings in the structural layer and in the dielectric layer.
    Type: Application
    Filed: November 30, 2015
    Publication date: March 24, 2016
    Inventors: TZONG-SHII PAN, SHUFUN HO
  • Patent number: 8611052
    Abstract: Embodiments of the present invention relate to an alignment comb and a subassembly of a head stack assembly for a hard disk drive using the alignment comb. The subassembly includes a flexible printed circuit (FPC) having a plurality of first apertures, a flexure configured to be coupled to the FPC, the flexure having a second aperture configured to overlap a corresponding one of the first apertures, and an alignment comb including a plurality of fingers configured to align the FPC with the flexure, the plurality of fingers being spaced apart in a first direction and a finger of the plurality of fingers configured to extend into the corresponding one of the first apertures and the second aperture.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: December 17, 2013
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Shufun Ho
  • Patent number: 8259417
    Abstract: A disk drive head stack assembly has a flexible printed circuit (FPC) including a flex cable and a flex stiffener. The flex stiffener includes a terminal region support portion that is attached to the actuator body, a flex cable guide portion, and a stiffener bend. The stiffener bend is between and connects the terminal region support portion and the flex cable guide portion. The flex cable includes a guided portion that is in contact with the flex cable guide portion. A flex cable terminal region is attached to the terminal region support portion. The stiffener bend is about a stiffener bend axis that is perpendicular to the actuator pivot axis.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: September 4, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Shufun Ho, Yau-Shing Lee
  • Patent number: 8068314
    Abstract: A novel head stack assembly (HSA) is disclosed and claimed. The HSA includes an actuator including an actuator body and an actuator arm extending from the actuator body, and a flexible printed circuit (FPC) adjacent the actuator body. The FPC includes a slit therethrough. A head gimbal assembly (HGA) is attached to the actuator arm. The HGA includes a load beam, a laminated flexure attached to the load beam, and a head attached to the laminated flexure. The laminated flexure has a flexure tail that includes an intermediate region that is disposed adjacent the actuator arm, and a terminal region that is electrically connected to the FPC. The terminal region is substantially orthogonal to the intermediate region. The intermediate region of the flexure tail extends into the slit, interferes with the slit, and contacts and deforms the FPC adjacent the slit.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: November 29, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Shufun Ho, Gregory Tran, Fernando A. Magsombol
  • Patent number: 7339268
    Abstract: A semiconductor die mounted to a flex cable is provided. The flex cable comprises a heat sink layer and a flex cable substrate having conductive traces disposed thereon. The flex cable substrate includes an aperture aligned with the semiconductor die. A thermal conductor disposed within the aperture contacts both the semiconductor die and the heat sink layer. The thermal conductor can comprise, for example, a set of solder balls.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: March 4, 2008
    Assignee: Western Digital Technologies, Inc.
    Inventors: Shufun Ho, Alex Y. Tsay, Ali Hosseinzadeh, Dennis W. Hogg, Chee Shu Tay
  • Patent number: 6970329
    Abstract: A disk drive includes a disk drive base, a spindle motor attached to the disk drive base, a disk supported by the spindle motor, and a head stack assembly coupled to the disk drive base. The head stack assembly includes an actuator body, a coil portion cantilevered from the actuator body, an actuator arm cantilevered from the actuator body in an opposite direction from the actuator arm, a flex circuit cable having an electrical connector end, and a flex bracket for clamping the electrical connector end of the flex circuit cable to the disk drive base, the flex bracket having first and second ends being spaced-apart along a width of the disk drive.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: November 29, 2005
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kamran Oveyssi, Shufun Ho