Patents by Inventor Shuhei FUKAYA

Shuhei FUKAYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible wiring board and use thereof
    Patent number: 10208159
    Abstract: Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: February 19, 2019
    Assignee: NORITAKE CO., LIMITED
    Inventors: Shuhei Fukaya, Hirohito Kakizoe, Tatsuya Baba, Terusada Sugiura, Yasushi Yoshino
  • Thermosetting conductive paste
    Patent number: 9676947
    Abstract: Provided is a heat curable conductive paste used to form a conductive coating. The heat curable conductive paste comprises a conductive powder, a heat curable epoxy resin and a curing agent. In the conductive powder, an aliphatic polyvalent carboxylic acid is adhered on a surface of a powdered metal core. The epoxy resin comprises a bifunctional or higher polyfunctional epoxy resin and a monofunctional epoxy resin, and the polyfunctional epoxy resin and the monofunctional epoxy resin have a mass ratio of 90:10 to 20:80.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: June 13, 2017
    Assignee: NORITAKE CO., LIMITED
    Inventors: Shuhei Fukaya, Shigeru Sakamoto, Tatsuya Baba
  • FLEXIBLE WIRING BOARD AND USE THEREOF
    Publication number: 20160295686
    Abstract: Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).
    Type: Application
    Filed: March 22, 2016
    Publication date: October 6, 2016
    Applicant: NORITAKE CO., LIMITED
    Inventors: Shuhei FUKAYA, Hirohito KAKIZOE, Tatsuya BABA, Terusada SUGIURA, Yasushi YOSHINO
  • THERMOSETTING CONDUCTIVE PASTE
    Publication number: 20150175817
    Abstract: Provided is a heat curable conductive paste used to form a conductive coating. The heat curable conductive paste comprises a conductive powder, a heat curable epoxy resin and a curing agent. In the conductive powder, an aliphatic polyvalent carboxylic acid is adhered on a surface of a powdered metal core. The epoxy resin comprises a bifunctional or higher polyfunctional epoxy resin and a monofunctional epoxy resin, and the polyfunctional epoxy resin and the monofunctional epoxy resin have a mass ratio of 90:10 to 20:80.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 25, 2015
    Inventors: Shuhei FUKAYA, Shigeru SAKAMOTO, Tatsuya BABA